JPS6240862B2 - - Google Patents
Info
- Publication number
- JPS6240862B2 JPS6240862B2 JP19691082A JP19691082A JPS6240862B2 JP S6240862 B2 JPS6240862 B2 JP S6240862B2 JP 19691082 A JP19691082 A JP 19691082A JP 19691082 A JP19691082 A JP 19691082A JP S6240862 B2 JPS6240862 B2 JP S6240862B2
- Authority
- JP
- Japan
- Prior art keywords
- etching
- thickness
- pattern
- corrosion
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005530 etching Methods 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 13
- 238000005260 corrosion Methods 0.000 claims description 12
- 230000007797 corrosion Effects 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000005507 spraying Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4828—Etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19691082A JPS5987845A (ja) | 1982-11-10 | 1982-11-10 | リ−ドフレ−ムの製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19691082A JPS5987845A (ja) | 1982-11-10 | 1982-11-10 | リ−ドフレ−ムの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5987845A JPS5987845A (ja) | 1984-05-21 |
JPS6240862B2 true JPS6240862B2 (US20020128544A1-20020912-P00008.png) | 1987-08-31 |
Family
ID=16365684
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19691082A Granted JPS5987845A (ja) | 1982-11-10 | 1982-11-10 | リ−ドフレ−ムの製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5987845A (US20020128544A1-20020912-P00008.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01107166U (US20020128544A1-20020912-P00008.png) * | 1988-01-08 | 1989-07-19 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4795694A (en) * | 1986-06-20 | 1989-01-03 | Siemens Aktiengesellschaft | Manufacture of fine structures for semiconductor contacting |
JP3018542B2 (ja) * | 1991-04-03 | 2000-03-13 | セイコーエプソン株式会社 | リードフレーム及びその製造方法 |
-
1982
- 1982-11-10 JP JP19691082A patent/JPS5987845A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01107166U (US20020128544A1-20020912-P00008.png) * | 1988-01-08 | 1989-07-19 |
Also Published As
Publication number | Publication date |
---|---|
JPS5987845A (ja) | 1984-05-21 |
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