JPS6230349U - - Google Patents

Info

Publication number
JPS6230349U
JPS6230349U JP1985122918U JP12291885U JPS6230349U JP S6230349 U JPS6230349 U JP S6230349U JP 1985122918 U JP1985122918 U JP 1985122918U JP 12291885 U JP12291885 U JP 12291885U JP S6230349 U JPS6230349 U JP S6230349U
Authority
JP
Japan
Prior art keywords
dielectric substrate
metal base
fixed
base block
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985122918U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985122918U priority Critical patent/JPS6230349U/ja
Publication of JPS6230349U publication Critical patent/JPS6230349U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図はこの考案による半導体装置の一実施例
を示す断面図、第２図は従来の半導体装置の一例
を示す断面図である。 １…電界効果トランジスタ、２ａ…ゲート電極
、２ｂ…ソース電極、２ｃ…ドレイン電極、３…
半田、４…誘電体基板、５…金属基体ブロツク、
５―１…ソース電極部、６…隙間部。 FIG. 1 is a sectional view showing an embodiment of a semiconductor device according to this invention, and FIG. 2 is a sectional view showing an example of a conventional semiconductor device. DESCRIPTION OF SYMBOLS 1... Field effect transistor, 2a... Gate electrode, 2b... Source electrode, 2c... Drain electrode, 3...
solder, 4... dielectric substrate, 5... metal base block,
5- 1 ...Source electrode part, 6...Gap part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 金属基体ブロツク上に半導体素子の一つの電極
が固着され、かつ該金属基体ブロツクをはさんで
誘電体基板が配置固着され、該誘電体基板の表面
に入出力用金属化層が設けられていて、該金属化
層に前記半導体素子の他電極が固着されてなる半
導体装置において、前記金属基体ブロツクと前記
誘電体基板の間に隙間部を設けたことを特徴とす
る半導体装置。 One electrode of a semiconductor element is fixed on a metal base block, a dielectric substrate is placed and fixed across the metal base block, and an input/output metallized layer is provided on the surface of the dielectric substrate. . A semiconductor device in which another electrode of the semiconductor element is fixed to the metallized layer, characterized in that a gap is provided between the metal base block and the dielectric substrate.
JP1985122918U 1985-08-07 1985-08-07 Pending JPS6230349U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985122918U JPS6230349U (en) 1985-08-07 1985-08-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985122918U JPS6230349U (en) 1985-08-07 1985-08-07

Publications (1)

Publication Number Publication Date
JPS6230349U true JPS6230349U (en) 1987-02-24

Family

ID=31013555

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985122918U Pending JPS6230349U (en) 1985-08-07 1985-08-07

Country Status (1)

Country Link
JP (1) JPS6230349U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01138819A (en) * 1987-11-26 1989-05-31 Matsushita Electric Works Ltd Wireless transmitter
JPH01138820A (en) * 1987-11-26 1989-05-31 Matsushita Electric Works Ltd Wireless transmitter

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01138819A (en) * 1987-11-26 1989-05-31 Matsushita Electric Works Ltd Wireless transmitter
JPH01138820A (en) * 1987-11-26 1989-05-31 Matsushita Electric Works Ltd Wireless transmitter
JPH0524688B2 (en) * 1987-11-26 1993-04-08 Matsushita Electric Works Ltd

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