JPS6230349U - - Google Patents
Info
- Publication number
- JPS6230349U JPS6230349U JP1985122918U JP12291885U JPS6230349U JP S6230349 U JPS6230349 U JP S6230349U JP 1985122918 U JP1985122918 U JP 1985122918U JP 12291885 U JP12291885 U JP 12291885U JP S6230349 U JPS6230349 U JP S6230349U
- Authority
- JP
- Japan
- Prior art keywords
- dielectric substrate
- metal base
- fixed
- base block
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 230000005669 field effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985122918U JPS6230349U (et) | 1985-08-07 | 1985-08-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985122918U JPS6230349U (et) | 1985-08-07 | 1985-08-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6230349U true JPS6230349U (et) | 1987-02-24 |
Family
ID=31013555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985122918U Pending JPS6230349U (et) | 1985-08-07 | 1985-08-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6230349U (et) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01138820A (ja) * | 1987-11-26 | 1989-05-31 | Matsushita Electric Works Ltd | ワイヤレス発信器 |
| JPH01138819A (ja) * | 1987-11-26 | 1989-05-31 | Matsushita Electric Works Ltd | ワイヤレス発信器 |
-
1985
- 1985-08-07 JP JP1985122918U patent/JPS6230349U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01138820A (ja) * | 1987-11-26 | 1989-05-31 | Matsushita Electric Works Ltd | ワイヤレス発信器 |
| JPH01138819A (ja) * | 1987-11-26 | 1989-05-31 | Matsushita Electric Works Ltd | ワイヤレス発信器 |
| JPH0524688B2 (et) * | 1987-11-26 | 1993-04-08 | Matsushita Electric Works Ltd |
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