JPS62211396A - コネクタ−端子の微小部分のメツキ装置 - Google Patents

コネクタ−端子の微小部分のメツキ装置

Info

Publication number
JPS62211396A
JPS62211396A JP60250949A JP25094985A JPS62211396A JP S62211396 A JPS62211396 A JP S62211396A JP 60250949 A JP60250949 A JP 60250949A JP 25094985 A JP25094985 A JP 25094985A JP S62211396 A JPS62211396 A JP S62211396A
Authority
JP
Japan
Prior art keywords
plating
plating solution
parts
plating liquid
plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60250949A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0125391B2 (enExample
Inventor
Yasuto Murata
康人 村田
Kenji Yamamoto
健治 山本
Junichi Tezuka
純一 手塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EEJA Ltd
Original Assignee
Electroplating Engineers of Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electroplating Engineers of Japan Ltd filed Critical Electroplating Engineers of Japan Ltd
Priority to JP60250949A priority Critical patent/JPS62211396A/ja
Priority to DE8686114812T priority patent/DE3683595D1/de
Priority to EP19860114812 priority patent/EP0222232B1/en
Priority to US06/924,653 priority patent/US4702811A/en
Publication of JPS62211396A publication Critical patent/JPS62211396A/ja
Publication of JPH0125391B2 publication Critical patent/JPH0125391B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
JP60250949A 1985-11-11 1985-11-11 コネクタ−端子の微小部分のメツキ装置 Granted JPS62211396A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP60250949A JPS62211396A (ja) 1985-11-11 1985-11-11 コネクタ−端子の微小部分のメツキ装置
DE8686114812T DE3683595D1 (de) 1985-11-11 1986-10-24 Vorrichtung zum selektiven metallbeschichten von steckverbinderkontaktstiften.
EP19860114812 EP0222232B1 (en) 1985-11-11 1986-10-24 Plating device for minute portions of connector terminals
US06/924,653 US4702811A (en) 1985-11-11 1986-10-29 Plating device for minute portions of connector terminals

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60250949A JPS62211396A (ja) 1985-11-11 1985-11-11 コネクタ−端子の微小部分のメツキ装置

Publications (2)

Publication Number Publication Date
JPS62211396A true JPS62211396A (ja) 1987-09-17
JPH0125391B2 JPH0125391B2 (enExample) 1989-05-17

Family

ID=17215402

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60250949A Granted JPS62211396A (ja) 1985-11-11 1985-11-11 コネクタ−端子の微小部分のメツキ装置

Country Status (2)

Country Link
US (1) US4702811A (enExample)
JP (1) JPS62211396A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6313493A (ja) * 1986-07-03 1988-01-20 Nec Corp ル−タセル
CN118531483A (zh) * 2024-07-26 2024-08-23 安徽昀水表面科技有限公司 一种自动化端子电镀设备

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4786389A (en) * 1987-09-25 1988-11-22 Amp Incorporated Electroplating apparatus
US4818349A (en) * 1988-02-01 1989-04-04 Amp Incorporated Selective plating apparatus for zone plating
CH684840A5 (fr) * 1991-06-11 1995-01-13 Electroplating Eng Eesa Cellule pour plaquer par voie électrolytique sélectivement des zones choisies de pièces métalliques disposées en bande.
FR2714080B1 (fr) * 1993-12-16 1996-03-01 Dalic Dispositif pour le traitement électrochimique, notamment localisé, d'un substrat conducteur.
WO2006017581A1 (en) * 2004-08-05 2006-02-16 Sv Probe Pte Ltd. Probe tip plating

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3751343A (en) * 1971-06-14 1973-08-07 A Macula Brush electroplating metal at increased rates of deposition
US3951772A (en) * 1974-05-31 1976-04-20 Auric Corporation Selective plating apparatus
JPS58224193A (ja) * 1982-06-24 1983-12-26 Seiko Epson Corp 部分メツキ方法
US4452684A (en) * 1983-03-11 1984-06-05 The Carolinch Company Apparatus for selective electrolytic plating
US4595464A (en) * 1984-09-25 1986-06-17 Robbins & Craig Welding & Mfg. Co. Continuous contact method for electrolytic fluid working of parts
JPS61147263A (ja) * 1984-12-20 1986-07-04 Canon Inc 静電荷像現像用電荷付与材

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6313493A (ja) * 1986-07-03 1988-01-20 Nec Corp ル−タセル
CN118531483A (zh) * 2024-07-26 2024-08-23 安徽昀水表面科技有限公司 一种自动化端子电镀设备

Also Published As

Publication number Publication date
JPH0125391B2 (enExample) 1989-05-17
US4702811A (en) 1987-10-27

Similar Documents

Publication Publication Date Title
DE2324834C2 (de) Vorrichtung zum kontinuierlichen selektiven Bandgalvanisieren
FI122221B (fi) Applikaattori käytettäväksi refleksoterapiassa
DE60042976D1 (de) Lösung für die elektrochemische abscheidung, methode, eine leiterplatte unter verwendung dieser lösung herzustellen und mehrschichtige leiterplatte
CN214991962U (zh) 一种用于柔性薄膜基材表面电镀加工的水电镀设备
JPH024678B2 (enExample)
JPH0125391B2 (enExample)
JPS61250191A (ja) コネクタ端子のブラシメツキ方法
GB1477024A (en) Continuous application of coatings by electrolysis
EP0222232B1 (en) Plating device for minute portions of connector terminals
JPH0140117B2 (enExample)
US4786389A (en) Electroplating apparatus
DE3839223C1 (enExample)
JPH0140116B2 (enExample)
DK161206B (da) Fremgangsmaade og apparat til ensidig elektroplettering af et bevaegeligt metalbaand
DE1287375B (de) Elektrodenwalze fuer Metallbandbehandlungsanlagen
JPS62103389A (ja) 微小部分のメツキ装置
JPS62136587A (ja) 部分メツキ装置
JPH11193496A (ja) 金属条のストライプめっき装置
JPH06500364A (ja) 電気メッキ槽
JPS62136586A (ja) 部分メツキ装置
JPS63266090A (ja) ストリツプの電気めつき設備
JPS61291989A (ja) 部分メツキ装置
JPS6022065B2 (ja) ステンレス帯鋼の連続着色方法
JPS63195290A (ja) 缶用メツキ鋼板の製造方法
KR20060114982A (ko) 부분 도금 장치 및 방법