JPS6243539B2 - - Google Patents
Info
- Publication number
- JPS6243539B2 JPS6243539B2 JP55051154A JP5115480A JPS6243539B2 JP S6243539 B2 JPS6243539 B2 JP S6243539B2 JP 55051154 A JP55051154 A JP 55051154A JP 5115480 A JP5115480 A JP 5115480A JP S6243539 B2 JPS6243539 B2 JP S6243539B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- circuit board
- insulating layer
- conductor
- carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5115480A JPS56146264A (en) | 1980-04-14 | 1980-04-14 | Carrier for equipment of chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5115480A JPS56146264A (en) | 1980-04-14 | 1980-04-14 | Carrier for equipment of chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56146264A JPS56146264A (en) | 1981-11-13 |
| JPS6243539B2 true JPS6243539B2 (cs) | 1987-09-14 |
Family
ID=12878897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5115480A Granted JPS56146264A (en) | 1980-04-14 | 1980-04-14 | Carrier for equipment of chip |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56146264A (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0334444U (cs) * | 1989-08-11 | 1991-04-04 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3629348B2 (ja) | 1997-04-16 | 2005-03-16 | 新光電気工業株式会社 | 配線基板 |
-
1980
- 1980-04-14 JP JP5115480A patent/JPS56146264A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0334444U (cs) * | 1989-08-11 | 1991-04-04 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56146264A (en) | 1981-11-13 |
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