JPS6236290Y2 - - Google Patents
Info
- Publication number
- JPS6236290Y2 JPS6236290Y2 JP19648381U JP19648381U JPS6236290Y2 JP S6236290 Y2 JPS6236290 Y2 JP S6236290Y2 JP 19648381 U JP19648381 U JP 19648381U JP 19648381 U JP19648381 U JP 19648381U JP S6236290 Y2 JPS6236290 Y2 JP S6236290Y2
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- fixed
- external connection
- semiconductor element
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 33
- 239000000758 substrate Substances 0.000 claims description 20
- 239000002184 metal Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000012212 insulator Substances 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19648381U JPS5899841U (ja) | 1981-12-26 | 1981-12-26 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19648381U JPS5899841U (ja) | 1981-12-26 | 1981-12-26 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5899841U JPS5899841U (ja) | 1983-07-07 |
| JPS6236290Y2 true JPS6236290Y2 (en, 2012) | 1987-09-16 |
Family
ID=30109723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19648381U Granted JPS5899841U (ja) | 1981-12-26 | 1981-12-26 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5899841U (en, 2012) |
-
1981
- 1981-12-26 JP JP19648381U patent/JPS5899841U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5899841U (ja) | 1983-07-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6114668B2 (en, 2012) | ||
| JPH03225854A (ja) | 半導体デバイス及びその製造方法 | |
| JP2532230B2 (ja) | 高周波用回路素子密封パッケ―ジとその製造方法 | |
| JP2008294219A (ja) | 半導体装置及びその製造方法 | |
| JPS6236290Y2 (en, 2012) | ||
| JPH0645504A (ja) | 半導体装置 | |
| JP2991168B2 (ja) | 半導体装置およびその製造方法 | |
| US4297722A (en) | Ceramic package for semiconductor devices having metalized lead patterns formed like a floating island | |
| JPH0567697A (ja) | 樹脂封止型半導体装置 | |
| JPH0382060A (ja) | 半導体装置 | |
| JPS63299370A (ja) | 高周波用半導体装置 | |
| JPH05315467A (ja) | 混成集積回路装置 | |
| JPS63146453A (ja) | 半導体パツケ−ジおよびその製造方法 | |
| JPS639664B2 (en, 2012) | ||
| JP3126503B2 (ja) | 半導体装置 | |
| JPS6129155B2 (en, 2012) | ||
| JP3051225B2 (ja) | 集積回路用パッケージ | |
| JPS6130286Y2 (en, 2012) | ||
| JPH06112337A (ja) | 半導体装置用パッケージ | |
| JPH04137739A (ja) | 混成集積回路 | |
| JPH11186465A (ja) | 半導体装置およびその製造方法 | |
| JPS63152160A (ja) | 半導体装置用リ−ドフレ−ム | |
| JPS6236299Y2 (en, 2012) | ||
| JPS5840339B2 (ja) | 高周波トランジスタ | |
| JPH04106962A (ja) | 樹脂封止型半導体装置 |