JPH0567650B2 - - Google Patents

Description

[Detailed description of the invention]

[Industrial Application Field] The present invention relates to a resin-sealed semiconductor device with excellent thermal shock resistance, and more specifically to an epoxy resin composition with excellent crack resistance even when subjected to rapid temperature changes. The present invention relates to a semiconductor device sealed with a material. [Prior Art] With the recent trend toward lighter, thinner, and shorter electronic products, semiconductor set manufacturers are increasingly shifting from conventional through-hole mounting to surface mounting in order to improve the packaging density of semiconductor devices. On automated surface mounting lines, semiconductor devices are subject to rapid temperature changes when soldering leads, which can cause cracks in the resin molding, deteriorate the interface between lead resins, and reduce moisture resistance as a result. Problems such as doing this may occur. To solve these problems, thermoplastic oligomers are added (Japanese Patent Laid-Open No. 62-115849) and various silicone compounds are added (Japanese Patent Laid-Open No. 62-115850) to alleviate the thermal shock during solder immersion. ), 62−
116654, 62-128162) and silicone modification (Japanese Patent Application Laid-Open No. 136860/1983), these methods all lead to cracks in the molded part after being dipped in solder, resulting in poor reliability. However, it has not been possible to obtain an excellent resin-sealed semiconductor device. In particular, the addition of these additives poses the problem of deteriorating workability during molding, and methods have been considered to improve the properties by changing the structure of the resin itself. These methods of changing the structure of the resin itself have various drawbacks, such as complicating the reaction process, and so far no satisfactory product has been obtained. By the way, JP-A-62-96521 and JP-A-62-104830 disclose methods using dicyclopentadiene phenolic polymer as a curing agent.
Although these have been announced, they all have different purposes and manufacturing methods. Especially JP-A-62-96521
The publication concerned with the production of laminates and multilayer printed boards, and the final composition is in the form of a varnish. Furthermore, the method disclosed in JP-A-62-104830 uses an imidazole-based curing accelerator, which significantly reduces moisture resistance. Furthermore, the final composition does not contain a filler and cannot satisfy the properties of strength and thermal expansion coefficient as a resin composition for semiconductor encapsulation. [Object of the Invention] The present invention was developed as a result of research aimed at obtaining a resin-encapsulated semiconductor device with excellent thermal shock resistance and reliability, which could not be obtained by using conventional resin compositions. An epoxy resin composition using a dicyclopentadiene phenolic polymer as a curing agent and further containing triphenylphosphine or 1,8-diazabicyclo(5,4,0)undecene alone or in combination as an essential component. The present invention was completed based on the discovery that a resin-sealed semiconductor device having excellent thermal shock resistance and reliability can be obtained by using the above method. [Structure of the Invention] The present invention uses an epoxy resin and a dicyclopentadiene phenolic polymer represented by the following general formula (1) as a curing agent in an equivalent ratio (number of epoxy groups/number of hydroxyl groups) to the epoxy resin. triphenylphosphine or 1,8-diazabicyclo(5,4,
0) The present invention relates to a resin-sealed semiconductor device characterized in that it is sealed with an epoxy resin composition containing undecene alone or in combination of one or more types thereof as an essential component. General formula (1)

〔Effect of the invention〕

As described above, the resin-sealed semiconductor device according to the present invention has excellent moisture resistance and crack resistance after being subjected to rapid temperature changes. Therefore, the present invention plays a very important role in industry since it has excellent properties required in recent surface mounting, especially thermal shock resistance, and is highly reliable. [Example] Epoxy resin, curing agent, curing accelerator and other raw materials were blended according to Table 1, mixed in a Henschel mixer, kneaded in a uniter, cooled and pulverized. Epoxy resin compositions of Comparative Examples 1 to 7 were obtained. Using the epoxy resin composition obtained according to the formulation shown in Table 1, a monitor IC incorporating an aluminum simulated element was molded at a molding temperature of 175°C and an injection time of 15 seconds, and a ring curing time of 15 seconds.
Transfer molding was performed for 90 seconds and post-curing was performed at 175° C. for 8 hours to obtain a resin-sealed semiconductor device. Table 2 shows the results of evaluating the surface hardness, moisture resistance, and crack resistance of the molded product of the resin-sealed semiconductor device obtained. As shown in Table 2, it can be seen that the Examples are superior in each reliability as compared to the Comparative Examples, and are particularly superior in moisture resistance and black resistance after solder immersion.

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Claims (1)

[Scope of Claims] 1 Epoxy resin and curing agent according to the following general formula (1)
An amount of the dicyclopentadiene phenolic polymer represented by the following formula to the epoxy resin such that the equivalent ratio (number of epoxy groups/number of hydroxyl groups) is 0.5 to 1.5, and triphenylphosphine or 1,8- as a curing accelerator. 1. A resin-sealed semiconductor device characterized in that it is encapsulated with an epoxy resin composition containing diazabicyclo(5,4,0) undecene alone or in combination as an essential component. [Chemical formula] (R in the formula represents a hydrogen atom, an alkyl group, a halogen such as chlorine, bromine, etc., and n represents an integer from 0 to 15.)