JPS6244421B2 - - Google Patents

Info

Publication number
JPS6244421B2
JPS6244421B2 JP21162782A JP21162782A JPS6244421B2 JP S6244421 B2 JPS6244421 B2 JP S6244421B2 JP 21162782 A JP21162782 A JP 21162782A JP 21162782 A JP21162782 A JP 21162782A JP S6244421 B2 JPS6244421 B2 JP S6244421B2
Authority
JP
Japan
Prior art keywords
lead
frame
lead frame
collector
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP21162782A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59100558A (ja
Inventor
Masaaki Shimotomai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP21162782A priority Critical patent/JPS59100558A/ja
Publication of JPS59100558A publication Critical patent/JPS59100558A/ja
Publication of JPS6244421B2 publication Critical patent/JPS6244421B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP21162782A 1982-11-30 1982-11-30 半導体装置用リ−ドフレ−ム Granted JPS59100558A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21162782A JPS59100558A (ja) 1982-11-30 1982-11-30 半導体装置用リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21162782A JPS59100558A (ja) 1982-11-30 1982-11-30 半導体装置用リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS59100558A JPS59100558A (ja) 1984-06-09
JPS6244421B2 true JPS6244421B2 (enrdf_load_stackoverflow) 1987-09-21

Family

ID=16608900

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21162782A Granted JPS59100558A (ja) 1982-11-30 1982-11-30 半導体装置用リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS59100558A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4523138B2 (ja) 2000-10-06 2010-08-11 ローム株式会社 半導体装置およびそれに用いるリードフレーム

Also Published As

Publication number Publication date
JPS59100558A (ja) 1984-06-09

Similar Documents

Publication Publication Date Title
JPH0717255Y2 (ja) モータのブラシ装置
KR980006174A (ko) 버틈 리드 패키지
JPS6244421B2 (enrdf_load_stackoverflow)
JPH05291467A (ja) リードフレームおよび半導体装置
US5925927A (en) Reinforced thin lead frames and leads
JP2679848B2 (ja) 半導体装置
JPH11340396A (ja) 電子部品製造用フープ状リードフレームの構造
JPS6223094Y2 (enrdf_load_stackoverflow)
JPS6233344Y2 (enrdf_load_stackoverflow)
JPS60137048A (ja) 半導体装置用リ−ドフレ−ム
JPS5812736B2 (ja) ジユシフウシガタハンドウタイソウチ
JPS607747A (ja) 樹脂封止型半導体装置
JP2823334B2 (ja) 半導体装置
JP2000260908A (ja) 表面実装型半導体装置およびその製造方法
JPS635252Y2 (enrdf_load_stackoverflow)
JPH0272556U (enrdf_load_stackoverflow)
CN118782571A (zh) 具有对准特征部的夹片及相关方法
JP2562267Y2 (ja) 電動機
JPH02132848A (ja) 半導体装置
JPH0729721Y2 (ja) リード線保持装置
KR200142844Y1 (ko) 리드프레임
JPS5826488Y2 (ja) ボビン装置
JPH05326800A (ja) リードフレーム
JPH0878590A (ja) リードフレーム
JPS5881957U (ja) リ−ドフレ−ム