JPS622778Y2 - - Google Patents
Info
- Publication number
- JPS622778Y2 JPS622778Y2 JP1982175616U JP17561682U JPS622778Y2 JP S622778 Y2 JPS622778 Y2 JP S622778Y2 JP 1982175616 U JP1982175616 U JP 1982175616U JP 17561682 U JP17561682 U JP 17561682U JP S622778 Y2 JPS622778 Y2 JP S622778Y2
- Authority
- JP
- Japan
- Prior art keywords
- sealing layer
- thermal expansion
- substrate
- synthetic resin
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982175616U JPS5981040U (ja) | 1982-11-22 | 1982-11-22 | 混成集積回路 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982175616U JPS5981040U (ja) | 1982-11-22 | 1982-11-22 | 混成集積回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5981040U JPS5981040U (ja) | 1984-05-31 |
| JPS622778Y2 true JPS622778Y2 (enExample) | 1987-01-22 |
Family
ID=30382024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1982175616U Granted JPS5981040U (ja) | 1982-11-22 | 1982-11-22 | 混成集積回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5981040U (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2796043B2 (ja) * | 1993-07-30 | 1998-09-10 | 京セラ株式会社 | 電子部品 |
| JP2014116409A (ja) * | 2012-12-07 | 2014-06-26 | Denso Corp | 電子装置 |
-
1982
- 1982-11-22 JP JP1982175616U patent/JPS5981040U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5981040U (ja) | 1984-05-31 |
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