JPS5846451Y2 - LCD panel - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a liquid crystal panel mounting a semiconductor device manufactured by a film carrier method.

The purpose of the present invention is to make the connection mounting structure between a semiconductor device manufactured by the film carrier method and a liquid crystal panel as thin as possible, and to make it smaller, and to increase the connection reliability, so that the mounting structure of the semiconductor device manufactured by the film carrier method can be realized. The aim is to increase the range of applications of

To connect a semiconductor device manufactured by the conventional film carrier method to a liquid crystal panel, generally, the semiconductor device is first connected to a circuit board, and then the liquid crystal panel and the circuit board are connected by soldering or using known connections such as springs. These methods require a large amount of space, both three-dimensionally and two-dimensionally, and require high material costs. It reminds me of the past.

The present invention eliminates such drawbacks and takes advantage of the advantages of thinness and small size, which are characteristics of semiconductor devices manufactured by film carrier orientation.

Next, explanation will be given based on the figures.

What is shown in FIG. 1 is a part of the liquid crystal panel viewed from the back, and 1 is mainly made of glass.

A thin film electrode 2 is formed on the glass.

Further, a gold-palladium electrode 3 is formed by printing on the thin film electrode 2, and a -.--under electrode 4 is also formed by printing so as to partially overlap the gold-palladium electrode 3.

The gold-palladium electrode 3 may be omitted, or if the circuit configuration causes problems if the input impedance is high,
It is necessary to use it.

The gold-palladium electrode 3 may have its terminal end aligned with the thin film electrode 2 as shown in FIG. 1, or may be misaligned as shown in FIG.

FIG. 3 is a back view showing a liquid crystal panel integrated with a semiconductor device, which is manufactured by a film carrier method, and has external lead terminals of metal foil electrodes 6 on a flexible insulating substrate 5. 7 is entirely supported by a flexible insulating substrate 5.

The external lead terminal 7 and the solder electrode 4 are connected by reflowing the solder electrode 4.

Also, if the conductor electrode 4 is not used, the gold-palladium electrode 3 will be exposed on the surface, so to connect it to the external lead terminal 7, apply a conductive adhesive to either of them in advance and dry and harden it after alignment. let

Furthermore, using the tin plated on the external lead terminal 7, gold paste is printed instead of the gold-palladium electrode 3, and the external lead terminal 7 is bonded to it, and alignment is achieved by applying heat and pressure. It is also possible to create a gold-tin eutectic alloy on the surface and bond it.

FIG. 4 is a sectional view of FIG. 3.

As mentioned above, in the present invention, a semiconductor substrate is placed directly on a liquid crystal panel, and a metal foil electrode on a flexible insulating substrate is bonded to a thin film electrode on a glass substrate using a solder or conductive adhesive. This has the effect that the connection part can be made thinner than the conventional connection with conductive rubber, and the connection is reliable, increasing the reliability of the connection part.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing the liquid crystal panel of the present invention from the back side. FIG. 2 shows a cross-sectional view of the electrode. FIG. 3 shows a view of the back side of the liquid crystal panel. FIG. 4 shows a cross-sectional view of FIG. 3. FIG. 5 is a diagram showing another embodiment of the present invention. 1...Glass, 2...Thin film electrode, 4...
. . . conductor electrode, 5 . . . flexible insulating substrate, 6 . . . metal foil thin film, 7 . . . external lead terminal.

Claims (1)

[Scope of utility model registration request] In a liquid crystal panel in which liquid crystal is sealed in upper and lower glass substrates, a carrier film electrode is formed on one of the upper and lower glass substrates, and a semiconductor device having a flexible insulating substrate is placed directly on the substrate. The metal foil electrode on the flexible insulating substrate is bonded to the thin film electrode by a conductive adhesive or a conductive adhesive.