JPS6233736B2 - - Google Patents

Info

Publication number
JPS6233736B2
JPS6233736B2 JP58003143A JP314383A JPS6233736B2 JP S6233736 B2 JPS6233736 B2 JP S6233736B2 JP 58003143 A JP58003143 A JP 58003143A JP 314383 A JP314383 A JP 314383A JP S6233736 B2 JPS6233736 B2 JP S6233736B2
Authority
JP
Japan
Prior art keywords
processing liquid
photoresist
semiconductor wafer
wafer
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58003143A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59126633A (ja
Inventor
Osamu Takahata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP58003143A priority Critical patent/JPS59126633A/ja
Publication of JPS59126633A publication Critical patent/JPS59126633A/ja
Publication of JPS6233736B2 publication Critical patent/JPS6233736B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • ing And Chemical Polishing (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP58003143A 1983-01-10 1983-01-10 半導体ウエ−ハの処理装置 Granted JPS59126633A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58003143A JPS59126633A (ja) 1983-01-10 1983-01-10 半導体ウエ−ハの処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58003143A JPS59126633A (ja) 1983-01-10 1983-01-10 半導体ウエ−ハの処理装置

Publications (2)

Publication Number Publication Date
JPS59126633A JPS59126633A (ja) 1984-07-21
JPS6233736B2 true JPS6233736B2 (enExample) 1987-07-22

Family

ID=11549129

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58003143A Granted JPS59126633A (ja) 1983-01-10 1983-01-10 半導体ウエ−ハの処理装置

Country Status (1)

Country Link
JP (1) JPS59126633A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6165435A (ja) * 1984-09-07 1986-04-04 Dainippon Screen Mfg Co Ltd 基板表面処理方法および装置
JPS61160930A (ja) * 1985-01-09 1986-07-21 Dainippon Screen Mfg Co Ltd 基板の表面処理液供給方法
JPH073474A (ja) * 1987-10-31 1995-01-06 Dainippon Screen Mfg Co Ltd 基板の表面処理方法及び装置
JPH01170023A (ja) * 1987-12-25 1989-07-05 Casio Comput Co Ltd フォトレジスト現像装置
JP2926946B2 (ja) * 1990-09-20 1999-07-28 日立電線株式会社 エッチング用スプレーノズル

Also Published As

Publication number Publication date
JPS59126633A (ja) 1984-07-21

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