JPS62283635A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS62283635A
JPS62283635A JP61126642A JP12664286A JPS62283635A JP S62283635 A JPS62283635 A JP S62283635A JP 61126642 A JP61126642 A JP 61126642A JP 12664286 A JP12664286 A JP 12664286A JP S62283635 A JPS62283635 A JP S62283635A
Authority
JP
Japan
Prior art keywords
chip
wiring
head
bed
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61126642A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0478172B2 (enExample
Inventor
Yoshio Okada
芳夫 岡田
Noriaki Oba
大庭　憲明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Toshiba Electronic Device Solutions Corp
Original Assignee
Toshiba Corp
Toshiba Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Toshiba Microelectronics Corp filed Critical Toshiba Corp
Priority to JP61126642A priority Critical patent/JPS62283635A/ja
Publication of JPS62283635A publication Critical patent/JPS62283635A/ja
Publication of JPH0478172B2 publication Critical patent/JPH0478172B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Wire Bonding (AREA)
JP61126642A 1986-05-31 1986-05-31 半導体装置 Granted JPS62283635A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61126642A JPS62283635A (ja) 1986-05-31 1986-05-31 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61126642A JPS62283635A (ja) 1986-05-31 1986-05-31 半導体装置

Publications (2)

Publication Number Publication Date
JPS62283635A true JPS62283635A (ja) 1987-12-09
JPH0478172B2 JPH0478172B2 (enExample) 1992-12-10

Family

ID=14940252

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61126642A Granted JPS62283635A (ja) 1986-05-31 1986-05-31 半導体装置

Country Status (1)

Country Link
JP (1) JPS62283635A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0265337U (enExample) * 1988-11-07 1990-05-16
JPH0265340U (enExample) * 1988-11-07 1990-05-16

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6413805B1 (en) 1993-03-12 2002-07-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device forming method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54132273U (enExample) * 1978-03-03 1979-09-13

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54132273U (enExample) * 1978-03-03 1979-09-13

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0265337U (enExample) * 1988-11-07 1990-05-16
JPH0265340U (enExample) * 1988-11-07 1990-05-16

Also Published As

Publication number Publication date
JPH0478172B2 (enExample) 1992-12-10

Similar Documents

Publication Publication Date Title
KR940006187Y1 (ko) 반도체장치
JPS62283635A (ja) 半導体装置
JPH01124244A (ja) リードフレーム
JPS60154644A (ja) 半導体装置
JPS63136657A (ja) 両面実装電子回路ユニツト
JPH0763066B2 (ja) 半導体装置
JPS60200559A (ja) メモリモジュール
KR19990010762A (ko) 반도체 소자 패키지
JPH01111342A (ja) 集積回路用パッケージ
JPH01145842A (ja) 半導体装置
JPH05259374A (ja) 高密度実装配線基板およびその高密度実装方法
JPS58184735A (ja) 集積回路チツプ
JPH0350842A (ja) 半導体装置
JPS63244849A (ja) 半導体集積回路
JPH02180062A (ja) 半導体集積回路用パッケージ
JPH04260341A (ja) 半導体集積回路装置
JPH03222442A (ja) Ｉｃパッケージ
JPH04107846A (ja) 半導体装置
JPS59165440A (ja) 集積回路パツケ−ジ
JPS6217872B2 (enExample)
JPH01289276A (ja) 半導体装置
JPH01162355A (ja) 半導体装置のパッケージ
JPH09148545A (ja) 半導体装置
JPH0227758A (ja) 集積回路装置
JPS6119151A (ja) 半導体装置

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees