FR2714080B1 - Dispositif pour le traitement électrochimique, notamment localisé, d'un substrat conducteur. - Google Patents
Dispositif pour le traitement électrochimique, notamment localisé, d'un substrat conducteur.Info
- Publication number
- FR2714080B1 FR2714080B1 FR9315166A FR9315166A FR2714080B1 FR 2714080 B1 FR2714080 B1 FR 2714080B1 FR 9315166 A FR9315166 A FR 9315166A FR 9315166 A FR9315166 A FR 9315166A FR 2714080 B1 FR2714080 B1 FR 2714080B1
- Authority
- FR
- France
- Prior art keywords
- electrochemical
- treatment
- conductive substrate
- particular localized
- localized
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
- C25F3/14—Etching locally
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/026—Electroplating of selected surface areas using locally applied jets of electrolyte
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/04—Electroplating with moving electrodes
- C25D5/06—Brush or pad plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Water Treatment By Electricity Or Magnetism (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9315166A FR2714080B1 (fr) | 1993-12-16 | 1993-12-16 | Dispositif pour le traitement électrochimique, notamment localisé, d'un substrat conducteur. |
US08/364,681 US5571389A (en) | 1993-12-16 | 1994-12-13 | Device for the electrochemical treatment especially the local electrochemical treatment, of conductive substrate |
DE69402952T DE69402952T2 (de) | 1993-12-16 | 1994-12-15 | Vorrichtung zu einer insbesonderen selektiven elektrochemischen Behandlung eines leitenden Substrats |
EP94402891A EP0663461B1 (fr) | 1993-12-16 | 1994-12-15 | Dispositif pour le traitement électrochimique, notamment localisé, d'un substrat conducteur |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9315166A FR2714080B1 (fr) | 1993-12-16 | 1993-12-16 | Dispositif pour le traitement électrochimique, notamment localisé, d'un substrat conducteur. |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2714080A1 FR2714080A1 (fr) | 1995-06-23 |
FR2714080B1 true FR2714080B1 (fr) | 1996-03-01 |
Family
ID=9454021
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9315166A Expired - Lifetime FR2714080B1 (fr) | 1993-12-16 | 1993-12-16 | Dispositif pour le traitement électrochimique, notamment localisé, d'un substrat conducteur. |
Country Status (4)
Country | Link |
---|---|
US (1) | US5571389A (fr) |
EP (1) | EP0663461B1 (fr) |
DE (1) | DE69402952T2 (fr) |
FR (1) | FR2714080B1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109898112A (zh) * | 2019-04-24 | 2019-06-18 | 浙江宏途电气科技有限公司 | 一种自动化电刷镀装置 |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT411693B (de) * | 2002-07-01 | 2004-04-26 | Fronius Int Gmbh | Elektrochemisches verfahren zum reinigen von oberflächen metallischer werkstücke |
DE19809487A1 (de) * | 1998-03-06 | 1999-09-09 | Greising | Verfahren und Vorrichtung zur Aufbringung einer räumlich begrenzten metallischen Deckschicht auf einer elektrisch leitenden Materialoberfläche |
US6939447B2 (en) | 1998-04-06 | 2005-09-06 | Tdao Limited | Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method |
GB2336161B (en) | 1998-04-06 | 2003-03-26 | John Michael Lowe | Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method |
US6143156A (en) * | 1998-07-24 | 2000-11-07 | Cae Vanguard, Inc. | Electroplating method and apparatus |
EP0978577B1 (fr) * | 1998-08-07 | 2003-12-17 | Fritz-Herbert Frembgen | Procédé et dispositif d'usinage électrochimique de pièces |
DE19848296A1 (de) * | 1998-10-12 | 2000-04-13 | Peter Van Treeck | Korrosionsstabile Anschlussklemme zur reversiblen Herstellung elektrischer Anschlüsse in Elektrolyten und anderen korrosiven Medien |
JP2000232078A (ja) * | 1999-02-10 | 2000-08-22 | Toshiba Corp | メッキ方法及びメッキ装置 |
US6538714B1 (en) * | 1999-10-25 | 2003-03-25 | 3M Innovative Properties Company | Dual color guest-host polarizers and devices containing guest-host polarizers |
IT1311147B1 (it) * | 1999-11-04 | 2002-03-04 | Edk Res Ag | Macchina per pulizia localizzata con cella, elettrolitica e/o adultrasuoni, di decapaggio e/o lucidatura |
US20060263188A1 (en) * | 2005-05-03 | 2006-11-23 | Goldin Martin C | Water dispensing system |
JP4216892B1 (ja) * | 2007-04-13 | 2009-01-28 | 優章 荒井 | 電解水の製造装置、電解水の製造方法および電解水 |
ATE551530T1 (de) * | 2008-02-27 | 2012-04-15 | Smith & Nephew Inc | Schlauchpumpenvorrichtung und -verfahren |
FR2991343B1 (fr) * | 2012-06-01 | 2014-05-16 | Dalic | Dispositif pour le traitement electrochimique, notamment localise, d'un substrat conducteur |
CN103160891B (zh) * | 2013-03-22 | 2015-08-12 | 北京联泰信科铁路信通技术有限公司 | 铁路钢轨面刷镀导电金属的方法及设备 |
US9393759B2 (en) * | 2013-10-24 | 2016-07-19 | General Electric Company | Metal laminate structures with systems and methods for treating |
GB2535805A (en) * | 2015-02-27 | 2016-08-31 | Biomet Uk Healthcare Ltd | Apparatus and method for selectively treating a surface of a component |
WO2016181698A1 (fr) * | 2015-05-08 | 2016-11-17 | 株式会社日立製作所 | Dispositif de traitement de surface de type humide |
GB2572402B (en) * | 2018-03-29 | 2020-06-17 | Hodges & Drake Design Ltd | A pumping apparatus with first and second peristaltic pumps |
DE102018109531A1 (de) * | 2018-04-20 | 2019-10-24 | Christian-Albrechts-Universität Zu Kiel | Klebe-Fügevorrichtung sowie Klebe-Fügeverfahren für eine metallische Oberfläche |
WO2020264084A1 (fr) | 2019-06-27 | 2020-12-30 | Boston Scientific Scimed, Inc. | Détection d'un endoscope dans un système de gestion de fluide |
EP4051341A1 (fr) | 2019-10-30 | 2022-09-07 | Boston Scientific Limited | Système de surveillance de fluide |
KR102254027B1 (ko) * | 2019-11-28 | 2021-05-20 | (주)천우테크 | 고정식 대형 스테인리스스틸 저장탱크 내부의 표면처리를 할 수 있는 이동식 전해연마 시스템 |
KR102355394B1 (ko) * | 2020-03-09 | 2022-01-26 | (주)한국마루이 | 휴대용 음극판 구조 및 이를 포함하는 전해연마 장치 |
WO2022026676A1 (fr) | 2020-07-30 | 2022-02-03 | Boston Scientific Scimed, Inc. | Système de gestion de fluide avec refroidissement de fibre laser intégré |
US20220220628A1 (en) * | 2021-01-13 | 2022-07-14 | Corrdesa, LLC | Electrochemical treatment system |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3294664A (en) * | 1963-09-03 | 1966-12-27 | Hoover Co | Electrolytic appliance for treating surfaces |
FI821438L (fi) * | 1982-04-26 | 1983-10-27 | Labsystems Oy | Vaetskebehandlare |
JPS62211396A (ja) * | 1985-11-11 | 1987-09-17 | Electroplating Eng Of Japan Co | コネクタ−端子の微小部分のメツキ装置 |
DE3839223C2 (de) * | 1988-11-19 | 1994-10-20 | Degussa | Vorrichtung zur selektiven galvanischen Beschichtung |
CH684840A5 (fr) * | 1991-06-11 | 1995-01-13 | Electroplating Eng Eesa | Cellule pour plaquer par voie électrolytique sélectivement des zones choisies de pièces métalliques disposées en bande. |
-
1993
- 1993-12-16 FR FR9315166A patent/FR2714080B1/fr not_active Expired - Lifetime
-
1994
- 1994-12-13 US US08/364,681 patent/US5571389A/en not_active Expired - Lifetime
- 1994-12-15 EP EP94402891A patent/EP0663461B1/fr not_active Expired - Lifetime
- 1994-12-15 DE DE69402952T patent/DE69402952T2/de not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109898112A (zh) * | 2019-04-24 | 2019-06-18 | 浙江宏途电气科技有限公司 | 一种自动化电刷镀装置 |
CN109898112B (zh) * | 2019-04-24 | 2020-07-21 | 温岭市中天自动化设备有限公司 | 一种自动化电刷镀装置 |
Also Published As
Publication number | Publication date |
---|---|
DE69402952T2 (de) | 1997-11-27 |
EP0663461B1 (fr) | 1997-05-02 |
US5571389A (en) | 1996-11-05 |
DE69402952D1 (de) | 1997-06-05 |
FR2714080A1 (fr) | 1995-06-23 |
EP0663461A1 (fr) | 1995-07-19 |
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