JPS6244409B2 - - Google Patents

Info

Publication number
JPS6244409B2
JPS6244409B2 JP58001507A JP150783A JPS6244409B2 JP S6244409 B2 JPS6244409 B2 JP S6244409B2 JP 58001507 A JP58001507 A JP 58001507A JP 150783 A JP150783 A JP 150783A JP S6244409 B2 JPS6244409 B2 JP S6244409B2
Authority
JP
Japan
Prior art keywords
adhesive tape
pellets
wafer
pellet
ultraviolet rays
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58001507A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59126648A (ja
Inventor
Koichi Tanigawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
Original Assignee
NEC Home Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd filed Critical NEC Home Electronics Ltd
Priority to JP58001507A priority Critical patent/JPS59126648A/ja
Publication of JPS59126648A publication Critical patent/JPS59126648A/ja
Publication of JPS6244409B2 publication Critical patent/JPS6244409B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H10P72/7414—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support the auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/743—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used as a support during manufacture of interconnect decals or build up layers

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP58001507A 1983-01-07 1983-01-07 ペレツト剥離方法 Granted JPS59126648A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58001507A JPS59126648A (ja) 1983-01-07 1983-01-07 ペレツト剥離方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58001507A JPS59126648A (ja) 1983-01-07 1983-01-07 ペレツト剥離方法

Publications (2)

Publication Number Publication Date
JPS59126648A JPS59126648A (ja) 1984-07-21
JPS6244409B2 true JPS6244409B2 (enExample) 1987-09-21

Family

ID=11503388

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58001507A Granted JPS59126648A (ja) 1983-01-07 1983-01-07 ペレツト剥離方法

Country Status (1)

Country Link
JP (1) JPS59126648A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01185981A (ja) * 1988-01-21 1989-07-25 Fuji Electric Co Ltd 極低温容器

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0616527B2 (ja) * 1983-07-29 1994-03-02 関西日本電気株式会社 半導体ウエ−ハダイシング用接着シ−ト
JPH0616528B2 (ja) * 1986-02-17 1994-03-02 ウシオ電機株式会社 粘着シ−ト処理装置
JPS62189111A (ja) * 1986-02-17 1987-08-18 ウシオ電機株式会社 粘着シ−ト処理装置
JPH0616529B2 (ja) * 1986-02-17 1994-03-02 ウシオ電機株式会社 粘着シ−ト処理装置
JPS6392038A (ja) * 1986-10-06 1988-04-22 Matsushita Electric Ind Co Ltd チツプ供給方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01185981A (ja) * 1988-01-21 1989-07-25 Fuji Electric Co Ltd 極低温容器

Also Published As

Publication number Publication date
JPS59126648A (ja) 1984-07-21

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