JPH0447960Y2 - - Google Patents

Info

Publication number
JPH0447960Y2
JPH0447960Y2 JP1986027429U JP2742986U JPH0447960Y2 JP H0447960 Y2 JPH0447960 Y2 JP H0447960Y2 JP 1986027429 U JP1986027429 U JP 1986027429U JP 2742986 U JP2742986 U JP 2742986U JP H0447960 Y2 JPH0447960 Y2 JP H0447960Y2
Authority
JP
Japan
Prior art keywords
tape
wafer
dicing
chips
cut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1986027429U
Other languages
English (en)
Japanese (ja)
Other versions
JPS62140736U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986027429U priority Critical patent/JPH0447960Y2/ja
Publication of JPS62140736U publication Critical patent/JPS62140736U/ja
Application granted granted Critical
Publication of JPH0447960Y2 publication Critical patent/JPH0447960Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Adhesive Tapes (AREA)
JP1986027429U 1986-02-28 1986-02-28 Expired JPH0447960Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986027429U JPH0447960Y2 (enExample) 1986-02-28 1986-02-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986027429U JPH0447960Y2 (enExample) 1986-02-28 1986-02-28

Publications (2)

Publication Number Publication Date
JPS62140736U JPS62140736U (enExample) 1987-09-05
JPH0447960Y2 true JPH0447960Y2 (enExample) 1992-11-12

Family

ID=30829449

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986027429U Expired JPH0447960Y2 (enExample) 1986-02-28 1986-02-28

Country Status (1)

Country Link
JP (1) JPH0447960Y2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5716371B2 (ja) * 2010-12-03 2015-05-13 住友ベークライト株式会社 半導体用フィルムおよび半導体装置の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5116329Y2 (enExample) * 1972-07-24 1976-04-30

Also Published As

Publication number Publication date
JPS62140736U (enExample) 1987-09-05

Similar Documents

Publication Publication Date Title
US7284941B2 (en) Method and apparatus for picking up a semiconductor chip, method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape
JP3197788B2 (ja) 半導体装置の製造方法
JP2003303921A (ja) 半導体装置の製造方法
WO2004030053A1 (ja) 薄型半導体チップの製造方法
US20070202665A1 (en) Deposition pattern for eliminating backside metal peeling during die separation in semiconductor device fabrication
JPH0447960Y2 (enExample)
JPH02265258A (ja) ダイシング装置
JPH0574934A (ja) 薄型チツプの形成方法
CN107039481B (zh) 半导体结构的制造方法
JP3064979B2 (ja) 半導体ウェハのダイシング方法
JPH03239346A (ja) 半導体装置の製造方法
JPH04367250A (ja) 半導体チップの製造方法
JP2003068832A (ja) ダイシングテープおよびその使用方法
JPS6244409B2 (enExample)
JPH05206267A (ja) 半導体装置の製造方法
JP2890851B2 (ja) 半導体装置の製造方法
JP2003086540A (ja) 半導体装置の製造方法及びその製造装置
JPH03241856A (ja) ダイシング方法
JPH04336448A (ja) 半導体装置の製造方法
JPH07249674A (ja) 半導体装置の製造方法及び製造装置
JPH0621219A (ja) 半導体装置の製造方法
JPH03187242A (ja) 半導体装置の製造方法
JPH0383320A (ja) 接着半導体基板及びその製造方法
JP2532142B2 (ja) 半導体装置の製造方法
JPS6048104B2 (ja) 半導体ウエハの分割方法