JPS56146264A - Carrier for equipment of chip - Google Patents

Carrier for equipment of chip

Info

Publication number
JPS56146264A
JPS56146264A JP5115480A JP5115480A JPS56146264A JP S56146264 A JPS56146264 A JP S56146264A JP 5115480 A JP5115480 A JP 5115480A JP 5115480 A JP5115480 A JP 5115480A JP S56146264 A JPS56146264 A JP S56146264A
Authority
JP
Japan
Prior art keywords
chip
equipping
conductors
face
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5115480A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6243539B2 (enExample
Inventor
Yoichiro Onishi
Hayato Takasago
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP5115480A priority Critical patent/JPS56146264A/ja
Publication of JPS56146264A publication Critical patent/JPS56146264A/ja
Publication of JPS6243539B2 publication Critical patent/JPS6243539B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/635—
    • H10W70/655—

Landscapes

  • Wire Bonding (AREA)
JP5115480A 1980-04-14 1980-04-14 Carrier for equipment of chip Granted JPS56146264A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5115480A JPS56146264A (en) 1980-04-14 1980-04-14 Carrier for equipment of chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5115480A JPS56146264A (en) 1980-04-14 1980-04-14 Carrier for equipment of chip

Publications (2)

Publication Number Publication Date
JPS56146264A true JPS56146264A (en) 1981-11-13
JPS6243539B2 JPS6243539B2 (enExample) 1987-09-14

Family

ID=12878897

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5115480A Granted JPS56146264A (en) 1980-04-14 1980-04-14 Carrier for equipment of chip

Country Status (1)

Country Link
JP (1) JPS56146264A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998047326A1 (fr) * 1997-04-16 1998-10-22 Shinko Electric Industries Co., Ltd. Tableau de connexions a trous d'interconnexion

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0334444U (enExample) * 1989-08-11 1991-04-04

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998047326A1 (fr) * 1997-04-16 1998-10-22 Shinko Electric Industries Co., Ltd. Tableau de connexions a trous d'interconnexion
US6271483B1 (en) 1997-04-16 2001-08-07 Shinko Electric Industries Co., Ltd Wiring board having vias
EP0926931A4 (en) * 1997-04-16 2006-12-06 Shinko Electric Ind Co CONDUCTOR PLATE WITH CONTACT

Also Published As

Publication number Publication date
JPS6243539B2 (enExample) 1987-09-14

Similar Documents

Publication Publication Date Title
EP0187195B1 (en) Method of manufacturing a circuit module
EP0089248B1 (en) Dense mounting of semiconductor chip packages
GB1162184A (en) Improvements in and relating to Connections to Solid State Devices
EP0124847A3 (en) A flexible base plate for printed circuit board and a method for the preparation thereof
JPS5788795A (en) Mutual connecting system for electronic circuit
KR900004722B1 (en) Hybrid intergrated circuit
GB1366000A (en) Electrical circuit module
EP0039160A3 (en) Methods for bonding conductive bumps to electronic circuitry
JPS56146264A (en) Carrier for equipment of chip
CN108848608A (zh) 一种柔性电路板及其制作方法
JPS56121018A (en) Terminal treating method for multilayer liquid-crystal panel
JPS575356A (en) Hybrid integrated circuit device
JPH118471A (ja) 多層配線基板の製造方法、および、多層配線基板を用いた電子部品の実装方法
JPS5852864A (ja) 半導体集積回路装置
JPS5595338A (en) Integrated circuit
CN221381286U (zh) 一种软硬组合电池保护板
JPS6484788A (en) Printed wiring board
JPS56133857A (en) Manufacture of hybrid ic
JPS5996793A (ja) プリント基板の製造方法
JPS6464292A (en) Manufacture of printed board
JPS5671926A (en) Chip carrier
JPS60236278A (ja) 配線用板
CN116347758A (zh) 一种特殊导通结构的双面柔性线路板及制备工艺
JPS59181501A (ja) 多層チツプ抵抗器
JPS60100496A (ja) プリント配線板