JPS59100558A - 半導体装置用リ−ドフレ−ム - Google Patents

半導体装置用リ−ドフレ−ム

Info

Publication number
JPS59100558A
JPS59100558A JP21162782A JP21162782A JPS59100558A JP S59100558 A JPS59100558 A JP S59100558A JP 21162782 A JP21162782 A JP 21162782A JP 21162782 A JP21162782 A JP 21162782A JP S59100558 A JPS59100558 A JP S59100558A
Authority
JP
Japan
Prior art keywords
lead
lead frame
collector
frame
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21162782A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6244421B2 (enrdf_load_stackoverflow
Inventor
Masaaki Shimotomai
下斗米　将昭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP21162782A priority Critical patent/JPS59100558A/ja
Publication of JPS59100558A publication Critical patent/JPS59100558A/ja
Publication of JPS6244421B2 publication Critical patent/JPS6244421B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
JP21162782A 1982-11-30 1982-11-30 半導体装置用リ−ドフレ−ム Granted JPS59100558A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21162782A JPS59100558A (ja) 1982-11-30 1982-11-30 半導体装置用リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21162782A JPS59100558A (ja) 1982-11-30 1982-11-30 半導体装置用リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS59100558A true JPS59100558A (ja) 1984-06-09
JPS6244421B2 JPS6244421B2 (enrdf_load_stackoverflow) 1987-09-21

Family

ID=16608900

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21162782A Granted JPS59100558A (ja) 1982-11-30 1982-11-30 半導体装置用リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS59100558A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6710431B2 (en) * 2000-10-06 2004-03-23 Rohm Co., Ltd. Semiconductor device and lead frame used therefor

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6710431B2 (en) * 2000-10-06 2004-03-23 Rohm Co., Ltd. Semiconductor device and lead frame used therefor
US7705444B2 (en) * 2000-10-06 2010-04-27 Rohm Co., Ltd. Semiconductor device with lead frame having lead terminals with wide portions of trapezoidal cross section
US8026591B2 (en) 2000-10-06 2011-09-27 Rohm Co., Ltd. Semiconductor device with lead terminals having portions thereof extending obliquely
US8421209B2 (en) 2000-10-06 2013-04-16 Rohm Co., Ltd. Semiconductor device with lead terminals having portions thereof extending obliquely
US8637976B2 (en) 2000-10-06 2014-01-28 Rohm Co., Ltd. Semiconductor device with lead terminals having portions thereof extending obliquely
US9064855B2 (en) 2000-10-06 2015-06-23 Rohm Co., Ltd. Semiconductor device with lead terminals having portions thereof extending obliquely
US9472492B2 (en) 2000-10-06 2016-10-18 Rohm Co., Ltd. Semiconductor device with lead terminals having portions thereof extending obliquely
US9812382B2 (en) 2000-10-06 2017-11-07 Rohm Co., Ltd. Semiconductor device with lead terminals having portions thereof extending obliquely
US10388595B2 (en) 2000-10-06 2019-08-20 Rohm Co., Ltd. Semiconductor device with lead terminals having portions thereof extending obliquely
US20190348348A1 (en) * 2000-10-06 2019-11-14 Rohm Co., Ltd. Semiconductor device with lead terminals having portions thereof extending obliquely
US10886204B2 (en) 2000-10-06 2021-01-05 Rohm Co., Ltd. Semiconductor device with lead terminals having portions thereof extending obliquely

Also Published As

Publication number Publication date
JPS6244421B2 (enrdf_load_stackoverflow) 1987-09-21

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