JP2800691B2 - Circuit board connection structure - Google Patents
Circuit board connection structureInfo
- Publication number
- JP2800691B2 JP2800691B2 JP6180588A JP18058894A JP2800691B2 JP 2800691 B2 JP2800691 B2 JP 2800691B2 JP 6180588 A JP6180588 A JP 6180588A JP 18058894 A JP18058894 A JP 18058894A JP 2800691 B2 JP2800691 B2 JP 2800691B2
- Authority
- JP
- Japan
- Prior art keywords
- connection
- connection land
- land
- circuit board
- width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/38—Effects and problems related to the device integration
- H01L2924/384—Bump effects
- H01L2924/3841—Solder bridging
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
Landscapes
- Combinations Of Printed Boards (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、回路基板とフレキシブ
ル基板とをはんだ付け等で電気的接合をする接続構造に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connection structure for electrically connecting a circuit board and a flexible board by soldering or the like.
【０００２】[0002]
【従来の技術】従来、回路基板とフレキシブル基板とを
はんだ付けする接続構造は、それぞれの基板に接続ラン
ドを設けて、その接続ランドを対向させてはんだ付けし
ている。近年では集積度が進み、配線パターンの間隔が
細かくなり、はんだ付けの際に隣り合った配線どうしが
はんだブリッジ４６を形成することがあるため（図
４）、例えば実開昭61-171273 号公報などのように、フ
レキシブル基板の接続ランドの長さを回路基板の接続ラ
ンドよりも短くしてはんだ付けすることが示されている
（図２）。また実開平1-65171 号公報では、フレキシブ
ル基板の接続ランドの長さを回路基板側の接続ランドよ
りも長くした接続構造（図３）が示されている。2. Description of the Related Art Conventionally, in a connection structure for soldering a circuit board and a flexible board, connection lands are provided on each board, and the connection lands are opposed to each other and soldered. In recent years, the degree of integration has increased, and the spacing between wiring patterns has become smaller, and adjacent wirings may form solder bridges 46 during soldering (FIG. 4). As shown in FIG. 2, soldering is performed with the connection land of the flexible board shorter than the connection land of the circuit board (FIG. 2). Japanese Utility Model Laid-Open Publication No. 1-65171 discloses a connection structure in which the connection lands of the flexible substrate are longer than the connection lands on the circuit board side (FIG. 3).
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、前記の
長さを短くした構造でも、端部に形成されるはんだフィ
レット（以下、フィレットと記す）の輪郭長が短く、は
んだブリッジ防止効果は充分ではない。また、フレキシ
ブル基板の接続ランドの長さを回路基板側の接続ランド
よりも広くした場合は、形成されたフィレットがフレキ
シブル基板側からは確認することができないため、はん
だ付け後の検査が困難であるという問題がある。However, even in the structure in which the length is shortened, the contour length of the solder fillet (hereinafter, referred to as a fillet) formed at the end is short, and the effect of preventing the solder bridge is not sufficient. . In addition, when the length of the connection land of the flexible board is made wider than the connection land on the circuit board side, the formed fillet cannot be confirmed from the flexible board side, so that inspection after soldering is difficult. There is a problem.
【０００４】従って本発明の目的は、はんだブリッジを
抑制して微細化が可能な、接続後の検査を容易にする回
路基板の接続構造を提供することである。Accordingly, an object of the present invention is to provide a connection structure of a circuit board which can be miniaturized by suppressing a solder bridge and which facilitates inspection after connection.
【０００５】[0005]
【課題を解決するための手段】上記の課題を解決するた
め本発明の構成は、回路基板に設けられた少なくとも一
つ以上の第一接続ランドと、該第一接続ランドと相対向
する位置のフレキシブル基板の第二接続ランドとを対向
させて、導電性接続材料で接続する回路基板の接続構造
において、前記第二接続ランドの幅が前記第一接続ラン
ドの幅よりも狭く、前記第二接続ランドが、幅方向で前
記第一接続ランドの幅内に配置され、接続した部分の長
手方向に沿って、前記第二接続ランド側から前記第一接
続ランド側に広がる前記導電性接続材料のフィレットが
形成されており、前記フレキシブル基板の第二接続ラン
ド領域が透明で、前記導電性接合材料が前記フレキシブ
ル基板側から目視できる構造であることである。In order to solve the above-mentioned problems, the structure of the present invention comprises at least one or more first connection lands provided on a circuit board and a first connection land at a position opposed to the first connection land. In a circuit board connection structure in which a second connection land of a flexible substrate is opposed to and connected with a conductive connection material, the width of the second connection land is smaller than the width of the first connection land, and A land is disposed within a width of the first connection land in a width direction, and a fillet of the conductive connection material extending from the second connection land side to the first connection land side along a longitudinal direction of a connected portion. Is formed, and the second connection run of the flexible substrate is formed.
And the conductive bonding material is flexible.
This is a structure that can be seen from the side of the substrate .
【０００６】[0006]
【作用】回路基板の第一接続ランドの幅がフレキシブル
基板の第二接続ランドの幅よりも広く、第二接続ランド
が第一接続ランドの幅内に位置するので、はんだ付けに
よる場合、はんだは隣り合った接続ランド領域へはみ出
さないで、自身の第二接続ランドから第一接続ランドに
向けて長手方向に沿って広がるフィレットを形成する。
このフィレット部分は透明にしたフレキシブル基板側か
ら確認できる。The width of the first connection land of the circuit board is wider than the width of the second connection land of the flexible substrate, and the second connection land is located within the width of the first connection land. Forming a fillet extending in the longitudinal direction from its own second connection land to the first connection land without protruding into the adjacent connection land area.
This fillet portion can be confirmed from the transparent flexible substrate side.
【０００７】[0007]
【発明の効果】回路基板側に広がるフィレットを確実に
形成する構造としてあるので、導電性接合材料がはんだ
の場合、はんだが他の接続ランド領域へ流出することが
防止され、はんだブリッジが発生することが抑制され、
配線間隔を狭くずくことができる。また形成されたはん
だフィレットを透明なフレキシブル基板側から確認でき
るので、はんだ付け後の検査が容易であり、たとえはん
だブリッジが発生していたとしても、容易に発見できて
不良品を出荷してしまうことがない。導電性接合材料が
銀(Ag)ペーストでも同様である。According to the present invention, since the fillet extending to the circuit board side is reliably formed, when the conductive bonding material is a solder, the solder is prevented from flowing out to another connection land area, and a solder bridge is generated. Is suppressed,
The wiring interval can be reduced. In addition, since the formed solder fillet can be confirmed from the transparent flexible substrate side, inspection after soldering is easy, and even if a solder bridge has occurred, it can be easily found and defective products will be shipped. Nothing. The same applies to the case where the conductive bonding material is silver (Ag) paste.
【０００８】[0008]
【実施例】以下、本発明を具体的な実施例に基づいて説
明する。図１は、フレキシブル基板１と回路基板２とを
それぞれの接続ランド５、６（第一接続ランド６、第二
接続ランド５）を対向させてはんだ付けした状態を、配
線の幅方向に切った断面図で模式的に示したものであ
る。フレキシブル基板１側の第二接続ランド５の幅Ｗ1
は、回路基板２側の第一接続ランド６の幅Ｗ2 よりも狭
く、ここの例ではＷ1 をＷ2 の半分程度にした場合を示
している。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to specific embodiments. FIG. 1 shows a state in which the flexible board 1 and the circuit board 2 are soldered with the connection lands 5 and 6 (the first connection lands 6 and the second connection lands 5) facing each other in the width direction of the wiring. This is schematically shown in a sectional view. The width W1 of the second connection land 5 on the flexible substrate 1 side
Is smaller than the width W2 of the first connection land 6 on the circuit board 2 side. In this example, W1 is about half of W2.
【０００９】はんだ付けによってはんだ３は、図１に示
すように、はんだのぬれの効果や表面張力により第二接
続ランド５の周囲に回り込んで、第二接続ランド５の根
元まではんだが付く状態になり、第一接続ランド６側で
は、ランドの表面にはんだが広がってはんだフィレット
４を形成する。このため、フィレット４ははんだ溜まり
の役割を果たし、はんだ３が隣の接続ランドへ流動する
ことを防ぐ。それで、はんだブリッジの発生が抑制さ
れ、端子間ショートを防ぐ。As shown in FIG. 1, the solder 3 wraps around the second connection land 5 due to the effect of solder wetting and surface tension, and the solder 3 is attached to the root of the second connection land 5 as shown in FIG. Then, on the first connection land 6 side, the solder spreads on the surface of the land to form the solder fillet 4. Therefore, the fillet 4 plays a role of a solder pool and prevents the solder 3 from flowing to the adjacent connection land. Therefore, occurrence of a solder bridge is suppressed, and a short circuit between terminals is prevented.
【００１０】第二接続ランド５の幅Ｗ1 は、特に第一接
続ランド６の幅Ｗ2 の半分程度に限るものではなく、第
一接続ランド６側にフィレットが形成されるように幅が
広がっていればよく、また第二接続ランド５の位置が第
一接続ランド６の位置の丁度中央に位置していなくて
も、フィレットが第一接続ランド６側に広がって形成さ
れる位置であれば良い。従ってフレキシブル基板１の位
置が回路基板２の位置からわずかにずれたとしても、は
んだ付けに不具合が生じることなく、確実にフィレット
が形成され、はんだブリッジが生じることが抑制され
る。[0010] The width W1 of the second connection land 5 is not particularly limited to about half of the width W2 of the first connection land 6, but is widened so that a fillet is formed on the first connection land 6 side. It is sufficient that the position of the second connection land 5 is not exactly located at the center of the position of the first connection land 6 as long as the fillet extends toward the first connection land 6. Therefore, even if the position of the flexible substrate 1 is slightly deviated from the position of the circuit board 2, a fillet is reliably formed without any trouble in soldering, and the occurrence of a solder bridge is suppressed.
【００１１】図１に示すフィレット３は、配線の長手方
向に沿って形成されるが、図２や図３に示すような従来
の端部に幅方向に沿ってのみ形成されるフィレットと異
なり、面積的に広く接合しているために従来よりも充分
強度が確保される。従ってフレキシブル基板１にかかる
力によって接続ランド部分に応力が作用する場合でも、
従来よりもずっと耐久性を有することになる。なお、以
上の実施例は、はんだの例で示したが、他の導電性接合
材料、例えば銀(Ag)ペーストなどでも本発明の効果は同
様である。Although the fillet 3 shown in FIG. 1 is formed along the longitudinal direction of the wiring, it is different from the conventional fillet formed only along the width direction at the end as shown in FIGS. 2 and 3. Due to the large area of the joint, sufficient strength can be ensured as compared with the related art. Therefore, even when a stress acts on the connection land portion due to the force applied to the flexible substrate 1,
It will be much more durable than before. Although the above embodiment has been described by using an example of a solder, the effect of the present invention is the same with other conductive bonding materials such as silver (Ag) paste.
【００１２】請求項でいう接続ランドとは、配線パター
ンの端部で他の回路配線と接続するためのはんだ付けす
る領域を言う。また接続ランドの幅とは、その配線パタ
ーンのはんだ付け領域の幅ということである。また長手
方向とは、それぞれの基板での配線が引き回されて端部
方向に伸びている方向である。The term "connection land" as used in the claims means an area to be soldered at the end of the wiring pattern for connection to another circuit wiring. The width of the connection land means the width of the soldering area of the wiring pattern. The term “longitudinal direction” refers to a direction in which wiring on each substrate is routed and extends toward the end.
【００１３】以上の構成によることで、接続強度を向上
させつつ、配線間隔を狭くできて、さらに接続後の検査
を容易にする回路基板の接続構造を示した。With the above configuration, the connection structure of the circuit board has been shown which can improve the connection strength, narrow the wiring interval, and further facilitate inspection after connection.
【図１】本発明を適用する回路基板の接続構造の模式的
構成断面図。FIG. 1 is a schematic sectional view of a circuit board connection structure to which the present invention is applied.
【図２】従来の、第二接続ランドが第一接続ランドより
短い構成で、長手方向にフィレットを形成する構成の説
明図。FIG. 2 is an explanatory view of a conventional configuration in which a second connection land is shorter than a first connection land, and a fillet is formed in a longitudinal direction.
【図３】従来の、第二接続ランドが第一接続ランドより
長い構成の説明図。FIG. 3 is an explanatory view of a conventional configuration in which a second connection land is longer than a first connection land.
【図４】従来の、等幅構成のランドの場合のはんだブリ
ッジ形成の説明図。FIG. 4 is an explanatory view of a conventional solder bridge formation in the case of a land having an equal width configuration.
１ フレキシブル基板 ２ 回路基板 ３ はんだ ４ はんだフィレット ５ 第二接続ランド ６ 第一接続ランド ２１、３１、４０ フレキシブル基板 ２５、３２、４１ 第二接続ランド ２３、３７、４４ はんだ ２６、３５、４５ 第一接続ランド ２２、３４、４２ 回路基板 ４６ はんだブリッジ Ｗ1 第二接続ランド幅 Ｗ2 第一接続ランド幅 Ｌ 第二接続ランド長 Ｌ’ 第一接続ランド長 DESCRIPTION OF SYMBOLS 1 Flexible board 2 Circuit board 3 Solder 4 Solder fillet 5 Second connection land 6 First connection land 21, 31, 40 Flexible board 25, 32, 41 Second connection land 23, 37, 44 Solder 26, 35, 45 First Connection lands 22, 34, 42 Circuit board 46 Solder bridge W1 Second connection land width W2 First connection land width L Second connection land length L 'First connection land length
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平４−12389（ＪＰ，Ａ) 特開 昭61−177795（ＪＰ，Ａ) 特開 平４−145689（ＪＰ，Ａ) 特公 昭55−10998（ＪＰ，Ｂ１) (58)調査した分野(Int.Cl.6，ＤＢ名) H05K 1/14 H05K 3/36──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-4-12389 (JP, A) JP-A-61-177795 (JP, A) JP-A-4-145689 (JP, A) 10998 (JP, B1) (58) Field surveyed (Int. Cl. 6 , DB name) H05K 1/14 H05K 3/36
Claims (1)
の第一接続ランドと、 該第一接続ランドと相対向する位置のフレキシブル基板
の第二接続ランドとを対向させ、導電性接合材料で接続
する回路基板の接続構造において、 前記第二接続ランドの幅が前記第一接続ランドの幅より
も狭く、 前記第二接続ランドが、幅方向で前記第一接続ランドの
幅内に配置され、 接続した部分の長手方向に沿って、前記第二接続ランド
側から前記第一接続ランド側に広がる前記導電性接合材
料のフィレットが形成されており、 前記フレキシブル基板の第二接続ランド領域が透明で、
前記導電性接合材料が前記フレキシブル基板側から目視
できる構造である ことを特徴とする回路基板の接続構
造。At least one or more first connection lands provided on a circuit board are opposed to a second connection land of a flexible board at a position facing the first connection lands. In the connection structure of the circuit board to be connected, the width of the second connection land is smaller than the width of the first connection land, and the second connection land is disposed within the width of the first connection land in the width direction. along the longitudinal direction of the connecting portion, the fillet is formed of the conductive bonding material extending the first connection land side from the second connecting land side, a second connection land areas of the flexible substrate is transparent ,
The conductive bonding material is visually observed from the flexible substrate side.
A connection structure for a circuit board, wherein the connection structure is a structure that can be used .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6180588A JP2800691B2 (en) | 1994-07-07 | 1994-07-07 | Circuit board connection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6180588A JP2800691B2 (en) | 1994-07-07 | 1994-07-07 | Circuit board connection structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0823147A JPH0823147A (en) | 1996-01-23 |
| JP2800691B2 true JP2800691B2 (en) | 1998-09-21 |
Family
ID=16085895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6180588A Expired - Lifetime JP2800691B2 (en) | 1994-07-07 | 1994-07-07 | Circuit board connection structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2800691B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7974104B2 (en) | 2006-02-17 | 2011-07-05 | Fujikura Ltd. | Printed wiring board and connection configuration of the same |
| US8003892B2 (en) | 2006-03-27 | 2011-08-23 | Fujikura Ltd. | Print circuit substrate and connection configuration of the same |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7964800B2 (en) | 2006-05-25 | 2011-06-21 | Fujikura Ltd. | Printed wiring board, method for forming the printed wiring board, and board interconnection structure |
| US8424748B2 (en) | 2009-12-21 | 2013-04-23 | Intel Corporation | Solder in cavity interconnection technology |
| JP2012069599A (en) * | 2010-09-21 | 2012-04-05 | Seiko Instruments Inc | Electronic apparatus, and manufacturing method therefor |
| CN102593626A (en) * | 2011-01-14 | 2012-07-18 | 富士康(昆山)电脑接插件有限公司 | Flexible flat cable assembly and assembling method thereof |
| US8936967B2 (en) | 2011-03-23 | 2015-01-20 | Intel Corporation | Solder in cavity interconnection structures |
| JP2016134453A (en) * | 2015-01-16 | 2016-07-25 | 株式会社リコー | Flexible wiring member, liquid discharge head, liquid discharge unit, device for discharging liquid, and production method of liquid discharge head |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT362272B (en) * | 1978-07-11 | 1981-04-27 | Tyrolia Freizeitgeraete | SKI BINDING |
| JPS61177795A (en) * | 1985-02-01 | 1986-08-09 | 関西日本電気株式会社 | Connection for multiterminal lead |
| JPH0412389A (en) * | 1990-04-28 | 1992-01-16 | Nec Corp | Display device |
| JPH04145689A (en) * | 1990-10-08 | 1992-05-19 | Nippon Mektron Ltd | Laser soldering and device thereof |
-
1994
- 1994-07-07 JP JP6180588A patent/JP2800691B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7974104B2 (en) | 2006-02-17 | 2011-07-05 | Fujikura Ltd. | Printed wiring board and connection configuration of the same |
| US8345436B2 (en) | 2006-02-17 | 2013-01-01 | Fujikura Ltd. | Printed wiring board and connection configuration of the same |
| US8003892B2 (en) | 2006-03-27 | 2011-08-23 | Fujikura Ltd. | Print circuit substrate and connection configuration of the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0823147A (en) | 1996-01-23 |
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