JPS6236391B2 - - Google Patents
Info
- Publication number
- JPS6236391B2 JPS6236391B2 JP57076941A JP7694182A JPS6236391B2 JP S6236391 B2 JPS6236391 B2 JP S6236391B2 JP 57076941 A JP57076941 A JP 57076941A JP 7694182 A JP7694182 A JP 7694182A JP S6236391 B2 JPS6236391 B2 JP S6236391B2
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- metal
- brazing material
- semiconductor element
- brazed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W95/00—Packaging processes not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
- H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57076941A JPS5890748A (ja) | 1982-05-07 | 1982-05-07 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57076941A JPS5890748A (ja) | 1982-05-07 | 1982-05-07 | 半導体装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49100939A Division JPS5819385B2 (ja) | 1974-09-04 | 1974-09-04 | ロウヅケホウホウ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5890748A JPS5890748A (ja) | 1983-05-30 |
| JPS6236391B2 true JPS6236391B2 (enExample) | 1987-08-06 |
Family
ID=13619764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57076941A Granted JPS5890748A (ja) | 1982-05-07 | 1982-05-07 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5890748A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59195856A (ja) * | 1983-04-20 | 1984-11-07 | Fujitsu Ltd | 半導体装置及びその製造方法 |
| JPS61107751A (ja) * | 1984-10-30 | 1986-05-26 | Nec Kansai Ltd | 樹脂モ−ルド型半導体装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5819385B2 (ja) * | 1974-09-04 | 1983-04-18 | 日本電気株式会社 | ロウヅケホウホウ |
-
1982
- 1982-05-07 JP JP57076941A patent/JPS5890748A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5890748A (ja) | 1983-05-30 |
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