JPS6224189B2 - - Google Patents

Info

Publication number
JPS6224189B2
JPS6224189B2 JP54092713A JP9271379A JPS6224189B2 JP S6224189 B2 JPS6224189 B2 JP S6224189B2 JP 54092713 A JP54092713 A JP 54092713A JP 9271379 A JP9271379 A JP 9271379A JP S6224189 B2 JPS6224189 B2 JP S6224189B2
Authority
JP
Japan
Prior art keywords
metal member
metal
deformable
contact
diffusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54092713A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5533890A (en
Inventor
Yuujin Hoosuton Dagurasu
Ansonii Rafuran Jeimuzu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of JPS5533890A publication Critical patent/JPS5533890A/ja
Publication of JPS6224189B2 publication Critical patent/JPS6224189B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Laminated Bodies (AREA)
JP9271379A 1978-07-24 1979-07-23 Thermal pressure adhesion diffusion bonding method Granted JPS5533890A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/927,346 US4204628A (en) 1978-07-24 1978-07-24 Method for thermo-compression diffusion bonding

Publications (2)

Publication Number Publication Date
JPS5533890A JPS5533890A (en) 1980-03-10
JPS6224189B2 true JPS6224189B2 (Sortimente) 1987-05-27

Family

ID=25454614

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9271379A Granted JPS5533890A (en) 1978-07-24 1979-07-23 Thermal pressure adhesion diffusion bonding method

Country Status (5)

Country Link
US (1) US4204628A (Sortimente)
JP (1) JPS5533890A (Sortimente)
DE (1) DE2928943C2 (Sortimente)
FR (1) FR2433387B1 (Sortimente)
SE (1) SE439894B (Sortimente)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4257156A (en) * 1979-03-09 1981-03-24 General Electric Company Method for thermo-compression diffusion bonding each side of a substrateless semiconductor device wafer to respective structured copper strain buffers
US4315591A (en) * 1979-03-08 1982-02-16 General Electric Company Method for thermo-compression diffusion bonding a structured copper strain buffer to each side of a substrateless semiconductor device wafer
US4574299A (en) * 1981-03-02 1986-03-04 General Electric Company Thyristor packaging system
US4444352A (en) * 1981-09-17 1984-04-24 General Electric Company Method of thermo-compression diffusion bonding together metal surfaces
US4607779A (en) * 1983-08-11 1986-08-26 National Semiconductor Corporation Non-impact thermocompression gang bonding method
JPH0231014Y2 (Sortimente) * 1984-12-12 1990-08-21
US4952999A (en) * 1988-04-26 1990-08-28 National Semiconductor Corporation Method and apparatus for reducing die stress
US5139887A (en) * 1988-12-27 1992-08-18 Barnes Group, Inc. Superplastically formed cellular article
US4934580A (en) * 1988-12-27 1990-06-19 Barnes Group, Inc. Method of making superplastically formed and diffusion bonded articles and the articles so made
US5049976A (en) * 1989-01-10 1991-09-17 National Semiconductor Corporation Stress reduction package and process
US5848746A (en) * 1996-01-16 1998-12-15 The Regents Of The University Of California Load regulating expansion fixture
US6129261A (en) † 1996-09-26 2000-10-10 The Boeing Company Diffusion bonding of metals
US7955504B1 (en) 2004-10-06 2011-06-07 State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of Oregon State University Microfluidic devices, particularly filtration devices comprising polymeric membranes, and method for their manufacture and use
US20090250442A1 (en) * 2007-12-03 2009-10-08 Eerc Foundation Joining of difficult-to-weld materials
US8801922B2 (en) * 2009-06-24 2014-08-12 State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of Oregon State University Dialysis system
US20100326914A1 (en) * 2009-06-24 2010-12-30 State of Oregon acting by and through the State Board of Higher Education on behalf of Oregon Microfluidic devices
US20110189048A1 (en) * 2009-12-05 2011-08-04 Curtis James R Modular dialysis system
US8753515B2 (en) 2009-12-05 2014-06-17 Home Dialysis Plus, Ltd. Dialysis system with ultrafiltration control
US8580161B2 (en) 2010-05-04 2013-11-12 State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of Oregon State University Fluidic devices comprising photocontrollable units
US8501009B2 (en) 2010-06-07 2013-08-06 State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of Oregon State University Fluid purification system
WO2013052680A2 (en) 2011-10-07 2013-04-11 Home Dialysis Plus, Ltd. Heat exchange fluid purification for dialysis system
US9585514B2 (en) 2013-03-15 2017-03-07 All-Clad Metalsrafters, LLC Heat zone pan
US10081163B2 (en) 2013-03-15 2018-09-25 All-Clad Metalcrafters Llc Cooking utensil having a graphite core
CA2911879C (en) 2013-03-15 2021-04-20 All-Clad Metalcrafters Llc Cookware with selectively bonded layers
JP6657186B2 (ja) 2014-04-29 2020-03-04 アウトセット・メディカル・インコーポレイテッドＯｕｔｓｅｔ Ｍｅｄｉｃａｌ， Ｉｎｃ． 透析システムおよび方法
ES2908601T3 (es) 2016-08-19 2022-05-03 Outset Medical Inc Sistema y métodos de diálisis peritoneal
BR112021003168A2 (pt) 2018-08-23 2021-05-11 Outset Medical, Inc. métodos para preparar um conjunto de tubos e um dialisador, para testar vazamentos, para preparar um conjunto de tubos, para melhorar a durabilidade e operação de uma ou mais bombas de deslocamento e para prover terapia de diálise, sistema de diálise, e, acessório de queima de bomba
US11364706B2 (en) 2018-12-19 2022-06-21 All-Clad Metalcrafters, L.L.C. Cookware having a graphite core
BR112021021836A2 (pt) 2019-04-30 2022-01-04 Outset Medical Inc Métodos para calcular a pressão arterial, para criar dialisato em um sistema de diálise, para medir a porcentagem de rejeição em um sistema de diálise, para coletar e analisar plasma sanguíneo, para remover gás de um circuito extracorpóreo de um sistema de diálise, para inferir uma pressão de linha em um circuito extracorpóreo de um sistema de diálise, para prover terapia de diálise extracorpórea e intracorpórea, para montar um conjunto de tubos de paciente no estilo cartucho em uma máquina de diálise e para preparar uma máquina de diálise para terapia de diálise, câmaras de fluxo e de remoção de ar, sistema de diálise, subsistema de dispensação de dialisato, filtro de micróbio/endotoxina de uso único, dialisador, dispositivo para medir pressão de um sistema de diálise, e, conjunto de tubos de sangue

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH182135A (de) * 1935-04-11 1936-01-31 Ostendorf Peter Verfahren zum Plattieren von Blechen, Platten usw. aus Metall.
DE1141029B (de) * 1960-06-23 1962-12-13 Siemens Ag Halbleiteranordnung und Verfahren zu ihrer Herstellung
US3273029A (en) * 1963-08-23 1966-09-13 Hoffman Electronics Corp Method of attaching leads to a semiconductor body and the article formed thereby
US3295089A (en) * 1963-10-11 1966-12-27 American Mach & Foundry Semiconductor device
US3650454A (en) * 1967-07-06 1972-03-21 Western Electric Co Device for bonding with a compliant medium
US3633267A (en) * 1968-12-27 1972-01-11 Boeing Co Method of diffusion bonding honeycomb composite structures
GB1365289A (en) * 1970-12-22 1974-08-29 Plessey Co Ltd Infrared soldering apparatus
US3886647A (en) * 1971-07-07 1975-06-03 Trw Inc Method of making erosion resistant articles
DE2418106A1 (de) * 1974-04-13 1975-11-06 Siemens Ag Trockenloetverfahren zum hochfesten verbinden von metallfolien mit keramiken, glaesern und anderen oxidischen werkstoffen

Also Published As

Publication number Publication date
US4204628A (en) 1980-05-27
DE2928943A1 (de) 1980-02-07
FR2433387A1 (fr) 1980-03-14
JPS5533890A (en) 1980-03-10
DE2928943C2 (de) 1986-08-14
SE439894B (sv) 1985-07-08
FR2433387B1 (fr) 1986-07-11
SE7906343L (sv) 1980-01-25

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