JPS59178678U

JPS59178678U - display device

Info

Publication number: JPS59178678U
Application number: JP7224383U
Authority: JP
Inventors: 博吉野
Original assignee: 三洋電機株式会社; 東京三洋電機株式会社
Priority date: 1983-05-13
Filing date: 1983-05-13
Publication date: 1984-11-29

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図は、本考案に用いられる薄型回路基板を作る方法
を示す平面図、第２図は、本考案の実施例を示す断面図
で、ある。１・・・フィルム状絶縁基板、２・・・貫通孔、３・・
・支持部、４・・・薄型回路基板、５・・・導電路、６
・・・リード、７・・・半導体素子、８・・・上部ガラ
ス基板、９・・・下部ガラス基板、１０・・・スペーサ
、１１・・・液晶、１２・・・偏光板、１３・・・偏光
反射板、１４．１５・・・透明電極、１６・・・電極、
１７・・・半田。FIG. 1 is a plan view showing a method of manufacturing a thin circuit board used in the present invention, and FIG. 2 is a sectional view showing an embodiment of the present invention. 1... Film-like insulating substrate, 2... Through hole, 3...
- Support part, 4... Thin circuit board, 5... Conductive path, 6
...Lead, 7...Semiconductor element, 8...Upper glass substrate, 9...Lower glass substrate, 10...Spacer, 11...Liquid crystal, 12...Polarizing plate, 13...・Polarizing reflector, 14.15...transparent electrode, 16...electrode,
17...Solder.

Claims

[Scope of utility model registration request]

A display panel in which a light-receiving display material is sandwiched between an upper glass substrate and a lower glass substrate, and an electrode is led out to a protruding portion of the upper glass substrate, and an insulating substrate with a thickness of 0.3 mm or less is coated with copper foil. A thin circuit board on which a plurality of conductive paths and a plurality of leads protruding from the side edges of the insulating substrate are formed by etching, and on which semiconductor elements or electronic components for driving the display panel are fixed; placing the thin circuit board on the back side of the display panel;
A display device characterized in that the plurality of leads are soldered or bonded with a conductive adhesive to electrodes led out from the protruding portion of the upper glass substrate.