JPS6225518B2 - - Google Patents
Info
- Publication number
- JPS6225518B2 JPS6225518B2 JP56160906A JP16090681A JPS6225518B2 JP S6225518 B2 JPS6225518 B2 JP S6225518B2 JP 56160906 A JP56160906 A JP 56160906A JP 16090681 A JP16090681 A JP 16090681A JP S6225518 B2 JPS6225518 B2 JP S6225518B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- signal
- thermal head
- tape carrier
- pads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 239000010409 thin film Substances 0.000 claims description 2
- 239000010408 film Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Electronic Switches (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56160906A JPS5862076A (ja) | 1981-10-12 | 1981-10-12 | サ−マルヘツドの二層配線部の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56160906A JPS5862076A (ja) | 1981-10-12 | 1981-10-12 | サ−マルヘツドの二層配線部の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5862076A JPS5862076A (ja) | 1983-04-13 |
JPS6225518B2 true JPS6225518B2 (de) | 1987-06-03 |
Family
ID=15724888
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56160906A Granted JPS5862076A (ja) | 1981-10-12 | 1981-10-12 | サ−マルヘツドの二層配線部の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5862076A (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6034023A (ja) * | 1983-08-04 | 1985-02-21 | Oki Electric Ind Co Ltd | 半導体チップの基板への実装方法 |
JPS60143641A (ja) * | 1983-12-29 | 1985-07-29 | Konishiroku Photo Ind Co Ltd | 集積回路装置 |
-
1981
- 1981-10-12 JP JP56160906A patent/JPS5862076A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5862076A (ja) | 1983-04-13 |
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