JPS62269826A - Float attracting method for semiconductor wafer - Google Patents
Float attracting method for semiconductor waferInfo
- Publication number
- JPS62269826A JPS62269826A JP61111048A JP11104886A JPS62269826A JP S62269826 A JPS62269826 A JP S62269826A JP 61111048 A JP61111048 A JP 61111048A JP 11104886 A JP11104886 A JP 11104886A JP S62269826 A JPS62269826 A JP S62269826A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- gas
- dust
- wafer
- jetted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 41
- 238000000034 method Methods 0.000 title claims description 10
- 235000012431 wafers Nutrition 0.000 claims description 35
- 238000001179 sorption measurement Methods 0.000 claims description 6
- 239000000428 dust Substances 0.000 abstract description 15
- 238000002347 injection Methods 0.000 abstract description 4
- 239000007924 injection Substances 0.000 abstract description 4
- 101100298225 Caenorhabditis elegans pot-2 gene Proteins 0.000 abstract 1
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Manipulator (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
Abstract
Description
【発明の詳細な説明】
３、発明の詳細な説明
産業上の利用分野
本発明は、半導体素子を形成するための半導体ウェハに
ダストを付着させずｌこ浮遊させ吸着搬送する方法に関
するものである。Detailed Description of the Invention 3. Detailed Description of the Invention Field of Industrial Application The present invention relates to a method for floating and adsorbing dust on a semiconductor wafer for forming semiconductor elements without adhering to it. .
従来の技術
半導体ウェハを非接触で吸着搬送する手段として第３図
に示した構造によるものがある。これは、気体を配管ノ
ズル９から、チャンバー１５に入れ、下部の垂直式噴射
口１２より、半導体ウェハ８に対して垂直に気体を噴射
する。噴射された気体は、半導体ウェハ８表面に突きあ
たった後、かさ状吸着部１３と半導体ウェハ８の微小な
すき間を通って、半導体ウェハ８周辺及びかさ状吸着部
にあけた穴、すなわち、気体排出口２に向かって流れる
。この時に、半導体ウエノＸ８をかさ状吸着部１３の方
向に吸引力が発生し、この発生した吸引力を用いて、半
導体ウェハ８を浮遊させ、吸着させるものである。2. Description of the Related Art There is a structure shown in FIG. 3 as a means for suctioning and transporting semiconductor wafers in a non-contact manner. In this process, gas is introduced into a chamber 15 through a piping nozzle 9, and the gas is injected perpendicularly to the semiconductor wafer 8 from a vertical injection port 12 at the bottom. After hitting the surface of the semiconductor wafer 8, the injected gas passes through a minute gap between the umbrella suction part 13 and the semiconductor wafer 8, and passes through the holes made around the semiconductor wafer 8 and in the umbrella suction part. It flows towards the outlet 2. At this time, a suction force is generated on the semiconductor wafer X8 in the direction of the umbrella-like suction portion 13, and the generated suction force is used to suspend and suction the semiconductor wafer 8.
発明が解決しようとする問題点
従来の方法では、５インチ半導体ウェハを吸着させるた
めには、６ ｋｇ ／ ｃｒ＃以上の高圧力気体を半導
体ウェハの表面にあてる必要があり、また半導体ウェハ
の表面に対して直接１こ気体があたるため、噴射気体中
および周辺雰囲気中のダストならびに吸着時のダスト巻
き上げにより、半導体ウェハに多数のダストが付着する
。Problems to be Solved by the Invention In the conventional method, in order to adsorb a 5-inch semiconductor wafer, it is necessary to apply high-pressure gas of 6 kg/cr# or more to the surface of the semiconductor wafer. Since the single gas directly hits the semiconductor wafer, a large amount of dust adheres to the semiconductor wafer due to dust in the injected gas and the surrounding atmosphere, and dust being stirred up during adsorption.
問題点を解決するための手段
本発明は、半導体ウェハを浮遊吸着して搬送するための
容器上部に設置した気体噴出ノズルを、半導体ウェハ表
面に対して水平に設け、かつ噴射する気体を半導体ウェ
ハに対して水平方向に送りだす半導体ウェハの浮遊吸着
方法である。Means for Solving the Problems The present invention provides a gas jet nozzle installed at the top of a container for floating and transporting semiconductor wafers, which is installed horizontally to the surface of the semiconductor wafer, and injects gas onto the semiconductor wafer. This is a floating adsorption method for semiconductor wafers that is sent out horizontally to the ground.
作用
本発明によると噴出させた気体が直接に半導体ウェハの
表面にあたらず、また、噴出圧力も１ ｋｇ／ ｃｎｆ
以下に低減できるため、噴射気体中および、周辺雰囲気
中のダストならびに吸着時のダスト巻き上げにより、半
導体ウェハにダストが付着することがない。According to the present invention, the ejected gas does not directly hit the surface of the semiconductor wafer, and the ejected pressure is also 1 kg/cnf.
Therefore, dust does not adhere to the semiconductor wafer due to dust in the injected gas, the surrounding atmosphere, and dust being stirred up during suction.
実施例
第１図に本発明の方法を用いた装置例の概略断面図を示
す。また、第２図にはその概略平面図を示した。以下に
本発明の方法による実施例を図を用いて説明する。Embodiment FIG. 1 shows a schematic sectional view of an example of an apparatus using the method of the present invention. Further, FIG. 2 shows a schematic plan view thereof. Examples of the method of the present invention will be described below with reference to the drawings.
本発明は、気体を配管用ノズル１からチャンバー４に入
れ、下部の水平用噴射口５より半導体ウェハ８の表面に
対して水平方向にテーバのついたかさ状吸着部６にあけ
た気体排出口２に向かって、気体を噴出させるように構
成されている。これにより気体を半導体ウェハ８の表面
に直接噴出することなく、両者の間に作られたすき間を
通って外部へ噴出することができ、従来の６ ｋｇ ／
ｃａに比べて１ ｋｇ ／ ｃ＋ｌｉと低い気体の噴
出圧力で半導体ウェハ８を浮遊吸着することができるた
め、ガス配管内のダスト、周囲雰囲気中に含まれている
ダスト、吸着時の巻き上げによるダストを全て防止する
ことができる。In the present invention, gas is introduced into a chamber 4 through a piping nozzle 1, and a gas discharge port is provided in a tapered umbrella-shaped suction portion 6 in a horizontal direction to the surface of a semiconductor wafer 8 through a horizontal injection port 5 at the bottom. It is configured to eject gas towards the 2. This allows the gas to be ejected to the outside through the gap created between the semiconductor wafer 8 without being ejected directly onto the surface of the semiconductor wafer 8.
Since the semiconductor wafer 8 can be floatingly adsorbed with a gas ejection pressure as low as 1 kg/c+li compared to ca, dust in the gas piping, dust contained in the surrounding atmosphere, and dust rolled up during adsorption can be removed. All can be prevented.
発明の効果
非接触で、半導体ウェハを浮遊吸着して搬送するための
容器上部に設置した気体噴出ノズルが、半導体ウェハ表
面に対して水平に設けられ、かつ、そのノズルから噴出
される気体が半導体ウェハに対して水平方向であること
により、半導体ウェハ表面に付着するダストを、大幅に
低減することが可能であり、さらに半導体ウェハ表面を
傷つけることなく浮遊吸着させ、半導体ウェハを搬送す
ることが 可能である。Effects of the Invention A gas jetting nozzle installed at the top of a container for floating and transporting semiconductor wafers in a non-contact manner is installed horizontally to the surface of the semiconductor wafer, and the gas jetted from the nozzle is By being oriented horizontally to the wafer, it is possible to significantly reduce dust adhering to the semiconductor wafer surface, and it is also possible to transport the semiconductor wafer by floating it and adsorbing it without damaging the semiconductor wafer surface. It is.
第１図は、本発明の半導体ウェハ浮遊吸着方法を用いた
装置の概略断面図、第２図は、本発明の半導体ウェハ浮
遊吸着方法を用いた装置の概略平面図、第３図は、従来
方法の概略断面図である。
１・・・・・・配管用ノズル、２・・・・・・気体排出
口、３・・・・・・固定用ビス、４・・・・・・チャン
バー、５・・・・・・水平用噴射口、６・・・・・・汲
ｖｙ、７・・・・・・０リング、８・・・・・・半導体
ウェハ。
代理人の氏名 弁理士 中尾敏男 ほか１名ｆ−−・力
乙管用ノスーＩし
２−−一にもゼｒ出口
３−−１芝厭」
４−−−４−〒７バー
Ｓ−一一水Ｊｆ−ｎＵａｈ口
δ−・す再（トウエ八−FIG. 1 is a schematic sectional view of an apparatus using the semiconductor wafer floating adsorption method of the present invention, FIG. 2 is a schematic plan view of an apparatus using the semiconductor wafer floating adsorption method of the invention, and FIG. 3 is a conventional 1 is a schematic cross-sectional view of the method; FIG. 1...Piping nozzle, 2...Gas outlet, 3...Fixing screw, 4...Chamber, 5...Horizontal injection port, 6... pump vy, 7... 0 ring, 8... semiconductor wafer. Name of agent: Patent attorney Toshio Nakao and one other person f--・Rikiotsukanyo nosu Ishi 2--One zero exit 3--1 Shibaai" 4----4-〒7 bar S-11 Water Jf-nUah mouth δ-・sure
Claims (1)
に設置した気体噴出ノズルが、半導体ウェハ表面に対し
て水平に設けられ、かつ、そのノズルから噴射される気
体が半導体ウェハに対して水平方向であることを特徴と
する半導体ウェハの浮遊吸着方法。A gas jet nozzle installed at the top of the container for floating and transporting the semiconductor wafer is installed horizontally to the surface of the semiconductor wafer, and the gas jetted from the nozzle is horizontally directed to the semiconductor wafer. A floating adsorption method for semiconductor wafers, characterized by the following.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61111048A JPS62269826A (en) | 1986-05-15 | 1986-05-15 | Float attracting method for semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61111048A JPS62269826A (en) | 1986-05-15 | 1986-05-15 | Float attracting method for semiconductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62269826A true JPS62269826A (en) | 1987-11-24 |
Family
ID=14551083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61111048A Pending JPS62269826A (en) | 1986-05-15 | 1986-05-15 | Float attracting method for semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62269826A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6095582A (en) * | 1998-03-11 | 2000-08-01 | Trusi Technologies, Llc | Article holders and holding methods |
| WO2005086225A1 (en) * | 2004-03-03 | 2005-09-15 | Izumi Akiyama | Non-contact holding device, and non-contact holding and conveying device |
| JP2009032980A (en) * | 2007-07-27 | 2009-02-12 | Ihi Corp | Non-contact carrying device |
| CN110052428A (en) * | 2019-04-29 | 2019-07-26 | 深圳市安思科电子科技有限公司 | A kind of chip sorting equipment for being conveniently replaceable suction nozzle with dedusting function |
| CN110335843A (en) * | 2019-04-16 | 2019-10-15 | 广州贤智科技有限公司 | A kind of dedusting cake core sorting device with voltage stabilizing function |
| JP2020044603A (en) * | 2018-09-18 | 2020-03-26 | 東洋自動機株式会社 | Article transfer method and article transfer device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5545390Y2 (en) * | 1975-05-21 | 1980-10-24 | ||
| JPS58215372A (en) * | 1982-06-10 | 1983-12-14 | Canon Inc | Protector for multi-stylus head |
-
1986
- 1986-05-15 JP JP61111048A patent/JPS62269826A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5545390Y2 (en) * | 1975-05-21 | 1980-10-24 | ||
| JPS58215372A (en) * | 1982-06-10 | 1983-12-14 | Canon Inc | Protector for multi-stylus head |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6095582A (en) * | 1998-03-11 | 2000-08-01 | Trusi Technologies, Llc | Article holders and holding methods |
| WO2005086225A1 (en) * | 2004-03-03 | 2005-09-15 | Izumi Akiyama | Non-contact holding device, and non-contact holding and conveying device |
| JP2005251948A (en) * | 2004-03-03 | 2005-09-15 | Izumi Akiyama | Non-contact holding device and non-contact holding/conveying device |
| CN100433288C (en) * | 2004-03-03 | 2008-11-12 | 秋山泉 | Non-contact holding device, and non-contact holding and conveying device |
| US7510226B2 (en) | 2004-03-03 | 2009-03-31 | Izumi Akiyama | Non-contact holder device and non-contact holding and conveying device |
| JP2009032980A (en) * | 2007-07-27 | 2009-02-12 | Ihi Corp | Non-contact carrying device |
| JP2020044603A (en) * | 2018-09-18 | 2020-03-26 | 東洋自動機株式会社 | Article transfer method and article transfer device |
| CN110335843A (en) * | 2019-04-16 | 2019-10-15 | 广州贤智科技有限公司 | A kind of dedusting cake core sorting device with voltage stabilizing function |
| CN110335843B (en) * | 2019-04-16 | 2021-06-18 | 济南科盛电子有限公司 | Dust removal type chip sorting equipment with voltage stabilizing function |
| CN110052428A (en) * | 2019-04-29 | 2019-07-26 | 深圳市安思科电子科技有限公司 | A kind of chip sorting equipment for being conveniently replaceable suction nozzle with dedusting function |
| CN110052428B (en) * | 2019-04-29 | 2021-11-12 | 智科博芯(北京)科技有限公司 | Chip sorting equipment with dust removal function and suction nozzle convenient to replace |
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