JPS62201923A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS62201923A JPS62201923A JP25030186A JP25030186A JPS62201923A JP S62201923 A JPS62201923 A JP S62201923A JP 25030186 A JP25030186 A JP 25030186A JP 25030186 A JP25030186 A JP 25030186A JP S62201923 A JPS62201923 A JP S62201923A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- dicyclopentadiene
- resin
- modified
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 32
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 32
- 239000000203 mixture Substances 0.000 title claims abstract description 11
- 229920005989 resin Polymers 0.000 claims abstract description 16
- 239000011347 resin Substances 0.000 claims abstract description 16
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims abstract description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims abstract description 3
- 229930003836 cresol Natural products 0.000 claims abstract description 3
- 239000000126 substance Substances 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 abstract description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 8
- 150000001896 cresols Chemical class 0.000 abstract description 5
- 229920003986 novolac Polymers 0.000 abstract description 5
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 abstract description 4
- 125000003700 epoxy group Chemical group 0.000 abstract description 3
- -1 heterocyclic amine Chemical class 0.000 abstract description 3
- 238000009413 insulation Methods 0.000 abstract description 3
- 239000004014 plasticizer Substances 0.000 abstract description 3
- 229920000049 Carbon (fiber) Polymers 0.000 abstract description 2
- 239000000654 additive Substances 0.000 abstract description 2
- 239000004917 carbon fiber Substances 0.000 abstract description 2
- 239000003365 glass fiber Substances 0.000 abstract description 2
- 239000011968 lewis acid catalyst Substances 0.000 abstract description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 abstract description 2
- 238000002156 mixing Methods 0.000 abstract description 2
- 239000003960 organic solvent Substances 0.000 abstract description 2
- 239000012766 organic filler Substances 0.000 abstract 1
- 239000012860 organic pigment Substances 0.000 abstract 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical class CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229910015900 BF3 Inorganic materials 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 150000002989 phenols Chemical group 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 239000012744 reinforcing agent Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- OCKYMBMCPOAFLL-UHFFFAOYSA-N 2-ethyl-3-methylphenol Chemical compound CCC1=C(C)C=CC=C1O OCKYMBMCPOAFLL-UHFFFAOYSA-N 0.000 description 1
- 239000004606 Fillers/Extenders Substances 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 235000008708 Morus alba Nutrition 0.000 description 1
- 240000000249 Morus alba Species 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012757 flame retardant agent Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000001165 hydrophobic group Chemical group 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 150000002931 p-cresols Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、耐熱性、耐水性、可撓性及び絶縁性に優れた
エポキシ樹脂組成物に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to an epoxy resin composition that has excellent heat resistance, water resistance, flexibility, and insulation properties.
（従来の技術および発明が解決すべき問題点）現在、エ
ポキシ樹脂の硬化剤としては、芳香族ポリアミン、ジシ
アンジアミド、酸無水物。(Prior art and problems to be solved by the invention) Currently, aromatic polyamines, dicyandiamide, and acid anhydrides are used as curing agents for epoxy resins.
ＢＦ：ｉｇＵ体等が使われている。しかしながら、この
ような硬化剤が配合されているエポキシ樹脂組成物は、
それぞれ次のＪ、うな問題をｈしている。すなわち芳香
族ポリアミンを用いたものは貯蔵安定性に欠け、しかも
その硬化物の耐湿性が悪い。また、ジシアンジアミドを
用いたものは、優れた貯蔵安定性を示すが、その硬化物
が耐熱性に欠け、しかも硬化速度が荏い。酸無水物を用
いたものは、耐熱性に比較曲りれた硬化物を生成するが
、吸湿しやすく貯蔵安定性に欠ける。ＢＦ３♀（１体を
用いたものは、貯′ｆｆｃ支定性に優れ、速硬性を有す
るが、生成硬化物が吸湿するとその電気特性が劣化する
。このＪ、うに従来の硬化剤を用いた場合、耐熱性、耐
水性に富む勧化物を生成でき、かつ貯蔵安定性に優れた
組成物を１″−Ｉることは困難であった。BF: igU type etc. are used. However, epoxy resin compositions containing such curing agents,
Each student is doing the following J and Una problems. That is, products using aromatic polyamines lack storage stability, and their cured products have poor moisture resistance. Further, those using dicyandiamide exhibit excellent storage stability, but the cured products lack heat resistance and the curing speed is slow. Those using acid anhydrides produce cured products that are relatively heat resistant and curved, but tend to absorb moisture and lack storage stability. BF3♀ (Those using one body have excellent storage properties and quick hardening properties, but when the resulting cured product absorbs moisture, its electrical properties deteriorate.When using this J, a conventional curing agent) However, it has been difficult to produce a composition that is highly heat resistant and water resistant and has excellent storage stability.
（問題点を解決するだめの手段〕
本発明者らは、特に可撓性、耐水性にすぐれ、耐熱性に
もずぐれた硬化物を生成でき、かつ貯蔵安定性の優れた
エポキシ樹脂組成物を１−７るために鋭意検討の結果、
硬化剤としてジシクロペンタジェン変性クレゾール樹脂
を使用することにより目的が達成できることを見いだし
、本発明に至ったものである。(Another means to solve the problem) The present inventors have developed an epoxy resin composition that can produce a cured product with particularly excellent flexibility, water resistance, and heat resistance, and has excellent storage stability. As a result of intensive study to determine 1-7,
The inventors have discovered that the object can be achieved by using a dicyclopentadiene-modified cresol resin as a curing agent, leading to the present invention.
すなわら本発明は、下記一般式［Ｉ］
（式中Ｒはメチル基、ｎはＯ〜１５の整数を示？Ｊ’、
）
で示されるジシクｆ」ペンタジェン変性オルソクレゾー
ルイか！ Ｉｌｉを硬化剤とするエポキシ樹脂組成物を
提供したものである。That is, the present invention is based on the following general formula [I] (wherein R is a methyl group, and n represents an integer of O to 15?J',
) is a pentadiene-modified orthocresol! The present invention provides an epoxy resin composition using Ili as a curing agent.
（作 用）
上記一般式［Ｉ］で示されるジシクロペンタジェン変性
クレゾール樹脂は、ジシクロペンタジＹンとクレゾール
をルイス酸触媒中で手合することによって得られる。(Function) The dicyclopentadiene-modified cresol resin represented by the above general formula [I] can be obtained by combining dicyclopentadiene and cresol in a Lewis acid catalyst.
トリシクロデカン環を含有することは樹脂の化学構造か
らみてもわかるように水酸基の間隔が拡がり、エポキシ
基との反応率が上がるため、架橋密度を適度にコントロ
ールできる。このため弾性率が低下し、トリシクロデカ
ン環の疎水性により吸水率を下げることかできる。As can be seen from the chemical structure of the resin, the inclusion of tricyclodecane rings widens the spacing between hydroxyl groups and increases the reaction rate with epoxy groups, making it possible to appropriately control the crosslinking density. Therefore, the elastic modulus decreases, and the water absorption rate can be lowered due to the hydrophobicity of the tricyclodecane ring.
従来のノボラック型樹脂はメヂレン塁でフェノール類と
結合している。このため硬化剤がエポキシ樹脂中のグリ
シジル基と反応した際に、隣接のグリシジル基が立体障
害によって反応を妨げられ、エポキシ樹脂の硬化特性が
低下りる要因に動く。この結果、硬化物の耐熱性、耐湿
性などを低下させる原因となっている。Conventional novolak-type resins are bound to phenols through medilene bases. Therefore, when the curing agent reacts with the glycidyl groups in the epoxy resin, the reaction is hindered by the steric hindrance of the adjacent glycidyl groups, which becomes a factor in reducing the curing properties of the epoxy resin. As a result, this causes a decrease in heat resistance, moisture resistance, etc. of the cured product.
本発明の硬化剤ではジシクロペンタジェン変性クレゾー
ル樹脂中のトリシクロデカン環が疎水基として鋤くため
、エポキシ樹脂組成物として用いた場合、従来のノボラ
ック型硬化剤に比べ、耐水性を大きく向上させることが
できる。In the curing agent of the present invention, the tricyclodecane ring in the dicyclopentadiene-modified cresol resin acts as a hydrophobic group, so when used in an epoxy resin composition, water resistance is greatly improved compared to conventional novolak type curing agents. can be done.
また得られたエポキシ樹脂の硬化体に可撓性を付与する
こともできる。成形材料に適用する場合、流動特性が重
要であり、本発明の硬化剤によれば、ノボラック型樹脂
を使用した場合に比較して低温で流動性を示す。It is also possible to impart flexibility to the obtained cured epoxy resin. When applied to molding materials, fluidity is important, and the curing agent of the present invention exhibits fluidity at lower temperatures than when a novolac type resin is used.
本発明で用いるこの樹脂は、アセトン、メチルエチルケ
１ヘン、テトラヒドロフラン、クロロホルム、メタノー
ル、エタノール等の有は溶剤に溶解し、種々のエポキシ
樹脂、トリフェニルフォスフェート、トリクレジルフ４
スフェーｉ〜可塑化剤等と相溶する。The resin used in the present invention can be dissolved in a solvent such as acetone, methyl ethyl phenol, tetrahydrofuran, chloroform, methanol, ethanol, etc., and can be dissolved in various epoxy resins, triphenyl phosphate, tricresilyl fluoride, etc.
Compatible with Sphe I ~ plasticizers, etc.
本発明の適用を受けるエポキシ樹脂は、公知のものが用
いられる。これらのエポキシ樹脂は、一分子当り少なく
とも２個のエポキシ基を有し、多価アル］−ル、多価フ
ェノール、多価カルボン酸あるいは多価アミンなどのグ
リシジル化合物でおるグリシジル型エポキシ樹脂や非グ
リシジル型エポキシ樹脂が挙げられる。As the epoxy resin to which the present invention is applied, publicly known epoxy resins are used. These epoxy resins have at least two epoxy groups per molecule, and include glycidyl-type epoxy resins made of glycidyl compounds such as polyhydric alcohols, polyhydric phenols, polyhydric carboxylic acids, or polyhydric amines, and non-glycidyl epoxy resins. Examples include glycidyl-type epoxy resins.
本発明の硬化剤とエポキシ樹脂との配合比は、本発明の
硬化剤の活性水素当用とエポキシ樹脂のエポキシ化ｍと
の比率で決定するのが通常であるが、多少当量比がずれ
ても所期の性能は十分発揮されるので、特に配合比を限
定する必要はない。The compounding ratio of the curing agent of the present invention and the epoxy resin is usually determined by the ratio of the active hydrogen equivalent of the curing agent of the present invention to the epoxidized m of the epoxy resin. Since the desired performance is sufficiently exhibited, there is no need to particularly limit the blending ratio.
このエポキシ樹脂組成物には、硬化剤の仙に必要に応じ
てカーボンファイバー、グラスファイバー、可塑剤、有
機溶剤２反応性希釈剤、増量剤、充填剤、補強剤、顔料
、難燃比剤、増粘剤、促進剤及び可撓性付与剤等の種々
の添加剤を配合することができる。エポキシ樹脂の硬化
促進剤としては、一般的に用いられる複素環式アミン類
、三フッ化ホウ素等のルイス酸及びそれらの塩類、有機
酸類、有機酸無水物類、尿素若しくはそれらの誘シ９体
類を単一あるいは混合して使用することができる。This epoxy resin composition contains carbon fiber, glass fiber, plasticizer, organic solvent 2-reactive diluent, extender, filler, reinforcing agent, pigment, flame retardant, and reinforcing agent as required in addition to the curing agent. Various additives such as a viscosity agent, an accelerator, and a flexibility imparting agent can be included. As curing accelerators for epoxy resins, commonly used heterocyclic amines, Lewis acids such as boron trifluoride and their salts, organic acids, organic acid anhydrides, urea or their derivatives are used. These types can be used singly or in combination.
本発明のエポキシ樹脂組成物は、エポキシ樹脂と硬化剤
の相溶性がよく、このエポキシ樹脂組成物を硬化ざ１１
ることにより１５Ｉられるエポキシ樹脂硬化物は、可撓
性に富み、接着性が強力で剥離強度が高く、衝撃に耐え
、耐水性が高く、高い絶縁性を示し、耐薬品性が良好で
ある等、種々のりぐれた性能を発揮する。The epoxy resin composition of the present invention has good compatibility between the epoxy resin and the curing agent.
The cured epoxy resin produced by 15I is highly flexible, has strong adhesion, high peel strength, can withstand impact, has high water resistance, exhibits high insulation properties, and has good chemical resistance. , exhibits various excellent performances.
（実施例および発明の効果〕
以下に本発明の硬化剤の特徴を一層明確にするために、
実施例によって具体的に説明する。(Examples and effects of the invention) In order to further clarify the characteristics of the curing agent of the present invention,
This will be specifically explained using examples.
ただし、本発明はこれらの実施例に限定されるものでは
ない。以下に単に部とあるのはいずれも重量品を示す。However, the present invention is not limited to these examples. In the following, parts simply refer to heavy items.
実施例１
第１表に示すオルソクレゾールノボラックエポキシ樹脂
（エポキシ当１２１６９／ｅ（１）に一般式［Ｉ］ ′
ｃ示されるジシクロペンタジェン変性Ｏ−クレゾール樹
脂（水酸基当ｆｆ１１８５ ）を化学量論的に添加し、
硬化促進剤として２−メチルイミダゾール（２−Ｍ Ｉ
） ０．８部を配合し、１６０℃で１３時間、次いで
２３０’Ｃで２時間加熱し硬化させた。硬化体の物性を
第１表に示す３゜実施例２
実施例１と同様に第１表に示した配合比でＡルック１ノ
ゾールノボラツクエボキシ樹脂（エポキシ当ｆｆ１２１
６ ｙ／ｅｑ）と、ジシクロペンクジ１ン変性ｐ−クレ
ゾール樹脂（水酸基当ｍ１８５ ）を混合し、２−メチ
ルイミダゾール０．８部を配合して１６０℃で１３時間
、次いで２３０℃で２時間加熱硬化させた。硬化体の物
性を第１表に示す。Example 1 Orthocresol novolak epoxy resin shown in Table 1 (epoxy 12169/e(1) with general formula [I]'
c Add the dicyclopentadiene-modified O-cresol resin (hydroxyl group ff1185) shown stoichiometrically,
2-methylimidazole (2-M I
) 0.8 part was blended and cured by heating at 160°C for 13 hours and then at 230'C for 2 hours. The physical properties of the cured product are shown in Table 1. Example 2 A look 1 nosol novolac epoxy resin (epoxy ff121
6 y/eq) and dicyclopenk dione-modified p-cresol resin (m185 per hydroxyl group), blended with 0.8 parts of 2-methylimidazole, and heat-cured at 160°C for 13 hours, then at 230°C for 2 hours. I let it happen. Table 1 shows the physical properties of the cured product.
比較例１
実施例１で用いたジシクロペンタジェン変性Ｏ−クレゾ
ール樹脂に代えて、フェノールノボラック樹脂を使用し
た以外同様な処理を行なった。得られた硬化体の物性を
第１表に併記（）た。Comparative Example 1 The same treatment was carried out except that a phenol novolak resin was used in place of the dicyclopentadiene-modified O-cresol resin used in Example 1. The physical properties of the obtained cured product are also listed in Table 1 ().
以上の記載および第１表から明らかなように、本発明の
樹脂組成物はエポキシ樹脂硬化剤としてジシク［］ペン
タジェン変性クレゾール樹脂を用いることによって電気
特性１機械的特性を損うことなく可撓性、耐水性、耐桑
品性、低温作業性に優れかつ貯蔵安定性の優れたエポキ
シ樹脂硬化物をを得ることができた。この硬化物は積層
板用樹脂、ＩＣ封止剤用樹脂など民生用電子部品の進歩
に十分対応できる大変有利なものである。As is clear from the above description and Table 1, the resin composition of the present invention has flexibility without impairing electrical properties 1 and mechanical properties by using dicyclo[]pentadiene-modified cresol resin as an epoxy resin curing agent. It was possible to obtain a cured epoxy resin product having excellent water resistance, mulberry resistance, low-temperature workability, and storage stability. This cured product is very advantageous as it can fully respond to advances in consumer electronic components such as resins for laminates and resins for IC sealants.
′−、’、’７ゝ＼。′−、′、′7ゝ＼.
Claims (1)
成分とするエポキシ樹脂組成物。[Claims] Dicyclopentadiene represented by the following general formula [ I ] ▲ Numerical formulas, chemical formulas, tables, etc. are available ▼ [ I ] (In the formula, R is a methyl group and n is an integer from 0 to 15.) An epoxy resin composition containing cresol resin as an essential component.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60-244769 | 1985-10-31 | ||
| JP60244769 | 1985-10-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62201923A true JPS62201923A (en) | 1987-09-05 |
| JPH0340053B2 JPH0340053B2 (en) | 1991-06-17 |
Family
ID=17123631
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25030086A Granted JPS62201922A (en) | 1985-10-31 | 1986-10-21 | Epoxy resin composition |
| JP25030186A Granted JPS62201923A (en) | 1985-10-31 | 1986-10-21 | Epoxy resin composition |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25030086A Granted JPS62201922A (en) | 1985-10-31 | 1986-10-21 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (2) | JPS62201922A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03166220A (en) * | 1989-11-25 | 1991-07-18 | Matsushita Electric Works Ltd | Epoxy resin composition for sealing semiconductor |
| JPH03167251A (en) * | 1989-11-27 | 1991-07-19 | Matsushita Electric Works Ltd | Epoxy resin composition for semiconductor sealing |
| JPH05148410A (en) * | 1991-11-26 | 1993-06-15 | Shin Etsu Chem Co Ltd | Thermosetting resin composition and semiconductor device |
| KR100421927B1 (en) * | 2001-08-21 | 2004-03-12 | 제일모직주식회사 | Epoxy Resin Compound for Sealing Semiconductive Device |
| KR100480945B1 (en) * | 2001-12-28 | 2005-04-06 | 제일모직주식회사 | Epoxy Resin Composition for Sealing Semiconductor Device |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01105562A (en) * | 1987-10-19 | 1989-04-24 | Sumitomo Bakelite Co Ltd | Resin-sealed semiconductor device |
| JPH0597970A (en) * | 1991-10-07 | 1993-04-20 | Shin Etsu Chem Co Ltd | Thermosetting resin composition and semiconductor device |
| EP0705856A2 (en) | 1994-10-07 | 1996-04-10 | Shell Internationale Researchmaatschappij B.V. | Epoxy resin composition for semiconductor encapsulation |
| JPH10245473A (en) * | 1997-03-03 | 1998-09-14 | Yuka Shell Epoxy Kk | Epoxy resin composition |
| EP2284216B1 (en) | 2009-08-07 | 2012-03-28 | Ticona LLC | Low formaldehyde emission polyacetal composition |
| BR112014007774B1 (en) | 2011-09-29 | 2020-08-11 | Ticona Llc | MOLDED PRODUCT, POLYMERIC COMPOSITION AND PROCESS FOR THE PRODUCTION OF MOLDED PRODUCTS |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5499160A (en) * | 1978-01-20 | 1979-08-04 | Nippon Oil Co Ltd | Epoxy resin composition |
-
1986
- 1986-10-21 JP JP25030086A patent/JPS62201922A/en active Granted
- 1986-10-21 JP JP25030186A patent/JPS62201923A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5499160A (en) * | 1978-01-20 | 1979-08-04 | Nippon Oil Co Ltd | Epoxy resin composition |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03166220A (en) * | 1989-11-25 | 1991-07-18 | Matsushita Electric Works Ltd | Epoxy resin composition for sealing semiconductor |
| JPH03167251A (en) * | 1989-11-27 | 1991-07-19 | Matsushita Electric Works Ltd | Epoxy resin composition for semiconductor sealing |
| JPH05148410A (en) * | 1991-11-26 | 1993-06-15 | Shin Etsu Chem Co Ltd | Thermosetting resin composition and semiconductor device |
| KR100421927B1 (en) * | 2001-08-21 | 2004-03-12 | 제일모직주식회사 | Epoxy Resin Compound for Sealing Semiconductive Device |
| KR100480945B1 (en) * | 2001-12-28 | 2005-04-06 | 제일모직주식회사 | Epoxy Resin Composition for Sealing Semiconductor Device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0340052B2 (en) | 1991-06-17 |
| JPH0340053B2 (en) | 1991-06-17 |
| JPS62201922A (en) | 1987-09-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4532308A (en) | Epoxy resin composition | |
| US5317068A (en) | Composition of tetraglycidyl, triglycidyl and diglycidyl epoxy resins | |
| JPS62201923A (en) | Epoxy resin composition | |
| US4912179A (en) | Bisphenol A epoxy resin mixtures with aromatic di-secondary amine | |
| JPH0575775B2 (en) | ||
| JP2002069155A (en) | Epoxy resin composition | |
| JP2007217463A (en) | Epoxy resin composition and composite material intermediate | |
| WO2021099439A1 (en) | Peo-ppo-peo triblockcopolymers as additives for epoxide-anhydride systems | |
| JP3267636B2 (en) | Epoxy resin composition and electronic component sealing material | |
| JPH0797434A (en) | Epoxy resin composition | |
| JP2646391B2 (en) | Liquid epoxy resin composition | |
| JPS6239616A (en) | Epoxy resin composition | |
| JPH0532866A (en) | Light-transmitting epoxy resin composition and photosemiconductor device | |
| JPS58206674A (en) | Adhesive composition | |
| JPH06838B2 (en) | Resin composition | |
| US4038338A (en) | New polyepoxide-polysiloxane compounds | |
| JPS61143419A (en) | Resin composition and intermediate for composite material | |
| JPH02117913A (en) | Epoxy resin composition | |
| JPS62260820A (en) | Polymerizable composition | |
| JPH07238145A (en) | Epoxy resin composition | |
| JPS62104830A (en) | Curing agent for epoxy resin | |
| JP3941937B2 (en) | Epoxy resin composition | |
| JPH05179108A (en) | Thermosetting resin composition | |
| JPH01247414A (en) | Epoxy resin composition for sealing optical semiconductor | |
| KR960015972B1 (en) | Epoxy resin powder coating composition |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |