JPS6234475Y2 - - Google Patents
Info
- Publication number
- JPS6234475Y2 JPS6234475Y2 JP1982193363U JP19336382U JPS6234475Y2 JP S6234475 Y2 JPS6234475 Y2 JP S6234475Y2 JP 1982193363 U JP1982193363 U JP 1982193363U JP 19336382 U JP19336382 U JP 19336382U JP S6234475 Y2 JPS6234475 Y2 JP S6234475Y2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- circuit component
- shaped circuit
- conductor layer
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 21
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000007789 gas Substances 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000005476 soldering Methods 0.000 description 4
- 230000004907 flux Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【考案の詳細な説明】
産業上の利用分野
本考案はリード線を有しないチツプ状回路部品
（以下、チツプ部品という。）の取付装置に関する
ものである。[Detailed Description of the Invention] Industrial Application Field The present invention relates to a mounting device for chip-shaped circuit components (hereinafter referred to as chip components) that do not have lead wires.
従来技術
近年、コンデンサ、抵抗などの回路部品として
リード線を有しないいわゆるチツプ部品が多く用
いられている。ところで、これらチツプ部品は印
刷配線基板の導体層側に装着し、両端部に設けた
電極部を印刷配線基板の導体層に直接半田付けし
て使用される。BACKGROUND OF THE INVENTION In recent years, so-called chip components without lead wires have been widely used as circuit components such as capacitors and resistors. Incidentally, these chip components are used by being mounted on the conductor layer side of a printed wiring board, and electrode portions provided at both ends are directly soldered to the conductor layer of the printed wiring board.
しかしながら、半田付作業の際に、フラツクス
等の一部がガス化し、空気やガスによる気泡がチ
ツプ部品と導体層間に、滞留し、半田付着の信頼
性を著しく阻害していた。 However, during soldering work, some of the flux and the like become gasified, and air and gas bubbles remain between the chip components and the conductor layer, significantly impairing the reliability of solder adhesion.
かかる難点を解消するものとして、特公昭55−
38077号が提案されている。今、この従来装置を
第１図を参照して説明する。印刷配線基板１の導
体層２に、取付けられるチツプ部品３に近接し
て、上記チツプ部品３の電極部に対向する貫通孔
４を形成し、貫通孔４より空気、ガス等を排出
し、空気留りを防止するものである。 As a solution to this difficulty, the
No. 38077 is proposed. This conventional device will now be explained with reference to FIG. A through hole 4 is formed in the conductor layer 2 of the printed wiring board 1 in the vicinity of the chip component 3 to be attached, and faces the electrode portion of the chip component 3. Air, gas, etc. are discharged from the through hole 4, and the air This prevents it from becoming stuck.
ところが、この取付装置においても、チツプ部
品３と導体層２との間に、ガス等の気泡が入つた
場合、この気泡により、チツプ部品３を導体層２
より浮き上がらせ、半田付着が弱くなり、半田付
着の信頼性を阻害する懸念があつた。 However, even in this mounting device, if air bubbles such as gas enter between the chip part 3 and the conductor layer 2, the air bubbles cause the chip part 3 to be attached to the conductor layer 2.
There was a concern that the solder adhesion would become more elevated, weakening the solder adhesion, and impeding the reliability of the solder adhesion.
考案の目的
本考案は上述した従来の難点を解消し、チツプ
部品の半田付けを確実にし、その信頼性を向上さ
せることを目的とする。Purpose of the invention The purpose of the present invention is to solve the above-mentioned conventional difficulties, ensure the soldering of chip parts, and improve its reliability.
考案の構成
本考案はリード線を有しないチツプ状回路部品
を印刷配線基板の導体層側に装着し、前記チツプ
状回路部品の両端部に設けた電極部を前記印刷配
線基板の導体層に半田付けして取付るものであつ
て、前記チツプ状回路部品が装着される導体層お
よび、この導体層間に、チツプ状回路部品の全長
より長く、且、チツプ状回路部品の全幅より狭い
貫通長溝をチツプ状回路部品の両端部から延在す
る如く形成してなるチツプ状回路部品の取付装置
に関するものである。Structure of the invention The present invention mounts a chip-shaped circuit component without lead wires on the conductor layer side of a printed wiring board, and solders electrode parts provided at both ends of the chip-shaped circuit component to the conductor layer of the printed wiring board. A conductor layer on which the chip-shaped circuit component is mounted, and a penetrating long groove that is longer than the total length of the chip-shaped circuit component and narrower than the total width of the chip-shaped circuit component is provided between the conductor layer and the conductor layer on which the chip-shaped circuit component is mounted. The present invention relates to a mounting device for a chip-shaped circuit component, which is formed so as to extend from both ends of the chip-shaped circuit component.
実施例
以下、本考案の一実施例を第２図および第３図
に従い説明する。第２図は本考案の斜視図、第３
図は第２図のＸ−X′線断面図である。Embodiment An embodiment of the present invention will be described below with reference to FIGS. 2 and 3. Figure 2 is a perspective view of the present invention, Figure 3
The figure is a sectional view taken along the line X-X' in FIG. 2.
これらの図において、３はチツプ部品にして、
両端に電極部を有する。１は印刷配線基板、２は
印刷配線基板１に形成された導体層、５はチツプ
部品を仮止めする接着剤である。６は基板１を貫
通する空気留り防止用の長溝にして、導体層２お
よびこの導体層２間に、チツプ部品３の全長より
長く、且、チツプ部品３の全幅より狭くチツプ部
品３の両端部から延在する如く形成されている。 In these figures, 3 is a chip part,
It has electrode parts at both ends. 1 is a printed wiring board, 2 is a conductive layer formed on the printed wiring board 1, and 5 is an adhesive for temporarily fixing chip components. Reference numeral 6 denotes a long groove for preventing air trapping that penetrates through the board 1, and has a groove between the conductor layer 2 and the conductor layer 2, which is longer than the total length of the chip component 3 and narrower than the total width of the chip component 3, and is provided at both ends of the chip component 3. It is formed so as to extend from the section.
而して、チツプ部品３を導体層２間に仮装着
し、リフロー半田付け法により、チツプ部品３の
両端部に設けた電極部を半田付けする。この際、
フラツクスの一部がガス化するが、これらのガス
や空気は、第３図の矢印に示す如く、長溝６から
効果的に抜けて、ガスの滞留が防止できるので、
半田付着が確実に行なえる。 The chip component 3 is then temporarily attached between the conductor layers 2, and the electrode portions provided at both ends of the chip component 3 are soldered by reflow soldering. On this occasion,
Although some of the flux is gasified, these gases and air can effectively escape through the long grooves 6 as shown by the arrows in Fig. 3, and gas retention can be prevented.
Solder adhesion can be performed reliably.
考案の効果
以上説明したように、本考案によると、半田付
けの際生じるフラツクスのガスが確実に放出で
き、チツプ部品と導体層との間にガスが回り込ん
でチツプ部品を浮き上がらせるおそれもなく、チ
ツプ部品を導体層とを確実に半田付けでき、その
信頼性を向上させることができる。Effects of the invention As explained above, according to the invention, the flux gas generated during soldering can be reliably released, and there is no risk of gas entering between the chip components and the conductor layer and lifting the chip components. , the chip components can be reliably soldered to the conductor layer, and the reliability thereof can be improved.
第１図は従来例を示す斜視図、第２図および第
３図は本考案の一実施例を示すもので、第２図は
斜視図、第３図は第２図のＸ−X′線断面図であ
る。
１……印刷基板、２……導体層、３……チツプ
部品、６……長溝。
Fig. 1 is a perspective view showing a conventional example, Figs. 2 and 3 show an embodiment of the present invention, Fig. 2 is a perspective view, and Fig. 3 is a line taken along line X-X' in Fig. 2. FIG. 1...Printed board, 2...Conductor layer, 3...Chip parts, 6...Long groove.
Claims (1)
線基板の導体層側に接着剤にて仮装着し、前記チ
ツプ状回路部品の両端部に設けた電極部を前記印
刷配線基板の導体層に半田付けして取付るもので
あつて、前記チツプ状回路部品が装着される導体
層およびこの導体層間に、チツプ状回路部品の全
長より長く、且、チツプ状回路部品の全幅より狭
い貫通長溝をチツプ状回路部品の両端部から延在
する如く形成してなるチツプ状回路部品の取付装
置。 A chip-shaped circuit component without lead wires is temporarily attached to the conductor layer side of the printed wiring board with adhesive, and electrode parts provided at both ends of the chip-shaped circuit component are soldered to the conductor layer of the printed wiring board. The chip-shaped circuit component is installed as a chip-shaped circuit component, and a through-long groove is formed between the conductor layer on which the chip-shaped circuit component is mounted and the conductor layer, and is longer than the total length of the chip-shaped circuit component and narrower than the total width of the chip-shaped circuit component. A mounting device for a chip-shaped circuit component, which is formed so as to extend from both ends of the circuit component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19336382U JPS5996869U (en) | 1982-12-20 | 1982-12-20 | Mounting device for chip-shaped circuit components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19336382U JPS5996869U (en) | 1982-12-20 | 1982-12-20 | Mounting device for chip-shaped circuit components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5996869U JPS5996869U (en) | 1984-06-30 |
| JPS6234475Y2 true JPS6234475Y2 (en) | 1987-09-02 |
Family
ID=30415903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19336382U Granted JPS5996869U (en) | 1982-12-20 | 1982-12-20 | Mounting device for chip-shaped circuit components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5996869U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008277340A (en) * | 2007-04-25 | 2008-11-13 | Denso Corp | Wiring metal plate |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6120791U (en) * | 1984-07-09 | 1986-02-06 | ト−ソ−株式会社 | bracket for blinds |
-
1982
- 1982-12-20 JP JP19336382U patent/JPS5996869U/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6120791U (en) * | 1984-07-09 | 1986-02-06 | ト−ソ−株式会社 | bracket for blinds |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5996869U (en) | 1984-06-30 |
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