JPS6225443A - 混成集積回路装置 - Google Patents

混成集積回路装置

Info

Publication number
JPS6225443A
JPS6225443A JP16400485A JP16400485A JPS6225443A JP S6225443 A JPS6225443 A JP S6225443A JP 16400485 A JP16400485 A JP 16400485A JP 16400485 A JP16400485 A JP 16400485A JP S6225443 A JPS6225443 A JP S6225443A
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
lead
lead terminals
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16400485A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0587020B2 (enrdf_load_stackoverflow
Inventor
Hideo Iwamoto
岩本　日出生
Mamoru Koseki
小関　護
Susumu Hibi
日比　進
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP16400485A priority Critical patent/JPS6225443A/ja
Publication of JPS6225443A publication Critical patent/JPS6225443A/ja
Publication of JPH0587020B2 publication Critical patent/JPH0587020B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP16400485A 1985-07-26 1985-07-26 混成集積回路装置 Granted JPS6225443A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16400485A JPS6225443A (ja) 1985-07-26 1985-07-26 混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16400485A JPS6225443A (ja) 1985-07-26 1985-07-26 混成集積回路装置

Publications (2)

Publication Number Publication Date
JPS6225443A true JPS6225443A (ja) 1987-02-03
JPH0587020B2 JPH0587020B2 (enrdf_load_stackoverflow) 1993-12-15

Family

ID=15784929

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16400485A Granted JPS6225443A (ja) 1985-07-26 1985-07-26 混成集積回路装置

Country Status (1)

Country Link
JP (1) JPS6225443A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0745774A (ja) * 1993-07-31 1995-02-14 Nec Corp 混成集積回路装置
JP2000252397A (ja) * 1999-03-03 2000-09-14 Kitani Denki Kk 電気機器用プレス部品

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0745774A (ja) * 1993-07-31 1995-02-14 Nec Corp 混成集積回路装置
JP2000252397A (ja) * 1999-03-03 2000-09-14 Kitani Denki Kk 電気機器用プレス部品

Also Published As

Publication number Publication date
JPH0587020B2 (enrdf_load_stackoverflow) 1993-12-15

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