JPS6239942B2 - - Google Patents

Info

Publication number
JPS6239942B2
JPS6239942B2 JP57038252A JP3825282A JPS6239942B2 JP S6239942 B2 JPS6239942 B2 JP S6239942B2 JP 57038252 A JP57038252 A JP 57038252A JP 3825282 A JP3825282 A JP 3825282A JP S6239942 B2 JPS6239942 B2 JP S6239942B2
Authority
JP
Japan
Prior art keywords
electron beam
sample
test
testing
gun
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57038252A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57196539A (en
Inventor
Kurisuchan Fuaifuaa Hansu
Aasaa Shinpuson Robaato
Suteitsukeru Uerunaa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS57196539A publication Critical patent/JPS57196539A/ja
Publication of JPS6239942B2 publication Critical patent/JPS6239942B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y15/00—Nanotechnology for interacting, sensing or actuating, e.g. quantum dots as markers in protein assays or molecular motors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/305—Contactless testing using electron beams

Landscapes

  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Molecular Biology (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
JP57038252A 1981-05-26 1982-03-12 Test device for electric characteristics Granted JPS57196539A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/267,119 US4417203A (en) 1981-05-26 1981-05-26 System for contactless electrical property testing of multi-layer ceramics

Publications (2)

Publication Number Publication Date
JPS57196539A JPS57196539A (en) 1982-12-02
JPS6239942B2 true JPS6239942B2 (US06521211-20030218-C00004.png) 1987-08-26

Family

ID=23017394

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57038252A Granted JPS57196539A (en) 1981-05-26 1982-03-12 Test device for electric characteristics

Country Status (4)

Country Link
US (1) US4417203A (US06521211-20030218-C00004.png)
EP (1) EP0066070B1 (US06521211-20030218-C00004.png)
JP (1) JPS57196539A (US06521211-20030218-C00004.png)
DE (1) DE3266126D1 (US06521211-20030218-C00004.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0524403Y2 (US06521211-20030218-C00004.png) * 1986-12-09 1993-06-22

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JPS5933996B2 (ja) * 1981-05-26 1984-08-20 インターナシヨナルビジネス マシーンズ コーポレーシヨン 未焼結セラミツクの検査装置
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DE3138929A1 (de) * 1981-09-30 1983-04-14 Siemens AG, 1000 Berlin und 8000 München Verbessertes sekundaerelektronen-spektrometer fuer die potentialmessung an einer probe mit einer elektronensonde
DE3235461A1 (de) * 1982-09-24 1984-03-29 Siemens AG, 1000 Berlin und 8000 München Verfahren zur kontaktlosen pruefung eines objekts, insbesondere von mikroverdrahtungen, mit einer korpuskularstrahl-sonde
US4712057A (en) * 1983-05-25 1987-12-08 Battelle Memorial Institute Method of examining and testing an electric device such as an integrated or printed circuit
JPS60136235A (ja) * 1983-12-23 1985-07-19 Nec Corp 電子ビ−ムテスタ
US4575630A (en) 1984-01-30 1986-03-11 Ibm Corporation Electron-beam testing of semiconductor wafers
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US4985681A (en) * 1985-01-18 1991-01-15 Siemens Aktiengesellschaft Particle beam measuring method for non-contact testing of interconnect networks
US4786864A (en) * 1985-03-29 1988-11-22 International Business Machines Corporation Photon assisted tunneling testing of passivated integrated circuits
US4644264A (en) * 1985-03-29 1987-02-17 International Business Machines Corporation Photon assisted tunneling testing of passivated integrated circuits
US5006795A (en) * 1985-06-24 1991-04-09 Nippon Telephone and Telegraph Public Corporation Charged beam radiation apparatus
JPH0682718B2 (ja) * 1985-08-12 1994-10-19 日本電信電話株式会社 電子デバイスの試験装置およびその使用方法
US4733174A (en) * 1986-03-10 1988-03-22 Textronix, Inc. Circuit testing method and apparatus
US4746815A (en) * 1986-07-03 1988-05-24 International Business Machines Corporation Electronic EC for minimizing EC pads
DE3683053D1 (de) * 1986-10-23 1992-01-30 Ibm Verfahren zur kontaktfreien pruefung von platinen fuer integrierte schaltungen unter atmosphaerischen bedingungen.
US4843330A (en) * 1986-10-30 1989-06-27 International Business Machines Corporation Electron beam contactless testing system with grid bias switching
US5091171B2 (en) * 1986-12-23 1997-07-15 Tristrata Inc Amphoteric compositions and polymeric forms of alpha hydroxyacids and their therapeutic use
US4841242A (en) * 1987-04-10 1989-06-20 Siemens Aktiengesellschaft Method for testing conductor networks
JPH065691B2 (ja) * 1987-09-26 1994-01-19 株式会社東芝 半導体素子の試験方法および試験装置
US4803422A (en) * 1987-12-28 1989-02-07 General Dynamics, Pomona Division Electrical monitoring of flip-chip hybridization
US4851767A (en) * 1988-01-15 1989-07-25 International Business Machines Corporation Detachable high-speed opto-electronic sampling probe
US5057773A (en) * 1989-03-21 1991-10-15 International Business Machines Corporation Method for opens/shorts testing of capacitively coupled networks in substrates using electron beams
US4943769A (en) * 1989-03-21 1990-07-24 International Business Machines Corporation Apparatus and method for opens/shorts testing of capacitively coupled networks in substrates using electron beams
EP0402499A1 (de) * 1989-06-13 1990-12-19 Siemens Aktiengesellschaft Verfahren zur Prüfung einer Leiterplatte mit einer Teilchensonde
JP3087899B2 (ja) * 1989-06-16 2000-09-11 株式会社日立製作所 厚膜薄膜混成多層配線基板の製造方法
US4970461A (en) * 1989-06-26 1990-11-13 Lepage Andrew J Method and apparatus for non-contact opens/shorts testing of electrical circuits
EP0490154A3 (en) * 1990-12-07 1992-09-30 Siemens Aktiengesellschaft Method for determining the charge of a sample region
US5258706A (en) * 1991-10-16 1993-11-02 Siemens Aktiengesellschaft Method for the recognition of testing errors in the test of microwirings
DE4305672A1 (de) * 1993-02-24 1994-08-25 Integrated Circuit Testing Verfahren und Vorrichtung zum Testen von Netzwerken auf Kurzschlüsse und/oder Unterbrechungen
US5587664A (en) * 1995-07-12 1996-12-24 Exsight Ltd. Laser-induced metallic plasma for non-contact inspection
US6172363B1 (en) * 1996-03-05 2001-01-09 Hitachi, Ltd. Method and apparatus for inspecting integrated circuit pattern
US5781017A (en) * 1996-04-26 1998-07-14 Sandia Corporation Capacitive charge generation apparatus and method for testing circuits
US5959459A (en) * 1996-12-10 1999-09-28 International Business Machines Corporation Defect monitor and method for automated contactless inline wafer inspection
KR100544222B1 (ko) * 1997-01-13 2006-04-28 어플라이드 머티어리얼스, 인코포레이티드 웨이퍼의 결함을 검출하는 방법 및 장치
US6504393B1 (en) 1997-07-15 2003-01-07 Applied Materials, Inc. Methods and apparatus for testing semiconductor and integrated circuit structures
JP3813336B2 (ja) * 1997-11-20 2006-08-23 株式会社ルネサステクノロジ 集積回路の故障箇所特定方法および故障箇所特定装置
JP3356056B2 (ja) * 1998-05-15 2002-12-09 日本電気株式会社 配線不良検出回路、配線不良検出用半導体ウェハ及びこれらを用いた配線不良検出方法
US6232787B1 (en) * 1999-01-08 2001-05-15 Schlumberger Technologies, Inc. Microstructure defect detection
US6252412B1 (en) 1999-01-08 2001-06-26 Schlumberger Technologies, Inc. Method of detecting defects in patterned substrates
US6344750B1 (en) * 1999-01-08 2002-02-05 Schlumberger Technologies, Inc. Voltage contrast method for semiconductor inspection using low voltage particle beam
US6294918B1 (en) * 1999-09-23 2001-09-25 Taiwan Semiconductor Manufacturing Company, Ltd Method for locating weak circuit having insufficient driving current in IC chips
JP3877952B2 (ja) * 1999-11-30 2007-02-07 ファブソリューション株式会社 デバイス検査装置および検査方法
US6683320B2 (en) * 2000-05-18 2004-01-27 Fei Company Through-the-lens neutralization for charged particle beam system
DE10052198A1 (de) * 2000-10-20 2002-05-02 Akt Electron Beam Technology G Verfahren und Vorrichtung zum Testen von mikroelektronischen Komponenten
EP1344018A1 (en) * 2000-12-22 2003-09-17 Fei Company Particle-optical inspection device especially for semiconductor wafers
US6914443B2 (en) * 2002-07-24 2005-07-05 Applied Materials Israel, Ltd. Apparatus and method for enhanced voltage contrast analysis
US7528614B2 (en) * 2004-12-22 2009-05-05 Applied Materials, Inc. Apparatus and method for voltage contrast analysis of a wafer using a tilted pre-charging beam
US6812462B1 (en) 2003-02-21 2004-11-02 Kla-Tencor Technologies Corporation Dual electron beam instrument for multi-perspective
US6917194B2 (en) * 2003-08-27 2005-07-12 International Business Machines Corporation External verification of package processed linewidths and spacings in semiconductor packages
US6906538B2 (en) * 2003-09-30 2005-06-14 Agere Systems, Inc. Alternating pulse dual-beam apparatus, methods and systems for voltage contrast behavior assessment of microcircuits
US8748815B2 (en) * 2006-08-31 2014-06-10 Hermes Microvision, Inc. Method and system for detecting or reviewing open contacts on a semiconductor device
JP2010027743A (ja) * 2008-07-16 2010-02-04 Ebara Corp インプリント用ガラス基板、レジストパターン形成方法、インプリント用ガラス基板の検査方法及び検査装置
US20140009184A1 (en) * 2012-07-06 2014-01-09 Chen-Chung Chang Semiconductor chip test apparatus and method
US11376152B2 (en) 2014-03-19 2022-07-05 Purewick Corporation Apparatus and methods for receiving discharged urine
US11090183B2 (en) 2014-11-25 2021-08-17 Purewick Corporation Container for collecting liquid for transport
US10952889B2 (en) 2016-06-02 2021-03-23 Purewick Corporation Using wicking material to collect liquid for transport
US11806266B2 (en) 2014-03-19 2023-11-07 Purewick Corporation Apparatus and methods for receiving discharged urine
US9666411B1 (en) 2014-11-14 2017-05-30 Kla-Tencor Corporation Virtual ground for target substrate using floodgun and feedback control
CN105004962B (zh) * 2015-03-24 2017-10-20 华北电力大学（保定） 一种改进的汽轮发电机励磁绕组短路故障的检测方法
US10973678B2 (en) 2016-07-27 2021-04-13 Purewick Corporation Apparatus and methods for receiving discharged urine
EP3787568B1 (en) 2018-05-01 2023-12-06 Purewick Corporation Fluid collection devices, related systems, and related methods
EP3787569A1 (en) 2018-05-01 2021-03-10 Purewick Corporation Fluid collection devices, systems, and methods
BR112020022196A2 (pt) 2018-05-01 2021-02-02 Purewick Corporation vestimentas de coleta de fluido
JP7231738B2 (ja) * 2018-12-31 2023-03-01 エーエスエムエル ネザーランズ ビー．ブイ． 複数ビームを用いたインレンズウェーハプリチャージ及び検査
USD929578S1 (en) 2019-06-06 2021-08-31 Purewick Corporation Urine collection assembly
USD967409S1 (en) 2020-07-15 2022-10-18 Purewick Corporation Urine collection apparatus cover
US11801186B2 (en) 2020-09-10 2023-10-31 Purewick Corporation Urine storage container handle and lid accessories
EP4110247B1 (en) 2021-01-19 2024-02-28 Purewick Corporation Variable fit fluid collection devices
CA3195841A1 (en) 2021-02-26 2022-09-01 Camille Rose Newton Fluid collection devices having a sump between a tube opening and a barrier, and related systems and methods
US11938054B2 (en) 2021-03-10 2024-03-26 Purewick Corporation Bodily waste and fluid collection with sacral pad
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JPS518314A (en) * 1974-07-11 1976-01-23 Sumitomo Shipbuild Machinery Sementokurinkaano seizohoho

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0524403Y2 (US06521211-20030218-C00004.png) * 1986-12-09 1993-06-22

Also Published As

Publication number Publication date
JPS57196539A (en) 1982-12-02
EP0066070B1 (en) 1985-09-11
DE3266126D1 (en) 1985-10-17
US4417203A (en) 1983-11-22
EP0066070A1 (en) 1982-12-08

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