JPS62201922A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS62201922A JPS62201922A JP25030086A JP25030086A JPS62201922A JP S62201922 A JPS62201922 A JP S62201922A JP 25030086 A JP25030086 A JP 25030086A JP 25030086 A JP25030086 A JP 25030086A JP S62201922 A JPS62201922 A JP S62201922A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- dicyclopentadiene
- epoxy
- resin composition
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 33
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 33
- 239000000203 mixture Substances 0.000 title claims abstract description 12
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims abstract description 3
- 239000005011 phenolic resin Substances 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 abstract description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 8
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical class [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract description 4
- 238000009413 insulation Methods 0.000 abstract description 4
- -1 oxo cresol Chemical compound 0.000 abstract description 4
- 125000003700 epoxy group Chemical group 0.000 abstract description 3
- 229920003986 novolac Polymers 0.000 abstract description 3
- 239000003960 organic solvent Substances 0.000 abstract description 3
- 239000004014 plasticizer Substances 0.000 abstract description 3
- 229920000049 Carbon (fiber) Polymers 0.000 abstract description 2
- 239000000654 additive Substances 0.000 abstract description 2
- 239000004917 carbon fiber Substances 0.000 abstract description 2
- 239000011968 lewis acid catalyst Substances 0.000 abstract description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 abstract description 2
- 238000002156 mixing Methods 0.000 abstract description 2
- 229930003836 cresol Natural products 0.000 abstract 1
- 239000003365 glass fiber Substances 0.000 abstract 1
- 239000012766 organic filler Substances 0.000 abstract 1
- 239000012860 organic pigment Substances 0.000 abstract 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 7
- 150000002989 phenols Chemical class 0.000 description 7
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 229910015900 BF3 Inorganic materials 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 3
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 239000002562 thickening agent Substances 0.000 description 2
- KMZHZAAOEWVPSE-UHFFFAOYSA-N 2,3-dihydroxypropyl acetate Chemical compound CC(=O)OCC(O)CO KMZHZAAOEWVPSE-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000001165 hydrophobic group Chemical group 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、耐熱性、耐水性、可撓性及び絶縁性に優れた
エポキシ樹脂組成物に閉覆るものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention covers an epoxy resin composition having excellent heat resistance, water resistance, flexibility, and insulation properties.
〔従来の技術および発明が解決ずべき問題点〕現在、エ
ポキシ樹脂の硬化剤としては、芳香族ポリアミン、ジシ
アンジアミド、酸無水物。[Problems to be solved by conventional techniques and inventions] At present, aromatic polyamines, dicyandiamide, and acid anhydrides are used as curing agents for epoxy resins.
ＢＦ３錯体等が使われている。しかしながら、このよう
な硬化剤が配合されているエポキシ樹脂組成物は、それ
ぞれ次のような問題を有している。すなわち芳香族ポリ
アミンを用いたものは貯蔵安定性に欠け、しかもその硬
化物の耐湿性が悪い。また、ジシアンジアミドを用いた
ものは、優れた貯蔵安定性を示すが、その硬化物が耐熱
性に欠ｃノ、しかも硬化速度が遅い。酸無水物を用いた
ものは、耐熱性に比較的優れた硬化物を生成するが、吸
湿しやすく貯蔵安定性に欠ける。ＢＦ３鉗体を用いたも
のは、貯蔵安定性に優れ、速硬性を有するが、生成硬化
物が吸湿するとその電気特性が劣化する１、このように
従来の硬化剤を用いた場合、耐熱性、耐水性に富む硬化
物を生成でき、かつ貯蔵安定性に優れた組成物を１ηる
ことは回動であった。BF3 complex etc. are used. However, epoxy resin compositions containing such curing agents have the following problems. That is, products using aromatic polyamines lack storage stability, and their cured products have poor moisture resistance. Further, those using dicyandiamide exhibit excellent storage stability, but the cured product thereof lacks heat resistance and has a slow curing speed. Those using acid anhydrides produce cured products with relatively excellent heat resistance, but tend to absorb moisture and lack storage stability. Products using BF3 forceps have excellent storage stability and quick curing, but when the cured product absorbs moisture, its electrical properties deteriorate1.When using conventional curing agents, heat resistance, It was possible to create a composition that can produce a cured product with high water resistance and has excellent storage stability.
（問題点を解決するための手段）
本発明者らは、耐熱性、耐水性、可撓性に富む硬化物を
生成でき、かつ貯蔵安定性の優れたエポキシ樹脂組成物
を１ｑるために鋭意検討の結果、硬化剤としてジシクロ
ペンタジェン変性フェノール樹脂を使用することにより
目的が達成できることを見いだし、本発明に至ったもの
である。(Means for Solving the Problems) The present inventors have worked diligently to produce an epoxy resin composition that can produce a cured product with high heat resistance, water resistance, and flexibility, and has excellent storage stability. As a result of studies, it was discovered that the objective could be achieved by using a dicyclopentadiene-modified phenol resin as a curing agent, leading to the present invention.
すなわら本発明は、下記一般式［Ｉ］
（式中ｎはＯ〜１５の整数を示す。）
で示されるジシクロペンタジェン変性フェノール樹脂を
硬化剤とするエポキシ樹脂組成物を提供したものである
。That is, the present invention provides an epoxy resin composition using a dicyclopentadiene-modified phenolic resin represented by the following general formula [I] (wherein n represents an integer of O to 15) as a curing agent. It is.
（作 用）
上記一般式［工］で示されるジシク］」ペンタジェン変
性フェノール樹脂は、ジシクロペンタジェンとフェノー
ルをルイス酸触媒中で手合することによって１ｑられる
。(Function) The dicyclopentadiene-modified phenol resin represented by the above general formula [D] is produced by combining dicyclopentadiene and phenol in a Lewis acid catalyst.
］へリシクロデカン環を０有することは樹脂の化学梠造
からみてもわかるように水酸基の間隔が拡がり、エポキ
シ基との反応率が上がるため、架橋密度を適度にコント
ロールできる。このため弾性率が低下し、トリシクロデ
カン環の疎水性により吸水率を下げることができる。] As can be seen from the chemical layering of the resin, the presence of zero helicyclodecane rings widens the spacing between hydroxyl groups and increases the reaction rate with epoxy groups, making it possible to appropriately control the crosslinking density. Therefore, the elastic modulus decreases, and the water absorption rate can be lowered due to the hydrophobicity of the tricyclodecane ring.
従来のノボラック型樹脂はメヂレン基でフェノール類と
結合している。このため硬化剤がエポキシ樹脂中のグリ
シジル基と反応した際に、隣接のグリシジル基が立体障
害によって反応を妨げられ、エポキシ樹脂の硬化特性が
低下する要因に動く。この結果、硬化物の耐熱性、耐湿
性などを低下させる原因となっている。Conventional novolak-type resins are bonded to phenols through medilene groups. For this reason, when the curing agent reacts with the glycidyl groups in the epoxy resin, the reaction is hindered by steric hindrance of the adjacent glycidyl groups, which becomes a factor in reducing the curing properties of the epoxy resin. As a result, this causes a decrease in heat resistance, moisture resistance, etc. of the cured product.
本発明の硬化剤ではジシクロペンタジェン変性フェノー
ル樹脂中のトリシクロデカン環が疎水基として働くため
、エポキシ樹脂組成物として用いた場合、従来のノボラ
ック型硬化剤に比べ、耐水性を大ぎく向上させることが
できる。In the curing agent of the present invention, the tricyclodecane ring in the dicyclopentadiene-modified phenol resin acts as a hydrophobic group, so when used in an epoxy resin composition, water resistance is greatly improved compared to conventional novolak type curing agents. can be done.
また１ｑられたエポキシ樹脂の硬化体に可撓性を句与す
ることもできる。成形＋、（別に適用する場合、流動特
性が重要であり、本発明の硬化剤によれば、ノボラック
型樹脂を使用した場合に比較して低温で流動性を示す。It is also possible to impart flexibility to the cured product of the 1q epoxy resin. Molding + (In other applications, flow properties are important, and the curing agent of the present invention exhibits flow properties at lower temperatures than when novolak-type resins are used.
またフェニル核成分としてフェノールを用いることによ
り、エポキシ当量が小さくなり、耐熱性をざらに向上さ
せることができる。Furthermore, by using phenol as the phenyl core component, the epoxy equivalent can be reduced, and the heat resistance can be greatly improved.
本発明で用いるこの樹脂は、アセＩ〜ン、メチルエチル
ケトン、テトラヒドロフラン、クロロホルム、メタノー
ル、エタノール等の有機溶剤に溶解し、種々のエポキシ
樹脂、ｉ〜リフェニルフ号ススフェートトリクレジシ７
オスフｘ−ト可塑化剤等と相溶する。This resin used in the present invention can be dissolved in an organic solvent such as acetin, methyl ethyl ketone, tetrahydrofuran, chloroform, methanol, ethanol, etc., and can be dissolved in various epoxy resins,
Compatible with Osft plasticizers, etc.
本発明の適用を受けるエポキシ樹脂は、公知のものが用
いられる。これらのエポキシ樹脂は、一分子当り少なく
とも２個のエポキシ基を有し、多価アルコール、多価フ
ェノール、多価カルボンＷ１１ｃｉるいは多価アミンな
どのグリシジル化合物でおるグリシジル型エポキシ樹脂
や非グリシジル型エポキシ樹脂が挙げられる。As the epoxy resin to which the present invention is applied, publicly known epoxy resins are used. These epoxy resins have at least two epoxy groups per molecule, and include glycidyl-type epoxy resins and non-glycidyl-type epoxy resins made of glycidyl compounds such as polyhydric alcohols, polyhydric phenols, polyhydric carbon W11ci, or polyhydric amines. Examples include epoxy resins.
本発明の硬化剤とエポキシ樹脂との配合比は、本発明の
硬化剤の活性水素当ｍとエポキシ樹脂のエポキシ当量と
の比率で決定するのが通常であるが、多少当量比がずれ
ても所期の性能は上の発揮されるので、待に配合比を限
定する必要はない。The compounding ratio of the curing agent of the present invention and the epoxy resin is usually determined by the ratio of the active hydrogen equivalent of the curing agent of the present invention to the epoxy equivalent of the epoxy resin, but even if the equivalent ratio deviates slightly, Since the desired performance is achieved, there is no need to limit the blending ratio.
このエポキシ樹脂組成物には、硬化剤の他に必要に応じ
てカーボンファイバー、ゲラスフ７フイバー、可塑剤、
有機溶剤１反応性希釈剤、増但剤、充填剤、補強剤、顔
料、ｉ燃比剤、増粘剤、促進剤及び可撓性付与剤等の種
々の添加剤を配合することができる。エポキシ樹脂の（
Ｗ化促進剤としては、一般的に用いられる複素環式アミ
ン類、三フッ化ホウ素等のルイス酸及びそれらの塩類、
有機酸類、有機酸無水物類、尿素若しくはそれらの誘導
体類を単−必るいは混合して使用することができる。In addition to the curing agent, this epoxy resin composition may optionally contain carbon fiber, gelasfu 7 fiber, plasticizer,
Organic solvent 1 Various additives such as reactive diluents, thickeners, fillers, reinforcing agents, pigments, fuel ratio agents, thickeners, accelerators, and flexibility imparting agents can be blended. Epoxy resin (
Examples of the W conversion accelerator include commonly used heterocyclic amines, Lewis acids such as boron trifluoride, and their salts;
Organic acids, organic acid anhydrides, urea or their derivatives can be used singly or in combination.
本発明のエポキシ樹脂組成物は、エポキシ樹脂と硬化剤
の相溶性がよく、このエポキシ樹脂組成物８硬化さける
ことにより得られるエポキシ樹脂硬化物は、可撓性に富
み接着性が強力で剥離強度が高く、衝撃に耐え、耐水性
か高く、高い絶縁性を示し、耐薬品性が良好である等、
種々のすぐれた性能を発揮する。The epoxy resin composition of the present invention has good compatibility between the epoxy resin and the curing agent, and the cured epoxy resin obtained by avoiding curing of this epoxy resin composition 8 has high flexibility, strong adhesiveness, and peel strength. It has high resistance to shock, high water resistance, high insulation properties, good chemical resistance, etc.
Demonstrates various excellent performances.
（実施例および発明の効果〕
以下に本発明の硬化剤の特徴を一層明確にするために、
実施例によって置体的に説明する。(Examples and effects of the invention) In order to further clarify the characteristics of the curing agent of the present invention,
This will be explained in detail using an example.
ただ（）、本発明はこれらの実施例に限定されるもので
はない。以下に単に部とあるのはいずれも重量部を示す
。However, the present invention is not limited to these examples. All parts hereinafter simply indicate parts by weight.
実施例１
第１表に示すエポキシ樹脂に一般式［Ｉ］で示されるジ
シクロペンタジェン変性フェノール樹脂を化学ｍ論的に
添加し、硬化促進剤として２−メチルイミダゾール（２
−Ｍ Ｉ ） ０．８部を配合し、１６０℃で１３時間
、ついで２３０°Ｃで２時間加熱ｌノ硬化させた。硬化
体の物性を第１表に示す。Example 1 A dicyclopentadiene-modified phenol resin represented by the general formula [I] was chemically added to the epoxy resin shown in Table 1, and 2-methylimidazole (2
-MI) 0.8 part was blended and cured by heating at 160°C for 13 hours and then at 230°C for 2 hours. Table 1 shows the physical properties of the cured product.
比較例１
実施例１で用いたジシクロペンタジェン変性フェノール
樹脂に代えて、フェノールノボラック型樹脂を使用した
以外同様な処理を行なった。Comparative Example 1 The same treatment was carried out except that a phenol novolak type resin was used in place of the dicyclopentadiene-modified phenol resin used in Example 1.
１ｑられた硬化体の物性を第１表に併記した。The physical properties of the cured product are also listed in Table 1.
以上の記載おＪ、び第１表から明らかなように、本発明
の樹脂組成物はエポキシ樹脂硬化剤としてジシクロペン
タジェン変性フェノール樹脂を用いることによって絶縁
性、可撓性、耐水性。As is clear from the above description and Table 1, the resin composition of the present invention exhibits insulation, flexibility, and water resistance by using dicyclopentadiene-modified phenolic resin as an epoxy resin curing agent.
耐薬品性に優れたエポキシ樹脂硬化物を得ることができ
た。この硬化物は積層板やＩＣ月止剤用樹脂などの民牛
用電了部品の退歩に十分対応できる非常に右利なもので
ある。A cured epoxy resin with excellent chemical resistance could be obtained. This cured product is extremely useful and can sufficiently cope with the deterioration of electronic parts for civil use, such as laminates and resins for IC adhesives.
Claims (1)
成分とするエポキシ樹脂組成物。[Claims] Dicyclopentadiene phenol resin represented by the following general formula [I] ▲Mathematical formulas, chemical formulas, tables, etc.▼ [I] (In the formula, n represents an integer from 0 to 15) as an essential component An epoxy resin composition.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60-244769 | 1985-10-31 | ||
| JP60244769 | 1985-10-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62201922A true JPS62201922A (en) | 1987-09-05 |
| JPH0340052B2 JPH0340052B2 (en) | 1991-06-17 |
Family
ID=17123631
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25030186A Granted JPS62201923A (en) | 1985-10-31 | 1986-10-21 | Epoxy resin composition |
| JP25030086A Granted JPS62201922A (en) | 1985-10-31 | 1986-10-21 | Epoxy resin composition |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25030186A Granted JPS62201923A (en) | 1985-10-31 | 1986-10-21 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (2) | JPS62201923A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01105562A (en) * | 1987-10-19 | 1989-04-24 | Sumitomo Bakelite Co Ltd | Resin-sealed semiconductor device |
| DE4233450A1 (en) * | 1991-10-07 | 1993-04-08 | Shinetsu Chemical Co | HEAT-RESISTABLE RESIN COMPOSITIONS AND ENCLOSED SEMICONDUCTOR DEVICES |
| JPH05148410A (en) * | 1991-11-26 | 1993-06-15 | Shin Etsu Chem Co Ltd | Thermosetting resin composition and semiconductor device |
| EP0705856A2 (en) | 1994-10-07 | 1996-04-10 | Shell Internationale Researchmaatschappij B.V. | Epoxy resin composition for semiconductor encapsulation |
| US5900468A (en) * | 1997-03-03 | 1999-05-04 | Shell Oil Company | Epoxy resin composition |
| US8921471B2 (en) | 2009-08-07 | 2014-12-30 | Ticona Llc | Low formaldehyde emission polyacetal composition |
| US8975313B2 (en) | 2011-09-29 | 2015-03-10 | Ticona Llc | Polymer composition for producing articles having a metallic appearance |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0689112B2 (en) * | 1989-11-25 | 1994-11-09 | 松下電工株式会社 | Epoxy resin composition for semiconductor encapsulation |
| JPH0689113B2 (en) * | 1989-11-27 | 1994-11-09 | 松下電工株式会社 | Epoxy resin composition for semiconductor encapsulation |
| KR100421927B1 (en) * | 2001-08-21 | 2004-03-12 | 제일모직주식회사 | Epoxy Resin Compound for Sealing Semiconductive Device |
| KR100480945B1 (en) * | 2001-12-28 | 2005-04-06 | 제일모직주식회사 | Epoxy Resin Composition for Sealing Semiconductor Device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5499160A (en) * | 1978-01-20 | 1979-08-04 | Nippon Oil Co Ltd | Epoxy resin composition |
-
1986
- 1986-10-21 JP JP25030186A patent/JPS62201923A/en active Granted
- 1986-10-21 JP JP25030086A patent/JPS62201922A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5499160A (en) * | 1978-01-20 | 1979-08-04 | Nippon Oil Co Ltd | Epoxy resin composition |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01105562A (en) * | 1987-10-19 | 1989-04-24 | Sumitomo Bakelite Co Ltd | Resin-sealed semiconductor device |
| JPH0567650B2 (en) * | 1987-10-19 | 1993-09-27 | Sumitomo Bakelite Co | |
| DE4233450A1 (en) * | 1991-10-07 | 1993-04-08 | Shinetsu Chemical Co | HEAT-RESISTABLE RESIN COMPOSITIONS AND ENCLOSED SEMICONDUCTOR DEVICES |
| JPH0597970A (en) * | 1991-10-07 | 1993-04-20 | Shin Etsu Chem Co Ltd | Thermosetting resin composition and semiconductor device |
| US5312878A (en) * | 1991-10-07 | 1994-05-17 | Shin-Etsu Chemical Company, Limited | Naphthalene containing epoxy resin cured with a dicyclopentadiene phenolic resin |
| JPH05148410A (en) * | 1991-11-26 | 1993-06-15 | Shin Etsu Chem Co Ltd | Thermosetting resin composition and semiconductor device |
| EP0705856A2 (en) | 1994-10-07 | 1996-04-10 | Shell Internationale Researchmaatschappij B.V. | Epoxy resin composition for semiconductor encapsulation |
| US5900468A (en) * | 1997-03-03 | 1999-05-04 | Shell Oil Company | Epoxy resin composition |
| US8921471B2 (en) | 2009-08-07 | 2014-12-30 | Ticona Llc | Low formaldehyde emission polyacetal composition |
| US8975313B2 (en) | 2011-09-29 | 2015-03-10 | Ticona Llc | Polymer composition for producing articles having a metallic appearance |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62201923A (en) | 1987-09-05 |
| JPH0340053B2 (en) | 1991-06-17 |
| JPH0340052B2 (en) | 1991-06-17 |
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|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |