JPS6234475Y2 - - Google Patents
Info
- Publication number
- JPS6234475Y2 JPS6234475Y2 JP1982193363U JP19336382U JPS6234475Y2 JP S6234475 Y2 JPS6234475 Y2 JP S6234475Y2 JP 1982193363 U JP1982193363 U JP 1982193363U JP 19336382 U JP19336382 U JP 19336382U JP S6234475 Y2 JPS6234475 Y2 JP S6234475Y2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- circuit component
- shaped circuit
- conductor layer
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 21
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000007789 gas Substances 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000005476 soldering Methods 0.000 description 4
- 230000004907 flux Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19336382U JPS5996869U (ja) | 1982-12-20 | 1982-12-20 | チツプ状回路部品の取付装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19336382U JPS5996869U (ja) | 1982-12-20 | 1982-12-20 | チツプ状回路部品の取付装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5996869U JPS5996869U (ja) | 1984-06-30 |
JPS6234475Y2 true JPS6234475Y2 (ko) | 1987-09-02 |
Family
ID=30415903
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19336382U Granted JPS5996869U (ja) | 1982-12-20 | 1982-12-20 | チツプ状回路部品の取付装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5996869U (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008277340A (ja) * | 2007-04-25 | 2008-11-13 | Denso Corp | 配線金属板 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6120791U (ja) * | 1984-07-09 | 1986-02-06 | ト−ソ−株式会社 | ブラインド用ブラケツト |
-
1982
- 1982-12-20 JP JP19336382U patent/JPS5996869U/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6120791U (ja) * | 1984-07-09 | 1986-02-06 | ト−ソ−株式会社 | ブラインド用ブラケツト |
Also Published As
Publication number | Publication date |
---|---|
JPS5996869U (ja) | 1984-06-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6234475Y2 (ko) | ||
JP2800691B2 (ja) | 回路基板の接続構造 | |
JP2675473B2 (ja) | フラットパッケージic半田ディップ型プリント配線板 | |
JP2000068148A (ja) | 積層セラミック部品とその積層セラミック部品連 | |
JPS6236316Y2 (ko) | ||
JPS6120791Y2 (ko) | ||
JPS6240462Y2 (ko) | ||
JP2501678Y2 (ja) | 回路基板装置 | |
JP2002026482A (ja) | 電子部品の実装構造 | |
JP2591505B2 (ja) | 印刷配線板 | |
JPS62243393A (ja) | プリント基板 | |
JPH0513011Y2 (ko) | ||
JPS6361796B2 (ko) | ||
JPH0414286A (ja) | 表面実装用多層プリント配線板 | |
JPS6123391A (ja) | チツプ状回路部品の取付装置 | |
JPH03132092A (ja) | 印刷配線基板 | |
JPH0353516Y2 (ko) | ||
JPH0766952B2 (ja) | 混成集積回路装置 | |
JPH0378288A (ja) | 半導体装置 | |
JPH0569976U (ja) | 電子部品の実装構体 | |
JPS61177472U (ko) | ||
JPH1075041A (ja) | 回路基板 | |
JPS625679U (ko) | ||
JPS59227189A (ja) | チツプ状回路部品の半田デイツプ方法 | |
JPS5999475U (ja) | 電子部品のハンダ付け構造 |