JPS6025261A - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS6025261A JPS6025261A JP58132002A JP13200283A JPS6025261A JP S6025261 A JPS6025261 A JP S6025261A JP 58132002 A JP58132002 A JP 58132002A JP 13200283 A JP13200283 A JP 13200283A JP S6025261 A JPS6025261 A JP S6025261A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- semiconductor device
- semiconductor element
- lead frame
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W70/427—
-
- H10W40/255—
-
- H10W40/778—
-
- H10W70/6875—
-
- H10W72/07551—
-
- H10W72/50—
-
- H10W72/5449—
-
- H10W72/884—
-
- H10W74/00—
-
- H10W90/756—
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58132002A JPS6025261A (ja) | 1983-07-21 | 1983-07-21 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58132002A JPS6025261A (ja) | 1983-07-21 | 1983-07-21 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6025261A true JPS6025261A (ja) | 1985-02-08 |
| JPH041502B2 JPH041502B2 (enExample) | 1992-01-13 |
Family
ID=15071253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58132002A Granted JPS6025261A (ja) | 1983-07-21 | 1983-07-21 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6025261A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010514146A (ja) * | 2006-08-11 | 2010-04-30 | ヴィシャイ ジェネラル セミコンダクター エルエルシー | 半導体装置及び放熱能力を向上させた半導体装置の製造方法 |
-
1983
- 1983-07-21 JP JP58132002A patent/JPS6025261A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010514146A (ja) * | 2006-08-11 | 2010-04-30 | ヴィシャイ ジェネラル セミコンダクター エルエルシー | 半導体装置及び放熱能力を向上させた半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH041502B2 (enExample) | 1992-01-13 |
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