JPS6218614B2 - - Google Patents

Info

Publication number
JPS6218614B2
JPS6218614B2 JP54003729A JP372979A JPS6218614B2 JP S6218614 B2 JPS6218614 B2 JP S6218614B2 JP 54003729 A JP54003729 A JP 54003729A JP 372979 A JP372979 A JP 372979A JP S6218614 B2 JPS6218614 B2 JP S6218614B2
Authority
JP
Japan
Prior art keywords
alloy
plating
conductivity
strength
alloys
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54003729A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5596664A (en
Inventor
Shoji Shiga
Norihiko Kamyama
Hisao Orimo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP372979A priority Critical patent/JPS5596664A/ja
Publication of JPS5596664A publication Critical patent/JPS5596664A/ja
Publication of JPS6218614B2 publication Critical patent/JPS6218614B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP372979A 1979-01-16 1979-01-16 Copper alloy for lead frame of semiconductor element Granted JPS5596664A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP372979A JPS5596664A (en) 1979-01-16 1979-01-16 Copper alloy for lead frame of semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP372979A JPS5596664A (en) 1979-01-16 1979-01-16 Copper alloy for lead frame of semiconductor element

Publications (2)

Publication Number Publication Date
JPS5596664A JPS5596664A (en) 1980-07-23
JPS6218614B2 true JPS6218614B2 (enExample) 1987-04-23

Family

ID=11565349

Family Applications (1)

Application Number Title Priority Date Filing Date
JP372979A Granted JPS5596664A (en) 1979-01-16 1979-01-16 Copper alloy for lead frame of semiconductor element

Country Status (1)

Country Link
JP (1) JPS5596664A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5748639U (enExample) * 1980-09-05 1982-03-18
JPS59177949A (ja) * 1983-03-29 1984-10-08 Toshiba Corp 民生用素子
JPS6232631A (ja) * 1985-08-05 1987-02-12 Hitachi Ltd 集積回路パッケージ用リード片の製法
JP2014019907A (ja) * 2012-07-18 2014-02-03 Sh Copper Products Corp 電気・電子部品用銅合金

Also Published As

Publication number Publication date
JPS5596664A (en) 1980-07-23

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