JPS62201922A - エポキシ樹脂組成物 - Google Patents

エポキシ樹脂組成物

Info

Publication number
JPS62201922A
JPS62201922A JP25030086A JP25030086A JPS62201922A JP S62201922 A JPS62201922 A JP S62201922A JP 25030086 A JP25030086 A JP 25030086A JP 25030086 A JP25030086 A JP 25030086A JP S62201922 A JPS62201922 A JP S62201922A
Authority
JP
Japan
Prior art keywords
epoxy resin
dicyclopentadiene
epoxy
resin composition
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP25030086A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0340052B2 (enExample
Inventor
Hiroaki Nanba
宏彰 難波
Eiji Kojima
小島　鋭士
Masato Tamao
玉生　征人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Kokusaku Pulp Co Ltd
Original Assignee
Sanyo Kokusaku Pulp Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Kokusaku Pulp Co Ltd filed Critical Sanyo Kokusaku Pulp Co Ltd
Publication of JPS62201922A publication Critical patent/JPS62201922A/ja
Publication of JPH0340052B2 publication Critical patent/JPH0340052B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP25030086A 1985-10-31 1986-10-21 エポキシ樹脂組成物 Granted JPS62201922A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60244769 1985-10-31
JP60-244769 1985-10-31

Publications (2)

Publication Number Publication Date
JPS62201922A true JPS62201922A (ja) 1987-09-05
JPH0340052B2 JPH0340052B2 (enExample) 1991-06-17

Family

ID=17123631

Family Applications (2)

Application Number Title Priority Date Filing Date
JP25030086A Granted JPS62201922A (ja) 1985-10-31 1986-10-21 エポキシ樹脂組成物
JP25030186A Granted JPS62201923A (ja) 1985-10-31 1986-10-21 エポキシ樹脂組成物

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP25030186A Granted JPS62201923A (ja) 1985-10-31 1986-10-21 エポキシ樹脂組成物

Country Status (1)

Country Link
JP (2) JPS62201922A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01105562A (ja) * 1987-10-19 1989-04-24 Sumitomo Bakelite Co Ltd 樹脂封止型半導体装置
DE4233450A1 (de) * 1991-10-07 1993-04-08 Shinetsu Chemical Co Waermehaertbare harzzusammensetzungen und damit eingekapselte halbleitereinrichtungen
JPH05148410A (ja) * 1991-11-26 1993-06-15 Shin Etsu Chem Co Ltd 熱硬化性樹脂組成物及び半導体装置
EP0705856A2 (en) 1994-10-07 1996-04-10 Shell Internationale Researchmaatschappij B.V. Epoxy resin composition for semiconductor encapsulation
US5900468A (en) * 1997-03-03 1999-05-04 Shell Oil Company Epoxy resin composition
US8921471B2 (en) 2009-08-07 2014-12-30 Ticona Llc Low formaldehyde emission polyacetal composition
US8975313B2 (en) 2011-09-29 2015-03-10 Ticona Llc Polymer composition for producing articles having a metallic appearance

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0689112B2 (ja) * 1989-11-25 1994-11-09 松下電工株式会社 半導体封止用エポキシ樹脂組成物
JPH0689113B2 (ja) * 1989-11-27 1994-11-09 松下電工株式会社 半導体封止用エポキシ樹脂組成物
KR100421927B1 (ko) * 2001-08-21 2004-03-12 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물
KR100480945B1 (ko) * 2001-12-28 2005-04-06 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5499160A (en) * 1978-01-20 1979-08-04 Nippon Oil Co Ltd Epoxy resin composition

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5499160A (en) * 1978-01-20 1979-08-04 Nippon Oil Co Ltd Epoxy resin composition

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01105562A (ja) * 1987-10-19 1989-04-24 Sumitomo Bakelite Co Ltd 樹脂封止型半導体装置
DE4233450A1 (de) * 1991-10-07 1993-04-08 Shinetsu Chemical Co Waermehaertbare harzzusammensetzungen und damit eingekapselte halbleitereinrichtungen
JPH0597970A (ja) * 1991-10-07 1993-04-20 Shin Etsu Chem Co Ltd 熱硬化性樹脂組成物及び半導体装置
US5312878A (en) * 1991-10-07 1994-05-17 Shin-Etsu Chemical Company, Limited Naphthalene containing epoxy resin cured with a dicyclopentadiene phenolic resin
JPH05148410A (ja) * 1991-11-26 1993-06-15 Shin Etsu Chem Co Ltd 熱硬化性樹脂組成物及び半導体装置
EP0705856A2 (en) 1994-10-07 1996-04-10 Shell Internationale Researchmaatschappij B.V. Epoxy resin composition for semiconductor encapsulation
US5900468A (en) * 1997-03-03 1999-05-04 Shell Oil Company Epoxy resin composition
US8921471B2 (en) 2009-08-07 2014-12-30 Ticona Llc Low formaldehyde emission polyacetal composition
US8975313B2 (en) 2011-09-29 2015-03-10 Ticona Llc Polymer composition for producing articles having a metallic appearance

Also Published As

Publication number Publication date
JPS62201923A (ja) 1987-09-05
JPH0340052B2 (enExample) 1991-06-17
JPH0340053B2 (enExample) 1991-06-17

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees