JPS6239825B2 - - Google Patents

Info

Publication number
JPS6239825B2
JPS6239825B2 JP56176799A JP17679981A JPS6239825B2 JP S6239825 B2 JPS6239825 B2 JP S6239825B2 JP 56176799 A JP56176799 A JP 56176799A JP 17679981 A JP17679981 A JP 17679981A JP S6239825 B2 JPS6239825 B2 JP S6239825B2
Authority
JP
Japan
Prior art keywords
semiconductor element
semiconductor
heat dissipation
external lead
ceramic substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56176799A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5878443A (ja
Inventor
Takashi Myamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP56176799A priority Critical patent/JPS5878443A/ja
Publication of JPS5878443A publication Critical patent/JPS5878443A/ja
Publication of JPS6239825B2 publication Critical patent/JPS6239825B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Laser Beam Processing (AREA)
JP56176799A 1981-11-04 1981-11-04 半導体装置の製造方法 Granted JPS5878443A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56176799A JPS5878443A (ja) 1981-11-04 1981-11-04 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56176799A JPS5878443A (ja) 1981-11-04 1981-11-04 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5878443A JPS5878443A (ja) 1983-05-12
JPS6239825B2 true JPS6239825B2 (https=) 1987-08-25

Family

ID=16020039

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56176799A Granted JPS5878443A (ja) 1981-11-04 1981-11-04 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS5878443A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6081843A (ja) * 1983-10-12 1985-05-09 Fujitsu Ltd マイクロ波筐体の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51114874A (en) * 1975-04-02 1976-10-08 Hitachi Ltd Semiconductor device formation method
JPS577835A (en) * 1980-06-19 1982-01-16 Hitachi Cable Ltd Manufacture of base material for optical fiber

Also Published As

Publication number Publication date
JPS5878443A (ja) 1983-05-12

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