JPS6216542B2 - - Google Patents

Info

Publication number
JPS6216542B2
JPS6216542B2 JP54122582A JP12258279A JPS6216542B2 JP S6216542 B2 JPS6216542 B2 JP S6216542B2 JP 54122582 A JP54122582 A JP 54122582A JP 12258279 A JP12258279 A JP 12258279A JP S6216542 B2 JPS6216542 B2 JP S6216542B2
Authority
JP
Japan
Prior art keywords
circuit board
molding
mold
flexible printed
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54122582A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5646540A (en
Inventor
Kenichi Yoshikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP12258279A priority Critical patent/JPS5646540A/ja
Priority to GB8001694A priority patent/GB2042774B/en
Priority to CH40980A priority patent/CH641626B/de
Publication of JPS5646540A publication Critical patent/JPS5646540A/ja
Publication of JPS6216542B2 publication Critical patent/JPS6216542B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/02—Component assemblies
    • G04G17/04—Mounting of electronic components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Clocks (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP12258279A 1979-01-18 1979-09-26 Manufacture of circuit board for watch Granted JPS5646540A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP12258279A JPS5646540A (en) 1979-09-26 1979-09-26 Manufacture of circuit board for watch
GB8001694A GB2042774B (en) 1979-01-18 1980-01-18 Fabricating method of electronic watch module
CH40980A CH641626B (de) 1979-01-18 1980-01-18 Verfahren zur herstellung von elektronischen uhrmodulen.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12258279A JPS5646540A (en) 1979-09-26 1979-09-26 Manufacture of circuit board for watch

Publications (2)

Publication Number Publication Date
JPS5646540A JPS5646540A (en) 1981-04-27
JPS6216542B2 true JPS6216542B2 (enrdf_load_stackoverflow) 1987-04-13

Family

ID=14839473

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12258279A Granted JPS5646540A (en) 1979-01-18 1979-09-26 Manufacture of circuit board for watch

Country Status (1)

Country Link
JP (1) JPS5646540A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102673883B1 (ko) * 2023-05-24 2024-06-10 강병모 반려동물 보안출입장치가 구비된 펫하우스

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2806476A1 (en) * 2013-05-22 2014-11-26 The Swatch Group Research and Development Ltd. Electrochemical cell

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102673883B1 (ko) * 2023-05-24 2024-06-10 강병모 반려동물 보안출입장치가 구비된 펫하우스

Also Published As

Publication number Publication date
JPS5646540A (en) 1981-04-27

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