JPS6226197B2 - - Google Patents
Info
- Publication number
- JPS6226197B2 JPS6226197B2 JP54085766A JP8576679A JPS6226197B2 JP S6226197 B2 JPS6226197 B2 JP S6226197B2 JP 54085766 A JP54085766 A JP 54085766A JP 8576679 A JP8576679 A JP 8576679A JP S6226197 B2 JPS6226197 B2 JP S6226197B2
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- resin
- film
- resin laminate
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 25
- 239000002184 metal Substances 0.000 claims description 25
- 239000011888 foil Substances 0.000 claims description 22
- 229920005989 resin Polymers 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 19
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 6
- 229920005992 thermoplastic resin Polymers 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 9
- 238000010304 firing Methods 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8576679A JPS5610995A (en) | 1979-07-06 | 1979-07-06 | Method of forming circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8576679A JPS5610995A (en) | 1979-07-06 | 1979-07-06 | Method of forming circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5610995A JPS5610995A (en) | 1981-02-03 |
| JPS6226197B2 true JPS6226197B2 (it) | 1987-06-08 |
Family
ID=13867986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8576679A Granted JPS5610995A (en) | 1979-07-06 | 1979-07-06 | Method of forming circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5610995A (it) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57143556U (it) * | 1981-03-02 | 1982-09-09 | ||
| JPS611088A (ja) * | 1984-06-14 | 1986-01-07 | 松下電器産業株式会社 | 導電回路の形成法 |
| JPS62222604A (ja) * | 1987-02-03 | 1987-09-30 | アルプス電気株式会社 | 回路板の形成方法 |
| JPH02246395A (ja) * | 1989-03-20 | 1990-10-02 | Pfu Ltd | 三次元表面への配線パターンの形成方法 |
| KR930005013B1 (ko) * | 1990-03-16 | 1993-06-11 | 다이도 메탈 고오교오 가부시기가이샤 | 이분할 슬라이딩 베어링의 표면 처리방법 및 장치 |
-
1979
- 1979-07-06 JP JP8576679A patent/JPS5610995A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5610995A (en) | 1981-02-03 |
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