JPS59198486A - Flat display panel - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] (n) Technical Field of the Invention The present invention relates to a flat display panel, and in particular to mounting circuit elements for driving the panel directly on the display electrode terminal portion of the display panel by simply soldering. The present invention relates to a flat display panel that can be used.

(bl Technology background) Conventionally, flat display panel devices using electroluminescence (EL), liquid crystal, discharge gas, etc.
A display panel and a circuit for driving the panel are arranged separately, and the two are interconnected by a flexible cable or the like. For this reason, such conventional display panel devices tend to be large-sized, and the "thin structure" peculiar to flat display panel devices cannot be fully utilized. Therefore, in order to realize a thin flat display panel device, a display panel with a compact structure has been proposed in which, for example, a circuit element for driving the panel is mounted directly on the display electrode terminal 74B of the display panel.

(C) Problems with the Prior Art However, when a panel driving circuit element is directly mounted on the display electrode terminal portion of the display panel as described above, for example, a predetermined terminal is attached to each element mounting portion of the display electrode terminal portion of the display panel. Apply half E [1 paste in the pattern and create a solder layer. Next, a circuit element for the panel drive J is arranged in each element mounting part of the display electrode terminal section No. 1111, and the display panel is passed through a heating furnace heated to several hundred degrees, or heated to a similar temperature of several hundred degrees. The entire display panel, on which the circuit elements are placed on a jig plate, is mounted by heating or by soldering using a flow solder method or the like.

However, such a mounting method requires relatively large equipment such as a glue flow-solder device and has the disadvantage that one reflow process takes a long time. Also, depending on the type of display panel (such as a liquid crystal display panel), it may not be possible to heat the entire display panel to several hundred degrees. There is a need for a mounting structure that allows circuit elements to be easily mounted on display electrode terminals of a display panel.

(d) Purpose of the Invention The present invention has been made in view of the above-mentioned drawbacks of the conventional art.
The object of the present invention is to provide a novel flat display panel that can be easily soldered and mounted using a partial heating means with high thermal efficiency.

te+ Structure and object of the invention According to the invention, a panel drive circuit chip is built in the element mounting position of a plurality of display electrode terminal parts led out and arranged on an insulating substrate constituting a display panel,
Further, a driving circuit element having a heating element for solder fusion attached to the lower surface part is associated with the element, and the solder connection is made by heating the element mounting position of the electrode terminal part with the heating element for solder fusion. This is achieved by providing a flat display panel that

(f) Embodiments of the invention Embodiments of the invention will be described in detail below with reference to the drawings.

FIG. 1 is a perspective view conceptually showing an embodiment in which the present invention is applied to an EL display panel, FIG. 2 is a schematic configuration diagram of a drive circuit element shown in FIG. FIG. 3 is a schematic partially enlarged perspective view illustrating an embodiment of the mounting structure of the drive circuit element shown in FIG. 1, which is provided with a heating element for solder fusion. First, in FIG. 1, ■ is a panel substrate made of a ceramic substrate, a glazed ceramic substrate, a glass substrate, etc.
A plurality of In-5n oxides, etc. are arranged in parallel, and an EL light-emitting layer is formed thereon via a dielectric layer, and a plurality of In-5n oxides, etc. This is an EL display section in which linear transparent electrodes consisting of are arranged in parallel in a manner orthogonal to the back electrode, and a transparent protective cover is hermetically sealed on the EL multilayer structure. At the peripheral edge of the panel substrate 1, the terminal portions 3 of the respective electrodes are arranged in a lead-out manner. When the circuit elements 4 for driving the panel are directly mounted on the electrode terminal portions 3 of the IEL display panel as shown in the figure, in the present invention, as shown in the partially enlarged perspective view of FIG. First, solder paste is applied in advance to each element mounting connection pad 3a of each of the plurality of electrode terminal portions 3 arranged on the peripheral edge of the panel substrate 1 by a printing method or the like. Next, a ceramic package 4b (a 1,000-tube carrier may be used) is placed on the element mounting connection band 3a, in which a panel driving circuit element 4, specifically, a panel driving circuit tip 4a is built in as shown in FIG. ) A panel drive circuit is provided with a heat-generating ceramic substrate 4d for soldering, which is provided with a resistance heating element 4c such as Kungste/(W) or a resistance heating film made of indium/tin oxide, etc. on the lower surface of the panel drive circuit. The elements 4 are arranged facing each other. Then, a predetermined voltage is applied to the heating element terminal 4e of the panel drive circuit element 4 to cause the resistance heating element 4c to generate heat. In this way, the lower surface of the panel driving circuit element 4 is heated, and the solder applied to each element mounting connection pad 3a of each of the opposing electrode terminal parts 3 is heated and melted in an extremely short time, and each electrode terminal The panel driving circuit element 4 can be easily soldered to the portion 3 and can be easily mounted.

Although the above embodiment describes an example in which the present invention is applied to an EL display panel, the present invention is not limited to this because the entire display panel is not exposed to reflow solder temperature when circuit elements are mounted. For example, when applied to a structure in which a panel driving circuit element is directly mounted on a flat liquid crystal display panel or the like, extremely excellent effects can be obtained.

Further, the same effect can be obtained even when the present invention is applied to mounting a panel driving circuit element on a flat display panel in which each electrode terminal portion is disposed on the back side of the panel.

(g) Effects of the Invention As is clear from the explanation in section 2, according to the flat display panel according to the present invention, soldering of panel driving circuit elements to each electrode terminal portion of various flat display panels can be performed without any mounting process. but,
This method has the advantage that partial heating can be performed extremely easily and reliably in a short time without using a flow soldering device such as a heating furnace, which can cause a large amount of damage, and that the mounted element can be easily removed. Therefore, a highly reliable mounting structure can be realized at low cost, and its practical effects are significant.

[Brief explanation of the drawing]

FIG. 1 is a perspective view conceptually showing an embodiment in which the present invention is applied to an EL display panel, FIG. 2 is a schematic configuration diagram of a drive circuit element shown in FIG. FIG. 3 is a schematic partially enlarged perspective view illustrating an embodiment of the mounting structure of the drive circuit element shown in FIG. 1, which is provided with a heating element for solder fusion.

Claims (1)

[Claims] A drive circuit in which a panel drive circuit chip is built-in at the element mounting position of a plurality of display electrode terminals led out and arranged on an insulating substrate constituting a display panel, and a heating element for solder fusion is provided on the bottom surface. By matching the elements, the half-ETIFfA
! 1. A flat display panel characterized in that solder connection is performed by heating the element mounting position of the electrode terminal portion with a wearable heating element.