JPS5933996B2
(ja)
*
|
1981-05-26 |
1984-08-20 |
インターナシヨナルビジネス マシーンズ コーポレーシヨン |
未焼結セラミツクの検査装置
|
US4621232A
(en)
*
|
1981-05-26 |
1986-11-04 |
International Business Machines Corporation |
Inspection of unsintered single layer or multilayer ceramics using a broad area electrical contacting structure
|
DE3138929A1
(de)
*
|
1981-09-30 |
1983-04-14 |
Siemens AG, 1000 Berlin und 8000 München |
Verbessertes sekundaerelektronen-spektrometer fuer die potentialmessung an einer probe mit einer elektronensonde
|
DE3235461A1
(de)
*
|
1982-09-24 |
1984-03-29 |
Siemens AG, 1000 Berlin und 8000 München |
Verfahren zur kontaktlosen pruefung eines objekts, insbesondere von mikroverdrahtungen, mit einer korpuskularstrahl-sonde
|
US4712057A
(en)
*
|
1983-05-25 |
1987-12-08 |
Battelle Memorial Institute |
Method of examining and testing an electric device such as an integrated or printed circuit
|
JPS60136235A
(ja)
*
|
1983-12-23 |
1985-07-19 |
Nec Corp |
電子ビ−ムテスタ
|
US4575630A
(en)
|
1984-01-30 |
1986-03-11 |
Ibm Corporation |
Electron-beam testing of semiconductor wafers
|
DE3579380D1
(de)
*
|
1984-06-01 |
1990-10-04 |
Siemens Ag |
Verfahren zur elektrischen pruefung von mikroverdrahtungen mit hilfe von korpuskularsonden.
|
US4985681A
(en)
*
|
1985-01-18 |
1991-01-15 |
Siemens Aktiengesellschaft |
Particle beam measuring method for non-contact testing of interconnect networks
|
US4786864A
(en)
*
|
1985-03-29 |
1988-11-22 |
International Business Machines Corporation |
Photon assisted tunneling testing of passivated integrated circuits
|
US4644264A
(en)
*
|
1985-03-29 |
1987-02-17 |
International Business Machines Corporation |
Photon assisted tunneling testing of passivated integrated circuits
|
US5006795A
(en)
*
|
1985-06-24 |
1991-04-09 |
Nippon Telephone and Telegraph Public Corporation |
Charged beam radiation apparatus
|
JPH0682718B2
(ja)
*
|
1985-08-12 |
1994-10-19 |
日本電信電話株式会社 |
電子デバイスの試験装置およびその使用方法
|
US4733174A
(en)
*
|
1986-03-10 |
1988-03-22 |
Textronix, Inc. |
Circuit testing method and apparatus
|
US4746815A
(en)
*
|
1986-07-03 |
1988-05-24 |
International Business Machines Corporation |
Electronic EC for minimizing EC pads
|
DE3683053D1
(de)
*
|
1986-10-23 |
1992-01-30 |
Ibm |
Verfahren zur kontaktfreien pruefung von platinen fuer integrierte schaltungen unter atmosphaerischen bedingungen.
|
US4843330A
(en)
*
|
1986-10-30 |
1989-06-27 |
International Business Machines Corporation |
Electron beam contactless testing system with grid bias switching
|
JPH0524403Y2
(de)
*
|
1986-12-09 |
1993-06-22 |
|
|
US5091171B2
(en)
*
|
1986-12-23 |
1997-07-15 |
Tristrata Inc |
Amphoteric compositions and polymeric forms of alpha hydroxyacids and their therapeutic use
|
US4841242A
(en)
*
|
1987-04-10 |
1989-06-20 |
Siemens Aktiengesellschaft |
Method for testing conductor networks
|
JPH065691B2
(ja)
*
|
1987-09-26 |
1994-01-19 |
株式会社東芝 |
半導体素子の試験方法および試験装置
|
US4803422A
(en)
*
|
1987-12-28 |
1989-02-07 |
General Dynamics, Pomona Division |
Electrical monitoring of flip-chip hybridization
|
US4851767A
(en)
*
|
1988-01-15 |
1989-07-25 |
International Business Machines Corporation |
Detachable high-speed opto-electronic sampling probe
|
US5057773A
(en)
*
|
1989-03-21 |
1991-10-15 |
International Business Machines Corporation |
Method for opens/shorts testing of capacitively coupled networks in substrates using electron beams
|
US4943769A
(en)
*
|
1989-03-21 |
1990-07-24 |
International Business Machines Corporation |
Apparatus and method for opens/shorts testing of capacitively coupled networks in substrates using electron beams
|
EP0402499A1
(de)
*
|
1989-06-13 |
1990-12-19 |
Siemens Aktiengesellschaft |
Verfahren zur Prüfung einer Leiterplatte mit einer Teilchensonde
|
JP3087899B2
(ja)
*
|
1989-06-16 |
2000-09-11 |
株式会社日立製作所 |
厚膜薄膜混成多層配線基板の製造方法
|
US4970461A
(en)
*
|
1989-06-26 |
1990-11-13 |
Lepage Andrew J |
Method and apparatus for non-contact opens/shorts testing of electrical circuits
|
EP0490154A3
(en)
*
|
1990-12-07 |
1992-09-30 |
Siemens Aktiengesellschaft |
Method for determining the charge of a sample region
|
US5258706A
(en)
*
|
1991-10-16 |
1993-11-02 |
Siemens Aktiengesellschaft |
Method for the recognition of testing errors in the test of microwirings
|
DE4305672A1
(de)
*
|
1993-02-24 |
1994-08-25 |
Integrated Circuit Testing |
Verfahren und Vorrichtung zum Testen von Netzwerken auf Kurzschlüsse und/oder Unterbrechungen
|
US5587664A
(en)
*
|
1995-07-12 |
1996-12-24 |
Exsight Ltd. |
Laser-induced metallic plasma for non-contact inspection
|
US6172363B1
(en)
*
|
1996-03-05 |
2001-01-09 |
Hitachi, Ltd. |
Method and apparatus for inspecting integrated circuit pattern
|
US5781017A
(en)
*
|
1996-04-26 |
1998-07-14 |
Sandia Corporation |
Capacitive charge generation apparatus and method for testing circuits
|
US5959459A
(en)
*
|
1996-12-10 |
1999-09-28 |
International Business Machines Corporation |
Defect monitor and method for automated contactless inline wafer inspection
|
KR100544222B1
(ko)
*
|
1997-01-13 |
2006-04-28 |
어플라이드 머티어리얼스, 인코포레이티드 |
웨이퍼의 결함을 검출하는 방법 및 장치
|
US6504393B1
(en)
|
1997-07-15 |
2003-01-07 |
Applied Materials, Inc. |
Methods and apparatus for testing semiconductor and integrated circuit structures
|
JP3813336B2
(ja)
*
|
1997-11-20 |
2006-08-23 |
株式会社ルネサステクノロジ |
集積回路の故障箇所特定方法および故障箇所特定装置
|
JP3356056B2
(ja)
*
|
1998-05-15 |
2002-12-09 |
日本電気株式会社 |
配線不良検出回路、配線不良検出用半導体ウェハ及びこれらを用いた配線不良検出方法
|
US6232787B1
(en)
*
|
1999-01-08 |
2001-05-15 |
Schlumberger Technologies, Inc. |
Microstructure defect detection
|
US6252412B1
(en)
|
1999-01-08 |
2001-06-26 |
Schlumberger Technologies, Inc. |
Method of detecting defects in patterned substrates
|
US6344750B1
(en)
*
|
1999-01-08 |
2002-02-05 |
Schlumberger Technologies, Inc. |
Voltage contrast method for semiconductor inspection using low voltage particle beam
|
US6294918B1
(en)
*
|
1999-09-23 |
2001-09-25 |
Taiwan Semiconductor Manufacturing Company, Ltd |
Method for locating weak circuit having insufficient driving current in IC chips
|
JP3877952B2
(ja)
*
|
1999-11-30 |
2007-02-07 |
ファブソリューション株式会社 |
デバイス検査装置および検査方法
|
US6683320B2
(en)
*
|
2000-05-18 |
2004-01-27 |
Fei Company |
Through-the-lens neutralization for charged particle beam system
|
DE10052198A1
(de)
*
|
2000-10-20 |
2002-05-02 |
Akt Electron Beam Technology G |
Verfahren und Vorrichtung zum Testen von mikroelektronischen Komponenten
|
EP1344018A1
(de)
*
|
2000-12-22 |
2003-09-17 |
Fei Company |
Partikel-optisches inspektionssystem, insbesondere für halbleiterwafer
|
US6914443B2
(en)
*
|
2002-07-24 |
2005-07-05 |
Applied Materials Israel, Ltd. |
Apparatus and method for enhanced voltage contrast analysis
|
US7528614B2
(en)
*
|
2004-12-22 |
2009-05-05 |
Applied Materials, Inc. |
Apparatus and method for voltage contrast analysis of a wafer using a tilted pre-charging beam
|
US6812462B1
(en)
|
2003-02-21 |
2004-11-02 |
Kla-Tencor Technologies Corporation |
Dual electron beam instrument for multi-perspective
|
US6917194B2
(en)
*
|
2003-08-27 |
2005-07-12 |
International Business Machines Corporation |
External verification of package processed linewidths and spacings in semiconductor packages
|
US6906538B2
(en)
*
|
2003-09-30 |
2005-06-14 |
Agere Systems, Inc. |
Alternating pulse dual-beam apparatus, methods and systems for voltage contrast behavior assessment of microcircuits
|
US8748815B2
(en)
*
|
2006-08-31 |
2014-06-10 |
Hermes Microvision, Inc. |
Method and system for detecting or reviewing open contacts on a semiconductor device
|
JP2010027743A
(ja)
*
|
2008-07-16 |
2010-02-04 |
Ebara Corp |
インプリント用ガラス基板、レジストパターン形成方法、インプリント用ガラス基板の検査方法及び検査装置
|
US20140009184A1
(en)
*
|
2012-07-06 |
2014-01-09 |
Chen-Chung Chang |
Semiconductor chip test apparatus and method
|
US11376152B2
(en)
|
2014-03-19 |
2022-07-05 |
Purewick Corporation |
Apparatus and methods for receiving discharged urine
|
US11090183B2
(en)
|
2014-11-25 |
2021-08-17 |
Purewick Corporation |
Container for collecting liquid for transport
|
US10952889B2
(en)
|
2016-06-02 |
2021-03-23 |
Purewick Corporation |
Using wicking material to collect liquid for transport
|
US11806266B2
(en)
|
2014-03-19 |
2023-11-07 |
Purewick Corporation |
Apparatus and methods for receiving discharged urine
|
US9666411B1
(en)
|
2014-11-14 |
2017-05-30 |
Kla-Tencor Corporation |
Virtual ground for target substrate using floodgun and feedback control
|
CN105004962B
(zh)
*
|
2015-03-24 |
2017-10-20 |
华北电力大学(保定) |
一种改进的汽轮发电机励磁绕组短路故障的检测方法
|
US10973678B2
(en)
|
2016-07-27 |
2021-04-13 |
Purewick Corporation |
Apparatus and methods for receiving discharged urine
|
EP3787568B1
(de)
|
2018-05-01 |
2023-12-06 |
Purewick Corporation |
Flüssigkeitssammelvorrichtungen, zugehörige systeme und zugehörige verfahren
|
EP3787569A1
(de)
|
2018-05-01 |
2021-03-10 |
Purewick Corporation |
Flüssigkeitssammelvorrichtungen, systeme und -verfahren
|
BR112020022196A2
(pt)
|
2018-05-01 |
2021-02-02 |
Purewick Corporation |
vestimentas de coleta de fluido
|
JP7231738B2
(ja)
*
|
2018-12-31 |
2023-03-01 |
エーエスエムエル ネザーランズ ビー.ブイ. |
複数ビームを用いたインレンズウェーハプリチャージ及び検査
|
USD929578S1
(en)
|
2019-06-06 |
2021-08-31 |
Purewick Corporation |
Urine collection assembly
|
USD967409S1
(en)
|
2020-07-15 |
2022-10-18 |
Purewick Corporation |
Urine collection apparatus cover
|
US11801186B2
(en)
|
2020-09-10 |
2023-10-31 |
Purewick Corporation |
Urine storage container handle and lid accessories
|
EP4110247B1
(de)
|
2021-01-19 |
2024-02-28 |
Purewick Corporation |
Variabel passende fluid-sammelvorrichtungen
|
CA3195841A1
(en)
|
2021-02-26 |
2022-09-01 |
Camille Rose Newton |
Fluid collection devices having a sump between a tube opening and a barrier, and related systems and methods
|
US11938054B2
(en)
|
2021-03-10 |
2024-03-26 |
Purewick Corporation |
Bodily waste and fluid collection with sacral pad
|
WO2024008309A1
(en)
*
|
2022-07-08 |
2024-01-11 |
Applied Materials, Inc. |
Method for testing a packaging substrate, and apparatus for testing a packaging substrate
|