JPS6120791Y2 - - Google Patents
Info
- Publication number
- JPS6120791Y2 JPS6120791Y2 JP1096881U JP1096881U JPS6120791Y2 JP S6120791 Y2 JPS6120791 Y2 JP S6120791Y2 JP 1096881 U JP1096881 U JP 1096881U JP 1096881 U JP1096881 U JP 1096881U JP S6120791 Y2 JPS6120791 Y2 JP S6120791Y2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- shaped circuit
- circuit component
- printed wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 description 7
- 238000005476 soldering Methods 0.000 description 6
- 230000004907 flux Effects 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- -1 resistors Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【考案の詳細な説明】
本考案はリード線を有しないチツプ状回路部品
を半田付けによつて印刷配線基板に取付固定する
チツプ状回路部品の取付装置に係り、チツプ状回
路部品の半田付けを確実にし、その信頼性を著し
く向上させる取付装置に関する。[Detailed Description of the Invention] The present invention relates to a chip-shaped circuit component mounting device for attaching and fixing chip-shaped circuit components without lead wires to a printed wiring board by soldering. The present invention relates to a mounting device that significantly improves its reliability.
最近、コンデンサ、抵抗、半導体等の印刷配線
基板用の回路部品としてリード線を有しないチツ
プ状回路部品が開発され、実用化されるるように
なつてきたが、これらの回路部品は印刷配線基板
の導体層よりなるパターン部に装着し、両端部に
設けた電極部を印刷配線基板の導体層より成るパ
ターン部に直接半田付けして使用するものであ
る。ところでこの種のチツプ状回路部品を印刷配
線基板に取付けるに際しては、溶融半田がチツプ
状回路部品の両端に流れ込むため、これによつて
空気が一緒に巻込まれ、さらに印刷配線基板に付
着したフラツクス等がガス化して、これらの空気
やガスによる気泡がチツプ状回路部品の両側にそ
れぞれ滞留し、半田付着の信頼性を著しく阻害し
ていた。 Recently, chip-shaped circuit components without lead wires have been developed and put into practical use as circuit components for printed wiring boards such as capacitors, resistors, and semiconductors. It is used by being attached to a pattern part made of a conductor layer, and the electrode parts provided at both ends are directly soldered to the pattern part made of a conductor layer of a printed wiring board. By the way, when this type of chip-shaped circuit component is attached to a printed wiring board, molten solder flows into both ends of the chip-shaped circuit component, which entrains air and further removes flux, etc. attached to the printed wiring board. These air and gas bubbles accumulate on both sides of chip-shaped circuit components, significantly impairing the reliability of solder adhesion.
そこで従来、上記した空気やガスによる気泡の
滞留を防止するものとして、第１図および第２図
に示されるように、印刷配線基板２のチツプ状回
路部品１に近接してチツプ状回路部品１の電極部
１′に対向する貫通孔５を形成し、半田付けの際
に上記した気泡を貫通孔５を通して放出するよう
にしたチツプ状回路部品の取付装置がある。な
お、図において符号３は導電層よりなるパターン
部、４は半田、６はソルダーレジストである。 Therefore, as shown in FIGS. 1 and 2, in order to prevent the accumulation of air bubbles due to the above-mentioned air or gas, conventionally, as shown in FIGS. There is a mounting device for a chip-shaped circuit component in which a through hole 5 is formed opposite to the electrode portion 1', and the above-mentioned air bubbles are released through the through hole 5 during soldering. In the figure, numeral 3 is a pattern portion made of a conductive layer, 4 is solder, and 6 is a solder resist.
しかしながら上記したチツプ状回路部品の取付
装置は、チツプ状回路部品を取付けるにあたり、
上記した気泡に対して半田付けを著しく効果的に
かつ確実に行なうことが可能であるが、明かじめ
貫通孔５を形成しなければならないばかりか、半
田付けによるチツプ状回路部品の取付け時に、こ
の貫通孔５を通して印刷配線基板に付着している
フラツクスが基板表面に露出し、基板表面に設置
されている電気部品に悪影響を与える欠点があつ
た。 However, the above-mentioned mounting device for chip-type circuit components has the following problems when mounting chip-type circuit components:
Although it is possible to perform soldering remarkably effectively and reliably with respect to the above-mentioned air bubbles, there is a drawback in that not only must the through holes 5 be formed beforehand, but also that when the chip-like circuit components are attached by soldering, the flux adhering to the printed wiring board is exposed to the board surface through the through holes 5, adversely affecting the electrical components mounted on the board surface.
本考案は上記した従来の欠点に鑑みて成された
ものであり、その目的とするところは、印刷配線
基板にチツプ状回路部品を取付けに際し、簡単な
構成で空気やガスによる気泡の滞留を防止し半田
付けの信頼性を向上させると共に、フラツクスが
印刷配線基板の表面（上面）へ露出させることを
防止した取付装置を提供するにある。 The present invention was developed in view of the above-mentioned drawbacks of the conventional technology, and its purpose is to prevent the accumulation of air and gas bubbles with a simple structure when installing chip-shaped circuit components on printed wiring boards. An object of the present invention is to provide a mounting device that improves the reliability of soldering and prevents flux from being exposed to the surface (upper surface) of a printed wiring board.
以下、本考案のチツプ状回路部品の取付装置に
ついて一実施例の図面とともに説明する。 DESCRIPTION OF THE PREFERRED EMBODIMENTS A mounting device for chip-shaped circuit components according to the present invention will be described below with reference to drawings of one embodiment.
第３図および第４図はそれぞれ本考案のチツプ
状回路部品の取付装置における一実施例の断面図
および平面図であり、図中１は両端に電極部
１′，１′を有するチツプ状回路部品、２は印刷配
線基板、３は印刷配線基板２に形成された導体層
よりなるパターン部、４はチツプ状回路部品１の
電極部１′，１′と印刷配線基板２のパターン部３
とを電気的に接続固定するための付着された半
田、６は不要な半田付着を防止するためのソルダ
ーレジスト、７は前記印刷配線基板２の前記チツ
プ状回路部品１における電極部１′，１′が半田付
けされるパターン部３の端部に形成された、前記
電極部１′，１′の長さより長い導電層を有しない
スリツト状の半ぬき部分である。 3 and 4 are a sectional view and a plan view, respectively, of an embodiment of the chip-shaped circuit component mounting device of the present invention, and in the figure, 1 indicates a chip-shaped circuit having electrode portions 1', 1' at both ends. The components include a printed wiring board 2, a pattern portion 3 formed of a conductive layer formed on the printed wiring board 2, and 4 electrode portions 1', 1' of the chip-shaped circuit component 1 and a pattern portion 3 of the printed wiring board 2.
6 is a solder resist for preventing unnecessary solder adhesion, and 7 is electrode portions 1', 1 of the chip-shaped circuit component 1 of the printed wiring board 2. ' is a slit-shaped half-opened part formed at the end of the pattern part 3 to be soldered and which does not have a conductive layer longer than the length of the electrode parts 1', 1'.
本考案は上記実施例から明らかなように、印刷
配線基板のチツプ状回路部品に近接してパターン
部に半ぬき部分（ハーフピアス部分）を形成した
ものであり、チツプ状回路部品の電極部と印刷配
線基板のパターン部とを半田付けした場合でも空
気やガスによる気泡は印刷配線基板とチツプ状回
路部品間に形成された半ぬき部分を通して効果的
に放出されると共に、印刷配線基板の表面（上
面）にレジストが露出することなく半田付けを行
なうことができる。 As is clear from the above-mentioned embodiments, the present invention has a half-pierced part (half-pierced part) formed in the pattern part in the vicinity of the chip-shaped circuit component of the printed wiring board, and is similar to the electrode part of the chip-shaped circuit component. Even when the printed wiring board pattern section is soldered, air and gas bubbles are effectively released through the half-opened part formed between the printed wiring board and chip-shaped circuit components, and the surface of the printed wiring board ( Soldering can be performed without exposing the resist on the top surface.
なお印刷配線基板に形成した半ぬき部分は、回
路の修理、調整に際して半ぬき部分を押して取り
のぞくことによつて孔またはスリツトを印刷配線
基板に形成し、この孔またはスリツトをリード線
の付いている従来の回路部品を取付けるのに利用
することが可能である。 When repairing or adjusting a circuit, press and remove the half-opened part formed on the printed wiring board to form a hole or slit in the printed wiring board, and use this hole or slit to attach the lead wire. It can be used to attach conventional circuit components.
第１図および第２図は従来におけるチツプ状回
路部品の取付装置のそれぞれ断面図および平面
図、第３図および第４図は本考案のチツプ状回路
部品の取付装置における一実施例を示すそれぞれ
断面図および平面図である。
１……チツプ状回路部品、２……印刷配線基
板、３……パターン部、４……半田、７……半ぬ
き部、Ａ……接触部。
1 and 2 are a sectional view and a plan view, respectively, of a conventional chip-shaped circuit component mounting device, and FIGS. 3 and 4 show an embodiment of the chip-shaped circuit component mounting device of the present invention, respectively. They are a sectional view and a plan view. DESCRIPTION OF SYMBOLS 1...Chip-shaped circuit component, 2...Printed wiring board, 3...Pattern part, 4...Solder, 7...Half-blanked part, A...Contact part.
Claims (1)
電層からなるパターン部に半田付けされる印刷配
線基板とを具備し、該印刷配線基板の前記チツプ
状回路部品における電極部が半田付けされるパタ
ーンの端部に、前記電極部の長さより長い導電層
を有しないスリツト状の半ぬき部分を形成し、前
記チツプ状回路部品の前記パターン部への半田付
け時において発生する空気やガスによる気泡を、
前記半ぬき部分を介して放出するようにしたこと
を特徴とするチツプ状回路部品の取付装置。 A printed wiring board comprising a chip-shaped circuit component and a printed wiring board to which the chip-shaped circuit component is soldered to a pattern portion made of a conductive layer, and a pattern to which an electrode part of the chip-shaped circuit component of the printed wiring board is soldered. A slit-like half-opened part without a conductive layer that is longer than the length of the electrode part is formed at the end of the electrode part to prevent bubbles caused by air or gas generated when the chip-shaped circuit component is soldered to the pattern part. ,
A mounting device for a chip-shaped circuit component, characterized in that the chip-shaped circuit component is ejected through the half-opened portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1096881U JPS6120791Y2 (en) | 1981-01-30 | 1981-01-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1096881U JPS6120791Y2 (en) | 1981-01-30 | 1981-01-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57125560U JPS57125560U (en) | 1982-08-05 |
| JPS6120791Y2 true JPS6120791Y2 (en) | 1986-06-21 |
Family
ID=29809113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1096881U Expired JPS6120791Y2 (en) | 1981-01-30 | 1981-01-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6120791Y2 (en) |
-
1981
- 1981-01-30 JP JP1096881U patent/JPS6120791Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57125560U (en) | 1982-08-05 |
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