JPS58207661A - 半導体リ−ド部の処理方法 - Google Patents

半導体リ−ド部の処理方法

Info

Publication number
JPS58207661A
JPS58207661A JP57090712A JP9071282A JPS58207661A JP S58207661 A JPS58207661 A JP S58207661A JP 57090712 A JP57090712 A JP 57090712A JP 9071282 A JP9071282 A JP 9071282A JP S58207661 A JPS58207661 A JP S58207661A
Authority
JP
Japan
Prior art keywords
silver
copper
lead
replaced
lead portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57090712A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6244420B2 (Direct
Inventor
Satoshi Suzuki
智 鈴木
Shoji Shiga
志賀　章二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP57090712A priority Critical patent/JPS58207661A/ja
Publication of JPS58207661A publication Critical patent/JPS58207661A/ja
Publication of JPS6244420B2 publication Critical patent/JPS6244420B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/04—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP57090712A 1982-05-28 1982-05-28 半導体リ−ド部の処理方法 Granted JPS58207661A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57090712A JPS58207661A (ja) 1982-05-28 1982-05-28 半導体リ−ド部の処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57090712A JPS58207661A (ja) 1982-05-28 1982-05-28 半導体リ−ド部の処理方法

Publications (2)

Publication Number Publication Date
JPS58207661A true JPS58207661A (ja) 1983-12-03
JPS6244420B2 JPS6244420B2 (Direct) 1987-09-21

Family

ID=14006140

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57090712A Granted JPS58207661A (ja) 1982-05-28 1982-05-28 半導体リ−ド部の処理方法

Country Status (1)

Country Link
JP (1) JPS58207661A (Direct)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62163353A (ja) * 1986-01-14 1987-07-20 Hitachi Cable Ltd 銅酸化皮膜のピ−リング防止力の強いリ−ドフレ−ム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62163353A (ja) * 1986-01-14 1987-07-20 Hitachi Cable Ltd 銅酸化皮膜のピ−リング防止力の強いリ−ドフレ−ム

Also Published As

Publication number Publication date
JPS6244420B2 (Direct) 1987-09-21

Similar Documents

Publication Publication Date Title
JPS59145553A (ja) 複合構造体及びその形成方法
US6200451B1 (en) Method for enhancing the solderability of a surface
US4756467A (en) Solderable elements and method for forming same
JPH10287994A (ja) ボンディング部のメッキ構造
JP3303594B2 (ja) 耐熱銀被覆複合体とその製造方法
JPH04337657A (ja) 半導体装置用リードフレーム
US20010016232A1 (en) Method for enhancing the solderability of a surface
JPS58207661A (ja) 半導体リ−ド部の処理方法
JP3402228B2 (ja) 鉛を含まない錫ベース半田皮膜を有する半導体装置
JPH048883B2 (Direct)
TW202233899A (zh) 具備Ni電鍍皮膜之鍍敷結構體及含有該鍍敷結構體之引線框
JPH0373962B2 (Direct)
EP1029944A2 (en) Method for enhancing the solderability of a surface
JPS5882406A (ja) 銀又は銀合金被覆ダイオ−ドリ−ド線とその製造方法
JP4014739B2 (ja) リフローＳｎめっき材及び前記リフローＳｎめっき材を用いた端子、コネクタ、又はリード部材
JPH09291375A (ja) 鉄基材に被膜を備えた物品
JPH0122685B2 (Direct)
JPS6138187Y2 (Direct)
JPS63168043A (ja) リ−ドフレ−ム
JPS6142941A (ja) 半導体用リ−ドフレ−ム
JPS58108761A (ja) 電子部品
JPS6153434B2 (Direct)
JPH046101B2 (Direct)
JPH01104796A (ja) 多元合金被膜の形成方法
JPS59228311A (ja) Ａｇ被覆電気材料とその製造方法