JPS6243539B2 - - Google Patents

Info

Publication number
JPS6243539B2
JPS6243539B2 JP55051154A JP5115480A JPS6243539B2 JP S6243539 B2 JPS6243539 B2 JP S6243539B2 JP 55051154 A JP55051154 A JP 55051154A JP 5115480 A JP5115480 A JP 5115480A JP S6243539 B2 JPS6243539 B2 JP S6243539B2
Authority
JP
Japan
Prior art keywords
chip
circuit board
insulating layer
conductor
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55051154A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56146264A (en
Inventor
Yoichiro Oonishi
Hayato Takasago
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP5115480A priority Critical patent/JPS56146264A/ja
Publication of JPS56146264A publication Critical patent/JPS56146264A/ja
Publication of JPS6243539B2 publication Critical patent/JPS6243539B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/635—
    • H10W70/655—

Landscapes

  • Wire Bonding (AREA)
JP5115480A 1980-04-14 1980-04-14 Carrier for equipment of chip Granted JPS56146264A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5115480A JPS56146264A (en) 1980-04-14 1980-04-14 Carrier for equipment of chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5115480A JPS56146264A (en) 1980-04-14 1980-04-14 Carrier for equipment of chip

Publications (2)

Publication Number Publication Date
JPS56146264A JPS56146264A (en) 1981-11-13
JPS6243539B2 true JPS6243539B2 (enExample) 1987-09-14

Family

ID=12878897

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5115480A Granted JPS56146264A (en) 1980-04-14 1980-04-14 Carrier for equipment of chip

Country Status (1)

Country Link
JP (1) JPS56146264A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0334444U (enExample) * 1989-08-11 1991-04-04

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3629348B2 (ja) * 1997-04-16 2005-03-16 新光電気工業株式会社 配線基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0334444U (enExample) * 1989-08-11 1991-04-04

Also Published As

Publication number Publication date
JPS56146264A (en) 1981-11-13

Similar Documents

Publication Publication Date Title
US5471090A (en) Electronic structures having a joining geometry providing reduced capacitive loading
US5515604A (en) Methods for making high-density/long-via laminated connectors
US5719749A (en) Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board
KR100395862B1 (ko) 플립 칩형 반도체 장치 및 플립 칩형 반도체 장치 제조 방법
JP2996510B2 (ja) 電子回路基板
US5374196A (en) High-density/long-via laminated connector
JPH06291216A (ja) 基板及びセラミックパッケージ
JPH1154927A (ja) 複合配線基板、フレキシブル基板、半導体装置、および複合配線基板の製造方法
US10912194B2 (en) Printed circuit board
JPH0897557A (ja) 多層薄膜配線基板
US6121678A (en) Wrap-around interconnect for fine pitch ball grid array
CN101101899B (zh) 积层板及其制造方法、具有该积层板的电子元件和装置
JP3016910B2 (ja) 半導体モジュール構造
JP2007266111A (ja) 半導体装置、それを用いた積層型半導体装置、ベース基板、および半導体装置の製造方法
US5790386A (en) High I/O density MLC flat pack electronic component
JPS6243539B2 (enExample)
JP7272527B2 (ja) プリント回路基板
US6965162B2 (en) Semiconductor chip mounting substrate and semiconductor device using it
JP2022046840A (ja) 回路基板および回路基板の製造方法
JPS5987896A (ja) 多層プリント基板
JPS6127667A (ja) 半導体装置
JPH0286159A (ja) 半導体装置
JPH09130000A (ja) 両面配線基板およびそれを用いた半導体装置
JPH02222598A (ja) 半導体装置モジュール
JP2536175B2 (ja) 多層配線構造体