JPS6234452Y2 - - Google Patents

Info

Publication number
JPS6234452Y2
JPS6234452Y2 JP1982064248U JP6424882U JPS6234452Y2 JP S6234452 Y2 JPS6234452 Y2 JP S6234452Y2 JP 1982064248 U JP1982064248 U JP 1982064248U JP 6424882 U JP6424882 U JP 6424882U JP S6234452 Y2 JPS6234452 Y2 JP S6234452Y2
Authority
JP
Japan
Prior art keywords
lead frame
semiconductor device
pellet
metal
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982064248U
Other languages
English (en)
Japanese (ja)
Other versions
JPS58166051U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1982064248U priority Critical patent/JPS58166051U/ja
Publication of JPS58166051U publication Critical patent/JPS58166051U/ja
Application granted granted Critical
Publication of JPS6234452Y2 publication Critical patent/JPS6234452Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1982064248U 1982-04-30 1982-04-30 半導体装置 Granted JPS58166051U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982064248U JPS58166051U (ja) 1982-04-30 1982-04-30 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982064248U JPS58166051U (ja) 1982-04-30 1982-04-30 半導体装置

Publications (2)

Publication Number Publication Date
JPS58166051U JPS58166051U (ja) 1983-11-05
JPS6234452Y2 true JPS6234452Y2 (enExample) 1987-09-02

Family

ID=30074288

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982064248U Granted JPS58166051U (ja) 1982-04-30 1982-04-30 半導体装置

Country Status (1)

Country Link
JP (1) JPS58166051U (enExample)

Also Published As

Publication number Publication date
JPS58166051U (ja) 1983-11-05

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