JPS62201923A - エポキシ樹脂組成物 - Google Patents

エポキシ樹脂組成物

Info

Publication number
JPS62201923A
JPS62201923A JP25030186A JP25030186A JPS62201923A JP S62201923 A JPS62201923 A JP S62201923A JP 25030186 A JP25030186 A JP 25030186A JP 25030186 A JP25030186 A JP 25030186A JP S62201923 A JPS62201923 A JP S62201923A
Authority
JP
Japan
Prior art keywords
epoxy resin
dicyclopentadiene
resin
modified
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP25030186A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0340053B2 (enrdf_load_html_response
Inventor
Hiroaki Nanba
宏彰 難波
Eiji Kojima
小島　鋭士
Masato Tamao
玉生　征人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Kokusaku Pulp Co Ltd
Original Assignee
Sanyo Kokusaku Pulp Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Kokusaku Pulp Co Ltd filed Critical Sanyo Kokusaku Pulp Co Ltd
Publication of JPS62201923A publication Critical patent/JPS62201923A/ja
Publication of JPH0340053B2 publication Critical patent/JPH0340053B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP25030186A 1985-10-31 1986-10-21 エポキシ樹脂組成物 Granted JPS62201923A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60244769 1985-10-31
JP60-244769 1985-10-31

Publications (2)

Publication Number Publication Date
JPS62201923A true JPS62201923A (ja) 1987-09-05
JPH0340053B2 JPH0340053B2 (enrdf_load_html_response) 1991-06-17

Family

ID=17123631

Family Applications (2)

Application Number Title Priority Date Filing Date
JP25030186A Granted JPS62201923A (ja) 1985-10-31 1986-10-21 エポキシ樹脂組成物
JP25030086A Granted JPS62201922A (ja) 1985-10-31 1986-10-21 エポキシ樹脂組成物

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP25030086A Granted JPS62201922A (ja) 1985-10-31 1986-10-21 エポキシ樹脂組成物

Country Status (1)

Country Link
JP (2) JPS62201923A (enrdf_load_html_response)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03166220A (ja) * 1989-11-25 1991-07-18 Matsushita Electric Works Ltd 半導体封止用エポキシ樹脂組成物
JPH03167251A (ja) * 1989-11-27 1991-07-19 Matsushita Electric Works Ltd 半導体封止用エポキシ樹脂組成物
JPH05148410A (ja) * 1991-11-26 1993-06-15 Shin Etsu Chem Co Ltd 熱硬化性樹脂組成物及び半導体装置
KR100421927B1 (ko) * 2001-08-21 2004-03-12 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물
KR100480945B1 (ko) * 2001-12-28 2005-04-06 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01105562A (ja) * 1987-10-19 1989-04-24 Sumitomo Bakelite Co Ltd 樹脂封止型半導体装置
JPH0597970A (ja) * 1991-10-07 1993-04-20 Shin Etsu Chem Co Ltd 熱硬化性樹脂組成物及び半導体装置
EP0705856A2 (en) 1994-10-07 1996-04-10 Shell Internationale Researchmaatschappij B.V. Epoxy resin composition for semiconductor encapsulation
JPH10245473A (ja) * 1997-03-03 1998-09-14 Yuka Shell Epoxy Kk エポキシ樹脂組成物
EP2284216B1 (en) 2009-08-07 2012-03-28 Ticona LLC Low formaldehyde emission polyacetal composition
JP6422777B2 (ja) 2011-09-29 2018-11-14 ティコナ・エルエルシー 金属様外観を呈する物品の製造用重合体組成物

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5499160A (en) * 1978-01-20 1979-08-04 Nippon Oil Co Ltd Epoxy resin composition

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5499160A (en) * 1978-01-20 1979-08-04 Nippon Oil Co Ltd Epoxy resin composition

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03166220A (ja) * 1989-11-25 1991-07-18 Matsushita Electric Works Ltd 半導体封止用エポキシ樹脂組成物
JPH03167251A (ja) * 1989-11-27 1991-07-19 Matsushita Electric Works Ltd 半導体封止用エポキシ樹脂組成物
JPH05148410A (ja) * 1991-11-26 1993-06-15 Shin Etsu Chem Co Ltd 熱硬化性樹脂組成物及び半導体装置
KR100421927B1 (ko) * 2001-08-21 2004-03-12 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물
KR100480945B1 (ko) * 2001-12-28 2005-04-06 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물

Also Published As

Publication number Publication date
JPS62201922A (ja) 1987-09-05
JPH0340052B2 (enrdf_load_html_response) 1991-06-17
JPH0340053B2 (enrdf_load_html_response) 1991-06-17

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees