JPS61177795A - Connection for multiterminal lead - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is used for manufacturing thin film KL matrix display panels, liquid crystal matrix display springs, etc. This terminal and the corresponding external lead of the external flexible pull lead are electrically and mechanically connected to the conventional thin film ICL and liquid crystal matrix display panels. It is common to form a series of small pins and sockets on the top of the electrode, and to each of these many terminals, external leads formed as separate flexible leads are soldered to take the electrodes out.

An example of the structure of a thin film KL matrix display panel will now be described with reference to FIGS. 8 and 9. Furthermore, the 8th
The left half of the figure shows a cross-sectional view in the X direction, and the right half shows a cross-sectional view in the Y direction orthogonal to the X direction. In the figure, 1 is a transparent glass substrate, 2 is a matrix type KL element formed on the glass substrate 1, 8 is an inverted dish-shaped cover glass that hermetically seals the KL element 2 on the glass substrate 1, and 4 is a FiL This is a flexible lead for taking out the electrode of element 2 to the outside. 5, 5, . . . in the EL element 2 are formed on the glass substrate 1.

A transparent electrode formed of T and O in a large number of stripes at predetermined intervals in the X direction by vapor deposition or the like, 6 a transparent first insulating layer of ytoi 4 covering the transparent electrode 5, 7 a first insulating layer 6, a light emitting layer such as ZnS:Mn formed on the light emitting layer 7; 8, a transparent second insulating layer such as Y, 01, etc., covering the light emitting layer 7; 9.9...
* is a back electrode made of an At vapor-deposited film formed on the second insulating layer 8 in a large number of stripes at predetermined pitches in the Y direction perpendicular to the X direction.

Each of the electrodes 5, 9, . Terminal 10.10・
It is superimposed on and connected to .... Terminal 10.10・
. . . is a multilayer body of metals such as Ti, At, and Ni.

Cover glass 3 is electric 4i! 5..., 9...
... is fixed on the glass substrate l via an insulating adhesive 11 at a position crossing near the terminals,
An insulating protective fluid 12 such as silicone oil is placed between the L elements 2.
is enclosed (Japanese Patent Publication No. 5'7-47559). The flexible lead 4 is an insulating flexible film 13 made of polyimide or the like, and the external lead 14.1 is made of a large number of copper foils etc. at the same pitch and edge as the terminal 10°10...
4... is formed by adhering to the external lead 14.
．． The end of 14... corresponds to the terminal 10.10.
. . . are electrically and mechanically connected by solder 15, 15 . . . .

External lead 14 of flexible lead 4.14...
...and terminal 10.10...... soldering is done in the first step.
This is done as shown in Figures 0 and 11. First of all
As shown in FIG. 0, the glass substrate 1 is placed on a stable stand 16. On the other hand, apply preliminary solder 15. on the ends of each external lead 14.
15 .
Align and overlap each terminal 1 as shown in Figure 11.
0.10...External lead 14.1 corresponding to above
4... are overlapped via preliminary solder 15.15...... And the quartz plate 1 is placed on the flexible lead 4.
7 is placed on it and the flexible lead 4 is pressed (static pressure) onto the glass substrate l using the stand 16. In this state, the infrared beam 18 is passed through the quartz plate 17 and scanned from above the quartz plate 17, and the preliminary solder 15.15...
. . . are sequentially heated and melted to form terminals 10.10.
...... and external leads 14.14...... (Electronic Materials February 1975 P, 125-180
).

By the way, in the method of soldering using infrared heating, a large amount of the thermal energy of the infrared beam 18 escapes from the glass substrate 1 to the outside through the base 16 such as a copper plate, resulting in poor heating efficiency. The power is increased more than necessary, but this may cause the flexible lead 4 to stretch due to overheating, causing the external lead 14 to become misaligned with the terminal 10, or the external lead 14 to lift up from the terminal 10, causing soldering between the two. However, the soldering reliability was poor and the product yield was poor.

Furthermore, if the amount of the preliminary solder 15 used to connect the terminals 10 and the external leads 14 of the - group is small, defects are more likely to occur in soldering due to the above reasons, so it was necessary to increase the thickness d of the preliminary solder 15. . However, if the solder thickness d is large, the terminal 10
When pressing and soldering the external lead 14, there is a risk that the molten solder will protrude into the ram and come into contact with the solder between the adjacent terminal and lead, causing a short circuit failure due to a solder bridge. The yield was getting worse.

Means for Solving the Problems The present invention provides a method in which, when soldering a terminal on an insulating substrate and an external lead of a flexible lead using infrared heating, the terminal and the external lead are overlapped by providing a portion where they do not face each other. Additionally, it is characterized by being soldered.

Effect: According to the above means, when the preliminary solder is irradiated with an infrared beam and scanned to melt it, the excess solder gets wet on the ends and/or the parts of the external leads that do not face the other party, and it is not possible to solve the problem as in the conventional method. Since the solder does not protrude between adjacent terminals and/or external leads, there is no chance of short circuits due to solder between adjacent terminals and external leads.

Moreover, since the solder can be thickened, the terminals and external leads can be reliably soldered.

EXAMPLE Hereinafter, a case in which the present invention is applied to soldering between a terminal of a thin film KL panel and an external lead of a flexible lead will be described with reference to the drawings.

Figures 1 to 3 show enlarged cross-sectional views of essential parts at each stage of the first embodiment. Figure 1 is an exploded cross-sectional view before soldering, and Figure 2 is a cross-sectional view after soldering. , FIG. 3 is a sectional view after soldering.

First, a glass substrate l on which terminals 10 of a predetermined width are formed is placed on a stand 16, and on this glass substrate &1, flexible leads are formed on external leads 14 having the same width as the terminals 10 with preliminary solder 15 formed thereon. 4 are positioned so that their external leads 14 are shifted from the terminals 10 by a predetermined dimension t, and the quartz plates 1 are placed on top of the flexible leads 4.
7 is placed and pressurized. Then, the infrared beam 18 is irradiated and scanned from above the quartz plate 17, and the preliminary solder 15 is
(Figures 1 and 2). Then, terminal 10
and external leads 14 are connected via solder 15. At this time, the excess solder 15 is removed from the terminal 10 and the external lead 14.
The parts of the terminals that do not face each other get wet and are held by surface tension, so that they do not protrude between the adjacent terminals io and io, and no short circuit occurs (FIG. 3).

To explain more specifically, for example, the width of the terminal 10 and the external lead 140 is 0.4 rm, and the pitch of each is 0.
．． 8 tm, the thickness of the preliminary solder 15 formed on the external lead 14 is set to 20 to 40 μm, and the deviation dimension t between the terminal 10 and the external lead 14 is set to 0.1 to 0.15 points, the terminal 1
Out of 160 leads and external leads 14, there were no defects at any point, and there were also no open defects due to soldering defects.

On the other hand, when the same conditions as above are used except that the deviation dimension t of the terminal 10 and external lead 14 is set to 0, 5 to 10
Seat defects occurred in several places.

FIG. 4 shows an enlarged plan view of the main part of the second embodiment, and FIG. 5 shows a sectional view corresponding to the line B--B in FIG. 4. In this embodiment, the width of the outer lead 14 is made smaller than the width of the terminal 10, and portions not facing the outer lead 14 are provided on both sides of the terminal 10.

Further, as a modification of this example, the terminal 10 and one end of the external lead 14 may be aligned, and a portion not facing the external lead 14 may be provided only on one side of the terminal 10.

r'jl, FIG. 6 shows an enlarged plan view of the main part of the third embodiment, and FIG. 7 shows a sectional view corresponding to the line CC in FIG. 6.

In this embodiment, the external lead 14 has the same width as the terminal lO,
The terminal 10 and the external lead 140 are both formed to be inclined at a predetermined angle with respect to the terminal 10, and have two portions each that do not face the other party.

Effects of the Invention According to the present invention, since the terminal and the external lead are overlapped and soldered with some portions not facing each other, even if the preliminary solder is thick, the excess solder will not be absorbed by the terminal. And/or it is wetted and held in the part of the external lead that does not face the other party, and does not protrude between the terminals, so the terminal and external lead can be reliably soldered, and furthermore, a sheet occurs between adjacent terminals. Highly reliable soldering is possible.

[Brief explanation of the drawing]

1 to 3 are enlarged sectional views of essential parts at each stage of the first embodiment when the present invention is applied to soldering between the terminal of a thin film EL panel and the external lead of a flexible lead.
FIG. 1 is an exploded sectional view before soldering, FIG. 2 is a sectional view before soldering, and FIG. 3 is a sectional view after soldering. FIG. 4 is an enlarged plan view of essential parts for explaining a second embodiment of the present invention, and FIG. 5 is a sectional view taken along line B--B in FIG. 4. FIG. 6 is an enlarged plan view of essential parts for explaining an eighth embodiment of the present invention, and FIG. 7 is a sectional view taken along line CC in FIG. 6. Figure 8 shows a thin film KL with flexible leads connected to the terminals.
In the cross-sectional view of the panel, the left half shows a cross-section in the X direction, the right half shows a cross-section in the Y direction orthogonal to the X direction, and FIG. 9 is an enlarged cross-sectional view of the main part along line A-A in FIG. 8. It is. FIG. 1O is an enlarged exploded sectional view of the main part before soldering by the conventional method, and FIG. 11 is an enlarged sectional view of the main part after soldering. 1...Insulating substrate (glass substrate), 4...Flexible pull lead, 5...・・・・・・・・・Transparent electrode,
9...... Back electrode, 10...
・・・・・・・・・Terminal, 14・・・・・・External lead, 15・・・・・・(Spare) solder, 16・・・・・・
...stand, 17...quartz plate, 18...infrared beam. Soldering (1←Electronic Wholesale≠Short 9 Plow I! [IG Figure 1 Figure 2) ←- c! 14-I

Claims (1)

[Claims] The external part of the flexible lead includes a large number of terminals formed along the periphery of an insulating substrate and a large number of external leads formed at the same pitch as the terminals along the periphery of the insulating film. In a device in which the terminal and the external lead are overlapped via preliminary solder and soldered using external infrared heating, the terminal and the external lead are overlapped with a part that does not face each other and soldered. A method for connecting multi-terminal leads featuring: