JPS62192422A - エポキシ樹脂組成物の製法 - Google Patents
エポキシ樹脂組成物の製法Info
- Publication number
- JPS62192422A JPS62192422A JP3576886A JP3576886A JPS62192422A JP S62192422 A JPS62192422 A JP S62192422A JP 3576886 A JP3576886 A JP 3576886A JP 3576886 A JP3576886 A JP 3576886A JP S62192422 A JPS62192422 A JP S62192422A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- organopolysiloxane
- epoxy
- polybutadiene polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 58
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 58
- 239000000203 mixture Substances 0.000 title claims abstract description 51
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 42
- 229920002857 polybutadiene Polymers 0.000 claims abstract description 32
- 239000005062 Polybutadiene Substances 0.000 claims abstract description 31
- 229920000642 polymer Polymers 0.000 claims abstract description 30
- 239000007787 solid Substances 0.000 claims abstract description 30
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 13
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000000945 filler Substances 0.000 claims abstract description 9
- 239000002245 particle Substances 0.000 claims abstract description 9
- 150000002825 nitriles Chemical class 0.000 claims abstract description 6
- 239000000843 powder Substances 0.000 claims abstract description 6
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 6
- 238000009472 formulation Methods 0.000 claims description 4
- 125000003700 epoxy group Chemical group 0.000 abstract description 7
- 239000006185 dispersion Substances 0.000 abstract description 4
- 239000000178 monomer Substances 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 8
- 229920003986 novolac Polymers 0.000 description 8
- 239000004594 Masterbatch (MB) Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 239000011342 resin composition Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 125000000524 functional group Chemical group 0.000 description 4
- 239000005350 fused silica glass Substances 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 4
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical group C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 229910052801 chlorine Inorganic materials 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 229910002026 crystalline silica Inorganic materials 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- UKMSUNONTOPOIO-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O UKMSUNONTOPOIO-UHFFFAOYSA-N 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 235000021357 Behenic acid Nutrition 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241001441571 Hiodontidae Species 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 239000006230 acetylene black Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229940116226 behenic acid Drugs 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- KAKZBPTYRLMSJV-UHFFFAOYSA-N butadiene group Chemical class C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 125000005375 organosiloxane group Chemical group 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 150000003003 phosphines Chemical group 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 230000005477 standard model Effects 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3576886A JPS62192422A (ja) | 1986-02-19 | 1986-02-19 | エポキシ樹脂組成物の製法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3576886A JPS62192422A (ja) | 1986-02-19 | 1986-02-19 | エポキシ樹脂組成物の製法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62192422A true JPS62192422A (ja) | 1987-08-24 |
| JPH0310664B2 JPH0310664B2 (enrdf_load_stackoverflow) | 1991-02-14 |
Family
ID=12451043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3576886A Granted JPS62192422A (ja) | 1986-02-19 | 1986-02-19 | エポキシ樹脂組成物の製法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62192422A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01185350A (ja) * | 1988-01-18 | 1989-07-24 | Matsushita Electric Works Ltd | エポキシ樹脂成形材料 |
| US4933382A (en) * | 1987-03-20 | 1990-06-12 | Somar Corporation | Epoxy resin powder coating composition |
| JP2001279056A (ja) * | 2000-03-31 | 2001-10-10 | Toray Ind Inc | 半導体封止用エポキシ樹脂組成物 |
| KR20170127814A (ko) * | 2016-05-12 | 2017-11-22 | 삼성에스디아이 주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5981369A (ja) * | 1982-10-30 | 1984-05-11 | Matsushita Electric Works Ltd | 電気回路積層板用接着剤 |
| JPS6094428A (ja) * | 1983-10-28 | 1985-05-27 | Matsushita Electric Works Ltd | 封止用熱硬化性樹脂成形材料及びこれを用いて成形された電子部品 |
| JPS6126654A (ja) * | 1984-07-13 | 1986-02-05 | Matsushita Electric Works Ltd | 封止用エポキシ樹脂成形材料 |
-
1986
- 1986-02-19 JP JP3576886A patent/JPS62192422A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5981369A (ja) * | 1982-10-30 | 1984-05-11 | Matsushita Electric Works Ltd | 電気回路積層板用接着剤 |
| JPS6094428A (ja) * | 1983-10-28 | 1985-05-27 | Matsushita Electric Works Ltd | 封止用熱硬化性樹脂成形材料及びこれを用いて成形された電子部品 |
| JPS6126654A (ja) * | 1984-07-13 | 1986-02-05 | Matsushita Electric Works Ltd | 封止用エポキシ樹脂成形材料 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4933382A (en) * | 1987-03-20 | 1990-06-12 | Somar Corporation | Epoxy resin powder coating composition |
| JPH01185350A (ja) * | 1988-01-18 | 1989-07-24 | Matsushita Electric Works Ltd | エポキシ樹脂成形材料 |
| JP2001279056A (ja) * | 2000-03-31 | 2001-10-10 | Toray Ind Inc | 半導体封止用エポキシ樹脂組成物 |
| KR20170127814A (ko) * | 2016-05-12 | 2017-11-22 | 삼성에스디아이 주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0310664B2 (enrdf_load_stackoverflow) | 1991-02-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3175979B2 (ja) | 樹脂封止型半導体装置 | |
| JP2660012B2 (ja) | ゴム変性フェノール樹脂、エポキシ樹脂組成物及び樹脂封止型半導体装置 | |
| US6596813B2 (en) | Composition of epoxy resin, phenolic resin, butadiene particles and amino silicone oil | |
| JPS62192422A (ja) | エポキシ樹脂組成物の製法 | |
| JP2000017149A (ja) | 封止材用液状エポキシ樹脂組成物及びその硬化物 | |
| JP4706089B2 (ja) | エポキシ樹脂組成物及び半導体装置 | |
| JP2642966B2 (ja) | エポキシ樹脂組成物 | |
| JPH08199045A (ja) | エポキシ樹脂組成物の製造方法並びにその樹脂組成物を用いた半導体装置 | |
| JPH11116775A (ja) | 半導体封止用エポキシ樹脂組成物およびその製法 | |
| JP2593503B2 (ja) | エポキシ樹脂組成物及びそれを用いた樹脂封止型半導体装置 | |
| JP2001240726A (ja) | エポキシ樹脂組成物及び半導体装置 | |
| JP2002012654A (ja) | 半導体封止用エポキシ樹脂組成物 | |
| JPH04296046A (ja) | 樹脂封止型半導体装置 | |
| JP2690795B2 (ja) | エポキシ樹脂組成物 | |
| JPH03140322A (ja) | 半導体封止用エポキシ樹脂成形材料及び樹脂封止型半導体装置 | |
| JP3976390B2 (ja) | 半導体封止用エポキシ樹脂組成物の製法およびそれによって得られた半導体封止用エポキシ樹脂組成物ならびに半導体装置 | |
| JP2680351B2 (ja) | 封止用樹脂組成物 | |
| JP2000309678A (ja) | エポキシ樹脂組成物及び半導体装置 | |
| JPS6166713A (ja) | 半導体封止用エポキシ樹脂組成物の製造方法 | |
| JP4742414B2 (ja) | 半導体装置 | |
| JPH08239450A (ja) | エポキシ樹脂組成物、精密部品および半導体装置 | |
| JPS61163920A (ja) | 熱硬化性樹脂組成物およびその製法 | |
| JP2001247749A (ja) | エポキシ樹脂組成物及び半導体装置 | |
| JP2001240724A (ja) | エポキシ樹脂組成物及び半導体装置 | |
| JPH0577689B2 (enrdf_load_stackoverflow) |