JPS6219754U - - Google Patents
Info
- Publication number
- JPS6219754U JPS6219754U JP11221485U JP11221485U JPS6219754U JP S6219754 U JPS6219754 U JP S6219754U JP 11221485 U JP11221485 U JP 11221485U JP 11221485 U JP11221485 U JP 11221485U JP S6219754 U JPS6219754 U JP S6219754U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- leads
- coined
- inner lead
- coming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 238000007789 sealing Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａ，ｂはそれぞれの考案に用いるリード
フレームのコイニングを施す前のインナーリード
部の一例を示す平面図、側面図、第１図ｃ，ｄは
それぞれ第１図ａ，ｂに示すインナーリード部に
コイニングを施した状態を示す平面図、側面図、
第２図ａ，ｂはそれぞれ従来のもののインナーリ
ード部の一例を示す平面図、側面図、第３図はこ
の考案がリード本数の増加に有利であることを示
す説明図、第４図はこの考案がタブの面拡大に有
利であることを示す説明図、第５図は水分浸入阻
止を考慮した実施例を示す説明図である。
１……インナーリード部、２……コイニング部
、３……タブ。
Figures 1a and b are plan and side views showing an example of the inner lead portion of the lead frame used in each design before coining, and Figures 1c and d are the inner leads shown in Figures 1a and b, respectively. A plan view and a side view showing the state where the lead part is coined,
Figures 2a and b are a plan view and a side view respectively showing an example of the conventional inner lead part, Figure 3 is an explanatory diagram showing that this invention is advantageous in increasing the number of leads, and Figure 4 is an illustration of this invention. FIG. 5 is an explanatory diagram showing that the invention is advantageous in expanding the surface of the tab, and FIG. 5 is an explanatory diagram showing an embodiment that takes into consideration prevention of moisture infiltration. 1...Inner lead part, 2...Coining part, 3...Tab.
Claims (1)
脂からのリード抜けを防ぐために、リードフレー
ムのモールド樹脂内に埋め込まれるインナーリー
ド部のコイニングを施したことを特徴とする半導
体装置。 1. A semiconductor device sealed with a resin, characterized in that an inner lead portion embedded in a mold resin of a lead frame is coined in order to prevent the leads from coming off from the sealing resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11221485U JPS6219754U (en) | 1985-07-22 | 1985-07-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11221485U JPS6219754U (en) | 1985-07-22 | 1985-07-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6219754U true JPS6219754U (en) | 1987-02-05 |
Family
ID=30992875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11221485U Pending JPS6219754U (en) | 1985-07-22 | 1985-07-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6219754U (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4918591U (en) * | 1972-05-19 | 1974-02-16 | ||
| JPS5128487A (en) * | 1974-09-04 | 1976-03-10 | Hitachi Ltd | |
| JPS5226878B1 (en) * | 1972-07-03 | 1977-07-16 | ||
| JPS5827352A (en) * | 1981-08-12 | 1983-02-18 | Hitachi Ltd | Semiconductor device |
| JPS5994834A (en) * | 1982-11-24 | 1984-05-31 | Nec Corp | Lead frame |
-
1985
- 1985-07-22 JP JP11221485U patent/JPS6219754U/ja active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4918591U (en) * | 1972-05-19 | 1974-02-16 | ||
| JPS5226878B1 (en) * | 1972-07-03 | 1977-07-16 | ||
| JPS5128487A (en) * | 1974-09-04 | 1976-03-10 | Hitachi Ltd | |
| JPS5827352A (en) * | 1981-08-12 | 1983-02-18 | Hitachi Ltd | Semiconductor device |
| JPS5994834A (en) * | 1982-11-24 | 1984-05-31 | Nec Corp | Lead frame |