JPS6244420B2 - - Google Patents

Info

Publication number
JPS6244420B2
JPS6244420B2 JP57090712A JP9071282A JPS6244420B2 JP S6244420 B2 JPS6244420 B2 JP S6244420B2 JP 57090712 A JP57090712 A JP 57090712A JP 9071282 A JP9071282 A JP 9071282A JP S6244420 B2 JPS6244420 B2 JP S6244420B2
Authority
JP
Japan
Prior art keywords
silver
copper
lead part
lead
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57090712A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58207661A (ja
Inventor
Satoshi Suzuki
Shoji Shiga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP57090712A priority Critical patent/JPS58207661A/ja
Publication of JPS58207661A publication Critical patent/JPS58207661A/ja
Publication of JPS6244420B2 publication Critical patent/JPS6244420B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/04—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP57090712A 1982-05-28 1982-05-28 半導体リ−ド部の処理方法 Granted JPS58207661A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57090712A JPS58207661A (ja) 1982-05-28 1982-05-28 半導体リ−ド部の処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57090712A JPS58207661A (ja) 1982-05-28 1982-05-28 半導体リ−ド部の処理方法

Publications (2)

Publication Number Publication Date
JPS58207661A JPS58207661A (ja) 1983-12-03
JPS6244420B2 true JPS6244420B2 (Direct) 1987-09-21

Family

ID=14006140

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57090712A Granted JPS58207661A (ja) 1982-05-28 1982-05-28 半導体リ−ド部の処理方法

Country Status (1)

Country Link
JP (1) JPS58207661A (Direct)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62163353A (ja) * 1986-01-14 1987-07-20 Hitachi Cable Ltd 銅酸化皮膜のピ−リング防止力の強いリ−ドフレ−ム

Also Published As

Publication number Publication date
JPS58207661A (ja) 1983-12-03

Similar Documents

Publication Publication Date Title
JPS59145553A (ja) 複合構造体及びその形成方法
JPH10287994A (ja) ボンディング部のメッキ構造
JPS6244420B2 (Direct)
JP3402228B2 (ja) 鉛を含まない錫ベース半田皮膜を有する半導体装置
JPS60258492A (ja) 錫メツキ線の製造方法
JPH0621625A (ja) 印刷配線板及びその製造方法
JPS63249361A (ja) 半導体リ−ドフレ−ム
JPH0122685B2 (Direct)
JP4014739B2 (ja) リフローＳｎめっき材及び前記リフローＳｎめっき材を用いた端子、コネクタ、又はリード部材
JPS5882406A (ja) 銀又は銀合金被覆ダイオ−ドリ−ド線とその製造方法
JPH09291375A (ja) 鉄基材に被膜を備えた物品
JPH046101B2 (Direct)
JP2749773B2 (ja) リフロー半田めっき角線及びその製造方法
JPS6138187Y2 (Direct)
JPH0373962B2 (Direct)
JPH01104796A (ja) 多元合金被膜の形成方法
JPS63168043A (ja) リ−ドフレ−ム
JPH0689478B2 (ja) 樹脂封止半導体装置の製造方法
JPH02301546A (ja) 耐熱性に優れた電子・電機部品用ＳｎまたはＳｎ合金被覆材料
JPS621898A (ja) プリント基板用鋼材およびその製造方法
JPS58108761A (ja) 電子部品
JPH07192529A (ja) 耐メッキ性導電性被膜形成用厚膜銅組成物
JPH0238594A (ja) リード線の製造方法
KR800001622B1 (ko) 리이드 프레임용 금속 스트립
JPS6153434B2 (Direct)