JPH041502B2 - - Google Patents

Info

Publication number
JPH041502B2
JPH041502B2 JP58132002A JP13200283A JPH041502B2 JP H041502 B2 JPH041502 B2 JP H041502B2 JP 58132002 A JP58132002 A JP 58132002A JP 13200283 A JP13200283 A JP 13200283A JP H041502 B2 JPH041502 B2 JP H041502B2
Authority
JP
Japan
Prior art keywords
heat sink
lead frame
semiconductor element
mounting
insulated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58132002A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6025261A (ja
Inventor
Shinjiro Kojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP58132002A priority Critical patent/JPS6025261A/ja
Publication of JPS6025261A publication Critical patent/JPS6025261A/ja
Publication of JPH041502B2 publication Critical patent/JPH041502B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/427—
    • H10W40/255—
    • H10W40/778—
    • H10W70/6875—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/5449—
    • H10W72/884—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP58132002A 1983-07-21 1983-07-21 半導体装置 Granted JPS6025261A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58132002A JPS6025261A (ja) 1983-07-21 1983-07-21 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58132002A JPS6025261A (ja) 1983-07-21 1983-07-21 半導体装置

Publications (2)

Publication Number Publication Date
JPS6025261A JPS6025261A (ja) 1985-02-08
JPH041502B2 true JPH041502B2 (enExample) 1992-01-13

Family

ID=15071253

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58132002A Granted JPS6025261A (ja) 1983-07-21 1983-07-21 半導体装置

Country Status (1)

Country Link
JP (1) JPS6025261A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8048714B2 (en) * 2006-08-11 2011-11-01 Vishay General Semiconductor Llc Semiconductor device and method for manufacturing a semiconductor device having improved heat dissipation capabilities

Also Published As

Publication number Publication date
JPS6025261A (ja) 1985-02-08

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