JPS59201085A - Driving circuit element packaging structure for flat displaypanel - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (al) Technical Field of the Invention The present invention relates to a driving circuit element mounting structure of a flat display panel, and in particular, to a mounting structure of a drive circuit element for a flat panel display panel, and in particular to a structure in which a panel driving circuit element is mounted directly on a display electrode terminal portion of a display panel. This invention relates to an actual device structure that can be connected and arranged by soldering.

(bl Background of the Technology) Conventionally, in flat display panel devices that utilize electroluminescence (EL), ? The conventional display panel devices tend to be large in size, and the thin structure unique to flat display panel devices is insufficient. Therefore, in order to realize a thin flat display panel device, a display panel with a compact structure was proposed in which, for example, circuit elements for driving the panel were mounted directly on the display electrode terminals of the display panel. ing.

(C) Problems with the Prior Art However, when the panel driving circuit elements are directly mounted on the display electrode terminal part of the display panel as described above, for example, each element mounting part of the display electrode terminal part of the display panel A solder paste is applied in advance in a predetermined terminal pattern to form a solder layer. Next, panel driving circuit elements each having a connection terminal on the back side are arranged on each element mounting part of the display electrode terminal part, and the display panel is heated to several hundred degrees or passed through it. Furthermore, soldering is carried out by placing the display panel on a heating jig plate heated to several hundred degrees and heating the entire display panel on which the circuit elements are arranged, or by a flow soldering method or the like.

However, such a mounting method has the disadvantage that it requires equipment such as a fairly large glue flow solder device, and also requires a long time for one reflow process. Also, depending on the type of display panel (such as a liquid crystal display panel), it may not be possible to heat the entire display panel to several hundred degrees, so it is possible to easily heat the panel drive circuit by flow soldering without heating the entire display panel. There has been a need for a mounting structure that allows devices to be easily mounted on display electrode terminals of a display panel.

(di) Purpose of the Invention The present invention has been made in view of the above-mentioned drawbacks of the conventional art.The present invention has been made in view of the above-mentioned drawbacks of the conventional art. The object of the present invention is to provide a novel drive circuit element mounting structure for a flat display panel that can be mounted by soldering.

(e) Structure and object of the invention According to the present invention, a panel drive circuit element is mounted by soldering at the element mounting position of a plurality of display electrode terminal parts led out and arranged on a panel component substrate that constitutes a display part. In the mounting structure, a resistive heating element is disposed below the element mounting part of the electrode terminal part on the panel component board via an insulating layer, and the resistive heating element heats the element mounting part of the electrode terminal part. This is achieved by providing a drive circuit element mounting structure for a flat display panel, characterized in that the panel drive circuit element is connected and arranged to the element mounting portion by soldering.

(fl Embodiments of the Invention Below, embodiments of the present invention will be described in detail with reference to the drawings.

FIGS. 1 and 2 are perspective views sequentially illustrating an embodiment in which the present invention is applied to an EL display panel. First, in Fig. 1, ■ indicates that a plurality of linear back electrodes consisting of a plurality of electrodes are arranged in parallel on an insulating substrate made of a ceramic substrate, a glazed ceramic substrate, a glass substrate, etc., and a dielectric layer is placed on top of the linear back electrodes. An EL light-emitting layer is formed through the layer, and on the EL light-emitting layer, a plurality of linear transparent electrodes made of In-3n oxide, etc. are arranged in parallel in a form orthogonal to the back electrode. This is a panel component substrate in which an EL display section 2 is arranged, and a three-light protective cover is hermetically sealed on the EL multilayer structure. Further, on, for example, the peripheral edge portion 3 of the panel component substrate 1, terminal portions 4 of the respective electrodes are arranged in a lead-out manner. Further, on the lower side of the peripheral edge 3 of the panel component substrate 1 having each of the electrode terminal portions 4, if the insulating substrate is made of ceramic, for example, a thin dotted line is shown through an insulating thin plate layer 5 made of ceramic material. A resistance heating element 6 made of tungsten (W) or the like is provided. (If the insulating substrate is glass, a resistive heating film such as indium tin oxide ('ITO) may be placed through an insulating layer such as AI, 03, etc.) Each electrode terminal portion 4 to be connected to the panel drive circuit element 7 disposed through the insulating thin plate layer 5 is heated to a predetermined temperature.

However, in order to directly mount the circuit elements 7 for driving the panel as shown in FIG. A plurality of electrode terminal portions 4 are arranged on the portion 3.
Solder paste is applied in advance on each element mounting connection pad 4a by a printing method or the like, as in the prior art. Next, on the element mounting connection pad 4a, a panel driving circuit element 7, specifically a panel driving circuit chip is built into a ceramic package (a pointed carrier may be used),
Further, a panel driving circuit element 7 having a connecting terminal 7a arranged in a shape corresponding to the element mounting connection pad 4a of each electrode terminal part 4 is aligned and arranged on the lower surface thereof. In this arrangement, a predetermined voltage is applied to the heating terminals 6a, 6b of the resistance heating element 6 to heat the resistance heating element 6.

In this way, each electrode terminal portion 4 on which the panel driving circuit element 7 is arranged is heated to a predetermined temperature in a very short time,
The solder applied to each element mounting connection pad 4a is melted, and the panel driving circuit element 7 is easily soldered to each electrode terminal portion 4, and can be easily mounted.

In the above embodiment, a resistance heating element 6 made of tungsten (W) or the like is disposed under the peripheral edge 3 of the panel component substrate 1 having the electrode terminal portion 4 via the insulating thin plate layer 5. Although explained in the example, the resistance heating elements may be separately arranged under each electrode terminal part 4 of the peripheral part 3 of the panel component substrate 1 with the insulating thin plate layer 5 interposed therebetween. In addition, the present invention
Although an example in which the present invention is applied to a display panel has been described, the present invention is not limited to this example. Needless to say, this can also be applied to implementation. In particular, since the entire display panel is not exposed to reflow solder temperature when mounting the drive circuit elements, extremely excellent effects can be obtained when applied to directly mounting panel drive circuit elements on a liquid crystal display panel or the like.

Furthermore, similar effects can be obtained even when the present invention is applied to mounting a panel driving circuit element on a flat display panel or the like in which each electrode terminal portion is disposed on the back side of the panel.

(g) Effects of the Invention As is clear from the above explanation, according to the drive circuit element mounting structure of the flat display panel according to the present invention, the panel drive circuit element for each electrode terminal portion of various flat display panels can be mounted. The soldering process requires a large-scale process such as a heating furnace, etc.
Without using a soldering device, positioning and soldering can be performed reliably in an extremely short period of time, making it easy to mount. Further, it has the advantage that the mounted element can be easily removed. Therefore, a highly reliable mounting structure can be provided at low cost, and has excellent practical effects.

[Brief explanation of the drawing]

FIGS. 1 and 2 are schematic perspective views sequentially illustrating an embodiment in which the present invention is applied to an EL display panel. In the drawings, 1 is a panel component board, 2 is an EL display section,
3 is the peripheral edge of the panel component board, 4 is the electrode terminal portion, 4a is the element mounting connection band, 5 is the insulating thin plate layer, 6 is the resistance heating element,
6a and 6b are heating terminals of the resistance heating elements, 7 is a panel drive circuit element, and 7a is a connection terminal of the panel drive circuit element 7.

Claims (1)

[Claims] In a structure in which a panel driving circuit element is mounted by soldering at the element mounting position of a plurality of display electrode terminal parts led out and arranged on a panel constituent substrate forming a display section, the electrode terminal parts on the panel constituent substrate are mounted. A resistance heating element is disposed below the element mounting part through an insulating layer, and the element mounting part of the electrode terminal part is heated by the resistance heating element, and the panel drive 1 circuit element is attached to the element mounting part. A driving circuit element mounting configuration for a flat display panel, characterized in that the following are connected and arranged by soldering &J.