JPS6217604B2 - - Google Patents
Info
- Publication number
- JPS6217604B2 JPS6217604B2 JP56102675A JP10267581A JPS6217604B2 JP S6217604 B2 JPS6217604 B2 JP S6217604B2 JP 56102675 A JP56102675 A JP 56102675A JP 10267581 A JP10267581 A JP 10267581A JP S6217604 B2 JPS6217604 B2 JP S6217604B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- less
- ion content
- phenol
- 10ppm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 25
- 239000000203 mixture Substances 0.000 claims description 23
- 239000004065 semiconductor Substances 0.000 claims description 21
- 239000003822 epoxy resin Substances 0.000 claims description 19
- 229920000647 polyepoxide Polymers 0.000 claims description 19
- 229920003986 novolac Polymers 0.000 claims description 17
- 238000005538 encapsulation Methods 0.000 claims description 12
- FKNQFGJONOIPTF-UHFFFAOYSA-N Sodium cation Chemical compound [Na+] FKNQFGJONOIPTF-UHFFFAOYSA-N 0.000 claims description 7
- 229910001415 sodium ion Inorganic materials 0.000 claims description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 5
- 239000004843 novolac epoxy resin Substances 0.000 claims description 5
- 125000003700 epoxy group Chemical group 0.000 claims description 3
- 239000000843 powder Substances 0.000 description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- -1 chloro ion Chemical class 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000003918 potentiometric titration Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Phenolic Resins Or Amino Resins (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10267581A JPS582322A (ja) | 1981-06-30 | 1981-06-30 | 半導体封止用エポキシ樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10267581A JPS582322A (ja) | 1981-06-30 | 1981-06-30 | 半導体封止用エポキシ樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS582322A JPS582322A (ja) | 1983-01-07 |
| JPS6217604B2 true JPS6217604B2 (zh) | 1987-04-18 |
Family
ID=14333801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10267581A Granted JPS582322A (ja) | 1981-06-30 | 1981-06-30 | 半導体封止用エポキシ樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS582322A (zh) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59210933A (ja) * | 1983-05-17 | 1984-11-29 | Toshiba Chem Corp | 封止用樹脂組成物 |
| JPS59210932A (ja) * | 1983-05-17 | 1984-11-29 | Toshiba Chem Corp | 封止用樹脂組成物 |
| JPS6018519A (ja) * | 1983-07-09 | 1985-01-30 | Matsushita Electric Works Ltd | エポキシ樹脂組成物 |
| JPS6259626A (ja) * | 1985-09-10 | 1987-03-16 | Shin Etsu Chem Co Ltd | エポキシ樹脂組成物 |
| JP2525357B2 (ja) * | 1985-12-25 | 1996-08-21 | 東レ株式会社 | 樹脂封止電子部品 |
| US4842800A (en) * | 1987-10-01 | 1989-06-27 | General Electric Company | Method of encapsulating electronic devices |
| KR100995678B1 (ko) * | 2008-09-01 | 2010-11-22 | 주식회사 코오롱 | 페놀 노볼락 수지, 페놀 노볼락 에폭시 수지 및 에폭시 수지 조성물 |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3838094A (en) * | 1973-04-23 | 1974-09-24 | Nat Semiconductor Corp | Molding composition and molded product |
| JPS5010897A (zh) * | 1973-06-04 | 1975-02-04 | ||
| US3975757A (en) * | 1974-05-31 | 1976-08-17 | National Semiconductor Corporation | Molded electrical device |
| JPS5328960A (en) * | 1976-08-30 | 1978-03-17 | Kubota Ltd | Nitration treatment |
| JPS53134059A (en) * | 1977-04-28 | 1978-11-22 | Hitachi Chem Co Ltd | Molding material of epoxy resin |
| JPS54141569A (en) * | 1978-04-26 | 1979-11-02 | Toshiba Corp | Semiconductor device |
| JPS554952A (en) * | 1978-06-28 | 1980-01-14 | Toshiba Corp | Semiconductor device |
| JPS5516594A (en) * | 1978-07-17 | 1980-02-05 | Siemens Ag | Electroacoustic converter |
| JPS5529532A (en) * | 1978-08-23 | 1980-03-01 | Toshiba Corp | Epoxy resin composition |
| JPS55165655A (en) * | 1979-06-12 | 1980-12-24 | Toshiba Corp | Semiconductor device sealed up with resin |
| JPS567299A (en) * | 1979-06-25 | 1981-01-24 | Fujitsu Ltd | Error correcting circuit |
| JPS5610947A (en) * | 1979-07-10 | 1981-02-03 | Toshiba Corp | Semiconductor sealing resin composition |
| JPS5626926A (en) * | 1979-08-10 | 1981-03-16 | Toshiba Corp | Epoxy resin molding material for sealing electronic part |
| JPS5672046A (en) * | 1979-11-19 | 1981-06-16 | Toshiba Corp | Epoxy resin molding material |
| JPS572329A (en) * | 1980-06-05 | 1982-01-07 | Toshiba Corp | Epoxy resin type composition and semiconductor device of resin sealing type |
-
1981
- 1981-06-30 JP JP10267581A patent/JPS582322A/ja active Granted
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3838094A (en) * | 1973-04-23 | 1974-09-24 | Nat Semiconductor Corp | Molding composition and molded product |
| JPS5010897A (zh) * | 1973-06-04 | 1975-02-04 | ||
| US3975757A (en) * | 1974-05-31 | 1976-08-17 | National Semiconductor Corporation | Molded electrical device |
| JPS5328960A (en) * | 1976-08-30 | 1978-03-17 | Kubota Ltd | Nitration treatment |
| JPS53134059A (en) * | 1977-04-28 | 1978-11-22 | Hitachi Chem Co Ltd | Molding material of epoxy resin |
| JPS54141569A (en) * | 1978-04-26 | 1979-11-02 | Toshiba Corp | Semiconductor device |
| JPS554952A (en) * | 1978-06-28 | 1980-01-14 | Toshiba Corp | Semiconductor device |
| JPS5516594A (en) * | 1978-07-17 | 1980-02-05 | Siemens Ag | Electroacoustic converter |
| JPS5529532A (en) * | 1978-08-23 | 1980-03-01 | Toshiba Corp | Epoxy resin composition |
| JPS55165655A (en) * | 1979-06-12 | 1980-12-24 | Toshiba Corp | Semiconductor device sealed up with resin |
| JPS567299A (en) * | 1979-06-25 | 1981-01-24 | Fujitsu Ltd | Error correcting circuit |
| JPS5610947A (en) * | 1979-07-10 | 1981-02-03 | Toshiba Corp | Semiconductor sealing resin composition |
| JPS5626926A (en) * | 1979-08-10 | 1981-03-16 | Toshiba Corp | Epoxy resin molding material for sealing electronic part |
| JPS5672046A (en) * | 1979-11-19 | 1981-06-16 | Toshiba Corp | Epoxy resin molding material |
| JPS572329A (en) * | 1980-06-05 | 1982-01-07 | Toshiba Corp | Epoxy resin type composition and semiconductor device of resin sealing type |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS582322A (ja) | 1983-01-07 |
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