DE69402952D1 - Vorrichtung zu einer insbesonderen selektiven elektrochemischen Behandlung eines leitenden Substrats - Google Patents

Vorrichtung zu einer insbesonderen selektiven elektrochemischen Behandlung eines leitenden Substrats

Info

Publication number
DE69402952D1
DE69402952D1 DE69402952T DE69402952T DE69402952D1 DE 69402952 D1 DE69402952 D1 DE 69402952D1 DE 69402952 T DE69402952 T DE 69402952T DE 69402952 T DE69402952 T DE 69402952T DE 69402952 D1 DE69402952 D1 DE 69402952D1
Authority
DE
Germany
Prior art keywords
conductive substrate
electrochemical treatment
particularly selective
selective electrochemical
treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69402952T
Other languages
English (en)
Other versions
DE69402952T2 (de
Inventor
Patrick Kerampran
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dalic Laboratoire SA
Original Assignee
Dalic Laboratoire SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dalic Laboratoire SA filed Critical Dalic Laboratoire SA
Application granted granted Critical
Publication of DE69402952D1 publication Critical patent/DE69402952D1/de
Publication of DE69402952T2 publication Critical patent/DE69402952T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/14—Etching locally
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/026—Electroplating of selected surface areas using locally applied jets of electrolyte
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C25D5/06—Brush or pad plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Water Treatment By Electricity Or Magnetism (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
DE69402952T 1993-12-16 1994-12-15 Vorrichtung zu einer insbesonderen selektiven elektrochemischen Behandlung eines leitenden Substrats Expired - Fee Related DE69402952T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9315166A FR2714080B1 (fr) 1993-12-16 1993-12-16 Dispositif pour le traitement électrochimique, notamment localisé, d'un substrat conducteur.

Publications (2)

Publication Number Publication Date
DE69402952D1 true DE69402952D1 (de) 1997-06-05
DE69402952T2 DE69402952T2 (de) 1997-11-27

Family

ID=9454021

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69402952T Expired - Fee Related DE69402952T2 (de) 1993-12-16 1994-12-15 Vorrichtung zu einer insbesonderen selektiven elektrochemischen Behandlung eines leitenden Substrats

Country Status (4)

Country Link
US (1) US5571389A (de)
EP (1) EP0663461B1 (de)
DE (1) DE69402952T2 (de)
FR (1) FR2714080B1 (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT411693B (de) * 2002-07-01 2004-04-26 Fronius Int Gmbh Elektrochemisches verfahren zum reinigen von oberflächen metallischer werkstücke
DE19809487A1 (de) * 1998-03-06 1999-09-09 Greising Verfahren und Vorrichtung zur Aufbringung einer räumlich begrenzten metallischen Deckschicht auf einer elektrisch leitenden Materialoberfläche
US6939447B2 (en) 1998-04-06 2005-09-06 Tdao Limited Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
GB2336161B (en) 1998-04-06 2003-03-26 John Michael Lowe Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
US6143156A (en) * 1998-07-24 2000-11-07 Cae Vanguard, Inc. Electroplating method and apparatus
EP0978577B1 (de) * 1998-08-07 2003-12-17 Fritz-Herbert Frembgen Verfahren und Vorrichtung zum elektrochemischen Bearbeiten von Werkstücken
DE19848296A1 (de) * 1998-10-12 2000-04-13 Peter Van Treeck Korrosionsstabile Anschlussklemme zur reversiblen Herstellung elektrischer Anschlüsse in Elektrolyten und anderen korrosiven Medien
JP2000232078A (ja) * 1999-02-10 2000-08-22 Toshiba Corp メッキ方法及びメッキ装置
US6538714B1 (en) * 1999-10-25 2003-03-25 3M Innovative Properties Company Dual color guest-host polarizers and devices containing guest-host polarizers
IT1311147B1 (it) * 1999-11-04 2002-03-04 Edk Res Ag Macchina per pulizia localizzata con cella, elettrolitica e/o adultrasuoni, di decapaggio e/o lucidatura
US20060263188A1 (en) * 2005-05-03 2006-11-23 Goldin Martin C Water dispensing system
JP4216892B1 (ja) * 2007-04-13 2009-01-28 優章 荒井 電解水の製造装置、電解水の製造方法および電解水
ATE551530T1 (de) * 2008-02-27 2012-04-15 Smith & Nephew Inc Schlauchpumpenvorrichtung und -verfahren
FR2991343B1 (fr) * 2012-06-01 2014-05-16 Dalic Dispositif pour le traitement electrochimique, notamment localise, d'un substrat conducteur
CN103160891B (zh) * 2013-03-22 2015-08-12 北京联泰信科铁路信通技术有限公司 铁路钢轨面刷镀导电金属的方法及设备
US9393759B2 (en) * 2013-10-24 2016-07-19 General Electric Company Metal laminate structures with systems and methods for treating
GB2535805A (en) * 2015-02-27 2016-08-31 Biomet Uk Healthcare Ltd Apparatus and method for selectively treating a surface of a component
WO2016181698A1 (ja) * 2015-05-08 2016-11-17 株式会社日立製作所 湿式表面処理装置
GB2572402B (en) * 2018-03-29 2020-06-17 Hodges & Drake Design Ltd A pumping apparatus with first and second peristaltic pumps
DE102018109531A1 (de) * 2018-04-20 2019-10-24 Christian-Albrechts-Universität Zu Kiel Klebe-Fügevorrichtung sowie Klebe-Fügeverfahren für eine metallische Oberfläche
CN109898112B (zh) * 2019-04-24 2020-07-21 温岭市中天自动化设备有限公司 一种自动化电刷镀装置
WO2020264084A1 (en) 2019-06-27 2020-12-30 Boston Scientific Scimed, Inc. Detection of an endoscope to a fluid management system
EP4051341A1 (de) 2019-10-30 2022-09-07 Boston Scientific Limited Fluidüberwachungssystem
KR102254027B1 (ko) * 2019-11-28 2021-05-20 (주)천우테크 고정식 대형 스테인리스스틸 저장탱크 내부의 표면처리를 할 수 있는 이동식 전해연마 시스템
KR102355394B1 (ko) * 2020-03-09 2022-01-26 (주)한국마루이 휴대용 음극판 구조 및 이를 포함하는 전해연마 장치
WO2022026676A1 (en) 2020-07-30 2022-02-03 Boston Scientific Scimed, Inc. Fluid management system with integrated laser fiber cooling
US20220220628A1 (en) * 2021-01-13 2022-07-14 Corrdesa, LLC Electrochemical treatment system

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3294664A (en) * 1963-09-03 1966-12-27 Hoover Co Electrolytic appliance for treating surfaces
FI821438L (fi) * 1982-04-26 1983-10-27 Labsystems Oy Vaetskebehandlare
JPS62211396A (ja) * 1985-11-11 1987-09-17 Electroplating Eng Of Japan Co コネクタ−端子の微小部分のメツキ装置
DE3839223C2 (de) * 1988-11-19 1994-10-20 Degussa Vorrichtung zur selektiven galvanischen Beschichtung
CH684840A5 (fr) * 1991-06-11 1995-01-13 Electroplating Eng Eesa Cellule pour plaquer par voie électrolytique sélectivement des zones choisies de pièces métalliques disposées en bande.

Also Published As

Publication number Publication date
DE69402952T2 (de) 1997-11-27
EP0663461B1 (de) 1997-05-02
US5571389A (en) 1996-11-05
FR2714080A1 (fr) 1995-06-23
FR2714080B1 (fr) 1996-03-01
EP0663461A1 (de) 1995-07-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee
8370 Indication related to discontinuation of the patent is to be deleted
8339 Ceased/non-payment of the annual fee